Resistance random access memory devices and method of fabrication
    41.
    发明申请
    Resistance random access memory devices and method of fabrication 有权
    电阻随机存取存储器件及其制造方法

    公开(公告)号:US20070238246A1

    公开(公告)日:2007-10-11

    申请号:US11403020

    申请日:2006-04-11

    IPC分类号: H01L21/336

    摘要: A method of fabricating a RRAM includes preparing a substrate and forming a bottom electrode ori the substrate. A PCMO layer is deposited on the bottom electrode using MOCVD or liquid MOCVD, followed by a post-annealing process. The deposited PCMO thin film has a crystallized PCMO structure or a nano-size and amorphous PCMO structure. A top electrode is formed on the PCMO layer.

    摘要翻译: 制造RRAM的方法包括制备衬底并形成底部电极或衬底。 使用MOCVD或液体MOCVD将PCMO层沉积在底部电极上,随后进行后退火处理。 沉积的PCMO薄膜具有结晶的PCMO结构或纳米尺寸和无定形PCMO结构。 顶部电极形成在PCMO层上。

    Method of monitoring PCMO precursor synthesis
    42.
    发明申请
    Method of monitoring PCMO precursor synthesis 有权
    监测PCMO前体合成的方法

    公开(公告)号:US20070238203A1

    公开(公告)日:2007-10-11

    申请号:US11403022

    申请日:2006-04-11

    IPC分类号: H01L21/66

    摘要: A method of monitoring synthesis of PCMO precursor solutions includes preparing a PCMO precursor solution and withdrawing samples of the precursor solution at intervals during a reaction phase of the PCMO precursor solution synthesis. The samples of the PCMO precursor solution are analyzed by UV spectroscopy to determine UV transmissivity of the samples of the PCMO precursor solution and the samples used to form PCMO thin films. Electrical characteristics of the PCMO thin films formed from the samples are determined to identify PCMO thin films having optimal electrical characteristics. The UV spectral characteristics of the PCMO precursor solutions are correlated with the PCMO thin films having optimal electrical characteristics. The UV spectral characteristics are used to monitor synthesis of future batches of the PCMO precursor solutions, which will result in PCMO thin films having optimal electrical characteristics.

    摘要翻译: 监测PCMO前体溶液合成的方法包括制备PCMO前体溶液,并在PCMO前体溶液合成反应期间间隔取出前体溶液样品。 通过紫外光谱分析PCMO前体溶液的样品,以确定PCMO前体溶液和用于形成PCMO薄膜的样品的UV透射率。 确定由样品形成的PCMO薄膜的电特性以鉴定具有最佳电特性的PCMO薄膜。 PCMO前体溶液的UV光谱特性与具有最佳电学特性的PCMO薄膜相关。 UV光谱特性用于监测未来批次的PCMO前体溶液的合成,这将导致具有最佳电特性的PCMO薄膜。

    Crosspoint resistor memory device with back-to-back Schottky diodes
    43.
    发明申请
    Crosspoint resistor memory device with back-to-back Schottky diodes 审中-公开
    具有背对背肖特基二极管的交叉点电阻存储器件

    公开(公告)号:US20070015348A1

    公开(公告)日:2007-01-18

    申请号:US11295778

    申请日:2005-12-07

    申请人: Sheng Hsu Tingkai Li

    发明人: Sheng Hsu Tingkai Li

    IPC分类号: H01L21/28 H01L21/44

    摘要: A metal/semiconductor/metal (MSM) back-to-back Schottky diode, a resistance memory device using the MSM diode, and associated fabrication processes are provided. The method includes: providing a substrate; forming a metal bottom electrode overlying the substrate, having a first work function; forming a semiconductor layer overlying the metal bottom electrode, having a second work function, less than the first work function; and, forming a metal top electrode overlying the semiconductor layer, having a third work function, greater than the second work function. The metal top and bottom electrodes can be materials such as Pt, Au, Ag, TiN, Ta, Ru, or TaN. In one aspect, the metal top electrode and metal bottom electrode are made from the same material and, therefore, have identical work functions. The semiconductor layer can be a material such as amorphous silicon (a:Si), polycrystalline Si, InOx, or ZnO.

    摘要翻译: 提供金属/半导体/金属(MSM)背对背肖特基二极管,使用MSM二极管的电阻存储器件以及相关的制造工艺。 该方法包括:提供衬底; 形成覆盖所述基板的金属底电极,具有第一功函数; 形成覆盖所述金属底电极的半导体层,具有小于所述第一功函数的第二功函数; 以及形成覆盖所述半导体层的金属顶电极,具有大于所述第二功函数的第三功函数。 金属顶部和底部电极可以是诸如Pt,Au,Ag,TiN,Ta,Ru或TaN的材料。 在一个方面,金属顶电极和金属底电极由相同的材料制成,因此具有相同的功能。 半导体层可以是诸如非晶硅(a:Si),多晶Si,InO x或ZnO的材料。

    Memory cell with buffered layer
    44.
    发明申请
    Memory cell with buffered layer 有权
    带缓冲层的存储单元

    公开(公告)号:US20060099724A1

    公开(公告)日:2006-05-11

    申请号:US11314222

    申请日:2005-12-21

    IPC分类号: H01L21/00 H01L21/20

    摘要: A method is provided for forming a buffered-layer memory cell. The method comprises: forming a bottom electrode; forming a colossal magnetoresistance (CMR) memory film overlying the bottom electrode; forming a memory-stable semiconductor buffer layer, typically a metal oxide, overlying the memory film; and, forming a top electrode overlying the semiconductor buffer layer. In some aspects of the method the semiconductor buffer layer is formed from YBa2Cu3O7-X (YBCO), indium oxide (In2O3), or ruthenium oxide (RuO2), having a thickness in the range of 10 to 200 nanometers (nm). The top and bottom electrodes may be TiN/Ti, Pt/TiN/Ti, In/TiN/Ti, PtRhOx compounds, or PtIrOx compounds. The CMR memory film may be a Pr1-XCaXMnO3 (PCMO) memory film, where x is in the region between 0.1 and 0.6, with a thickness in the range of 10 to 200 nm.

    摘要翻译: 提供了一种用于形成缓冲层存储单元的方法。 该方法包括:形成底部电极; 形成覆盖底部电极的巨大磁阻(CMR)记忆膜; 形成存储器稳定的半导体缓冲层,通常为覆盖存储膜的金属氧化物; 并且形成覆盖半导体缓冲层的顶部电极。 在该方法的一些方面,半导体缓冲层由YBa 2 N 3 O 7-X(YBCO),氧化铟(In 2或2 O 3)或氧化钌(RuO 2 N 2),其厚度在10-200纳米(nm)的范围内。 顶部和底部电极可以是TiN / Ti,Pt / TiN / Ti,In / TiN / Ti,PtRhOx化合物或PtIrOx化合物。 CMR存储器膜可以是Pr 1-X C x MnO 3(PCMO)存储膜,其中x在0.1之间的区域 和0.6,厚度在10至200nm的范围内。

    Method for operating an MFIS ferroelectric memory array
    45.
    发明申请
    Method for operating an MFIS ferroelectric memory array 有权
    用于操作MFIS铁电存储器阵列的方法

    公开(公告)号:US20060068508A1

    公开(公告)日:2006-03-30

    申请号:US11262117

    申请日:2005-10-28

    IPC分类号: H01L21/00

    摘要: An MFIS memory array having a plurality of MFIS memory transistors with a word line connecting a plurality of MFIS memory transistor gates, wherein all MFIS memory transistors connected to a common word line have a common source, each transistor drain serves as a bit output, and all MFIS channels along a word line are separated by a P+ region and are further joined to a P+ substrate region on an SOI substrate by a P+ region is provided. Also provided are methods of making an MFIS memory array on an SOI substrate; methods of performing a block erase of one or more word lines, and methods of selectively programming a bit.

    摘要翻译: 一种MFIS存储器阵列,具有多个具有连接多个MFIS存储晶体管栅极的字线的MFIS存储晶体管,其中连接到公共字线的所有MFIS存储晶体管具有公共源,每个晶体管漏极用作位输出,以及 沿着字线的所有MFIS通道被P +区隔开,并且通过P +区进一步连接到SOI衬底上的P +衬底区域。 还提供了在SOI衬底上制造MFIS存储器阵列的方法; 执行一个或多个字线的块擦除的方法以及有选择地编程位的方法。

    System and method for forming a bipolar switching PCMO film
    46.
    发明申请
    System and method for forming a bipolar switching PCMO film 有权
    用于形成双极开关PCMO膜的系统和方法

    公开(公告)号:US20050275064A1

    公开(公告)日:2005-12-15

    申请号:US10855942

    申请日:2004-05-27

    摘要: A multi-layer PrxCa1-xMnO3 (PCMO) thin film capacitor and associated deposition method are provided for forming a bipolar switching thin film. The method comprises: forming a bottom electrode; depositing a nanocrystalline PCMO layer; depositing a polycrystalline PCMO layer; forming a multi-layer PCMO film with bipolar switching properties; and, forming top electrode overlying the PCMO film. If the polycrystalline layers are deposited overlying the nanocrystalline layers, a high resistance can be written with narrow pulse width, negative voltage pulses. The PCMO film can be reset to a low resistance using a narrow pulse width, positive amplitude pulse. Likewise, if the nanocrystalline layers are deposited overlying the polycrystalline layers, a high resistance can be written with narrow pulse width, positive voltage pulses, and reset to a low resistance using a narrow pulse width, negative amplitude pulse.

    摘要翻译: 提供了多层Pr 1 x 1 x x MnO 3(PCMO)薄膜电容器和相关的沉积方法,用于形成双极开关 薄膜。 该方法包括:形成底部电极; 沉积纳米晶体PCMO层; 沉积多晶PCMO层; 形成具有双极开关特性的多层PCMO膜; 并且形成覆盖PCMO膜的顶部电极。 如果多晶层沉积在纳米晶层之上,则可以用窄脉冲宽度,负电压脉冲写入高电阻。 PCMO膜可以使用窄脉冲宽度,正幅度脉冲复位为低电阻。 同样,如果纳米晶层沉积在多晶层上,则可以用窄脉冲宽度,正电压脉冲写入高电阻,并使用窄脉冲宽度,负幅度脉冲将其复位为低电阻。

    Ferroelectric transistor gate stack with resistance-modified conductive oxide
    47.
    发明申请
    Ferroelectric transistor gate stack with resistance-modified conductive oxide 有权
    具有电阻改性导电氧化物的铁电晶体管栅极叠层

    公开(公告)号:US20050269613A1

    公开(公告)日:2005-12-08

    申请号:US11184659

    申请日:2005-07-18

    申请人: Tingkai Li Sheng Hsu

    发明人: Tingkai Li Sheng Hsu

    CPC分类号: H01L21/28291 H01L29/78391

    摘要: The present invention discloses a novel ferroelectric transistor design using a resistive oxide film in place of the gate dielectric. By replacing the gate dielectric with a resistive oxide film, and by optimizing the value of the film resistance, the bottom gate of the ferroelectric layer is electrically connected to the silicon substrate, eliminating the trapped charge effect and resulting in the improvement of the memory retention characteristics. The resistive oxide film is preferably a doped conductive oxide in which a conductive oxide is doped with an impurity species. The doped conductive oxide is most preferred to be In2O3 with the dopant species being hafnium oxide, zirconium oxide, lanthanum oxide, or aluminum oxide.

    摘要翻译: 本发明公开了一种使用电阻氧化膜代替栅极电介质的新型铁电晶体管设计。 通过用电阻氧化膜代替栅极电介质,并且通过优化膜电阻的值,铁电层的底栅电连接到硅衬底,消除了捕获的电荷效应并导致存储保持率的提高 特点 电阻氧化膜优选为其中掺杂有杂质物质的导电氧化物的掺杂导电氧化物。 掺杂的导电氧化物最优选为掺杂物质为氧化铪,氧化锆,氧化镧或氧化铝的In 2 N 3 O 3。

    PCMO thin film with memory resistance properties
    48.
    发明申请
    PCMO thin film with memory resistance properties 有权
    具有记忆电阻特性的PCMO薄膜

    公开(公告)号:US20050239262A1

    公开(公告)日:2005-10-27

    申请号:US10831677

    申请日:2004-04-23

    摘要: A method is provided for forming a Pr0.3Ca0.7MnO3 (PCMO) thin film with crystalline structure-related memory resistance properties. The method comprises: forming a PCMO thin film with a first crystalline structure; and, changing the resistance state of the PCMO film using pulse polarities responsive to the first crystalline structure. In one aspect the first crystalline structure is either amorphous or a weak-crystalline. Then, the resistance state of the PCMO film is changed in response to unipolar pulses. In another aspect, the PCMO thin film has either a polycrystalline structure. Then, the resistance state of the PCMO film changes in response to bipolar pulses.

    摘要翻译: 提供了一种用于形成具有结晶结构相关的记忆电阻性质的Pr 0.3M 3 Ca 0.7 MnO 3(PCMO)薄膜的方法。 该方法包括:形成具有第一晶体结构的PCMO薄膜; 并且使用响应于第一晶体结构的脉冲极性来改变PCMO膜的电阻状态。 在一个方面,第一晶体结构是无定形或弱结晶。 然后,响应于单极脉冲改变PCMO膜的电阻状态。 另一方面,PCMO薄膜具有多晶结构。 然后,PCMO膜的电阻状态响应于双极性脉冲而改变。

    Ultra-shallow metal oxide surface channel MOS transistor
    50.
    发明申请
    Ultra-shallow metal oxide surface channel MOS transistor 失效
    超浅金属氧化物表面沟道MOS晶体管

    公开(公告)号:US20050156254A1

    公开(公告)日:2005-07-21

    申请号:US10761704

    申请日:2004-01-21

    摘要: An ultra-shallow surface channel MOS transistor and method for fabricating the same have been provided. The method comprises: forming CMOS source and drain regions, and an intervening well region; depositing a surface channel on the surface overlying the well region; forming a high-k dielectric overlying the surface channel; and, forming a gate electrode overlying the high-k dielectric. Typically, the surface channel is a metal oxide, and may be one of the following materials: indium oxide (In2O3), ZnO, RuO, ITO, or LaX-1SrXCoO3. In some aspects, the method further comprises: depositing a placeholder material overlying the surface channel; and, etching the placeholder material to form a gate region overlying the surface channel. In one aspect, the high-k dielectric is deposited prior to the deposition of the placeholder material. Alternately, the high-k dielectric is deposited following the etching of the placeholder material.

    摘要翻译: 提供了一种超浅表面沟道MOS晶体管及其制造方法。 该方法包括:形成CMOS源极和漏极区域以及中间阱区域; 在覆盖所述阱区域的表面上沉积表面通道; 形成覆盖表面通道的高k电介质; 并形成覆盖高k电介质的栅电极。 通常,表面通道是金属氧化物,并且可以是以下材料之一:氧化铟(In 2 O 3),ZnO,RuO,ITO或LaX-1SrXCoO 3。 在一些方面,所述方法还包括:沉积覆盖所述表面通道的占位符材料; 并且蚀刻占位符材料以形成覆盖表面通道的栅极区域。 在一个方面,高k电介质沉积在占位符材料的沉积之前。 或者,在占位符材料的蚀刻之后沉积高k电介质。