摘要:
An input device includes a plurality of manipulation portions; an input function portion manipulated by the manipulation portions to perform an input function; a light guiding sheet facing the rear side of the plurality of manipulation portions; and a light source applying light into the light guiding sheet, wherein a rear surface opposite to a front surface of the light guiding sheet facing the manipulation portions is provided with a plurality of concave portions which is depressed to the inside of the light guiding sheet, wherein each concave portion has a circular opening and an inner surface which is a smooth concave curve surface, and wherein light propagated through the inside of the light guiding sheet is reflected by the inner surface toward the inside of the light guiding sheet, and the light is applied from the front surface of the light guiding sheet to the manipulation portions.
摘要:
When a bulk silicon substrate and an SOI substrate are used separately, a board area is increased and so it is impossible to reduce the size of a semiconductor device as a whole. On the other hand, when an SOI-type MISFET and a bulk-type MISFET are formed on a same substrate, the SOI-type MISFET and the bulk-type MISFET should be formed in separate steps respectively, and thus the process gets complicated. A single crystal semiconductor substrate and an SOI substrate separated from the single crystal semiconductor substrate by a thin buried insulating film and having a thin single crystal semiconductor thin film (SOI layer) are used, and well diffusion layer regions, drain regions, gate insulating films and gate electrodes of the SOI-type MISFET and the bulk-type MISFET are formed in same steps. Since the bulk-type MISFET and the SOI-type MISFET can be formed on the same substrate, the board area can be reduced. A simple process can be realized by making manufacturing steps of the SOI-type MISFET and the bulk-type MISFET common.
摘要:
A MIS transistor having an inclined stacked source/drain structure increased in speed is provided. The MIS transistor comprises: a gate electrode formed on a substrate; a first sidewall insulating film formed on the substrate and along a sidewall of the gate electrode; source/drain semiconductor regions formed on a main surface of the substrate and respectively having one edge positioned under the sidewall of the gate electrode; a first stacked layer formed on the source/drain semiconductor regions and in contact with the first sidewall insulating film; a second sidewall insulating film formed on the stacked layer and in contact with the first sidewall insulating film; and a second stacked layer formed on the first stacked layer and in contact with the second sidewall insulating layer.
摘要:
In a field effect semiconductor device for high frequency power amplification, it is difficult to achieve size reduction and increased efficiency simultaneously while ensuring voltage withstanding. A further improvement in efficiency is attained by using a strained Si channel for LDMOS at an output stage for high frequency power amplification. Further, the efficiency is improved as much as possible while decreasing a leak current, by optimizing the film thickness of the strained Si layer having a channel region, inactivation of defects and a field plate structure.
摘要:
By using a solid solution of tantalum pentoxide and niobium pentoxide as a dielectric film installed between upper electrode and lower electrode in a capacitor which is used in a semiconductor device, the capacitor structure can be simplified to improve reliability of the semiconductor device while reducing the production cost thereof.
摘要:
A reduction of the junction electric field intensity is accomplished in the semiconductor regions for the sources and drains of field effects transistors. For this purpose, a structure is provided where the gate electrodes 9 of the MIS.FETQs for memory cell selection of a DRAM are buried within the trenches 7a and 7b created in the semiconductor substrate 1. The bottom corners within the trench 7b are rounded so as to have a radius of curvature in accordance with the sub-threshold coefficient of the MIS.FETQs for memory cell selection. In addition, the gate insulating film 8 within the trench 7b is made to have a laminated structure of a thermal oxide film and a CVD film.
摘要:
By using a solid solution of tantalum pentoxide and niobium pentoxide as a dielectric film installed between upper electrode and lower electrode in a capacitor which is used in a semiconductor device, the capacitor structure can be simplified to improve reliability of the semiconductor device while reducing the production cost thereof.
摘要:
In a method of manufacturing a semiconductor device having a memory mat portion in which an active region and a field region are formed densely, after a polishing stopper film is deposited on a semiconductor substrate, there are formed grooves by etching a polishing stopper film of a field region and the semiconductor substrate. Then, after an insulating film is deposited so as to fill the grooves, then insulating film is partly removed from the memory mat portion by etching. Under this state, the insulating film is chemically mechanically polished until the polishing stopper film is exposed. The film thickness of the polishing stopper film on the active region can be reduced, and an electrical element isolation characteristic of the field region can be improved. At the same time, upon chemical mechanical polishing, a silicon substrate can be prevented from being exposed at the central portion of the memory mat portion and the insulating film can be prevented from being left on the silicon nitride film near the outer periphery, thereby making it possible to form elements having uniform electrical characteristics on all active regions of the memory mat portion.
摘要:
A semiconductor memory device having STC cells wherein the major portions of active regions consisting of channel-forming portions are inclined at an angle of 45 degrees with respect to word lines and bit lines that meet at right angles with each other, thereby enabling the storage capacity portions to be arranged very densely and a sufficiently large capacity to be maintained with very small cell areas. Since the storage capacity portions are formed even on the bit lines, the bit lines are shielded, so that the capacity decreases between the bit lines and, hence, the memory array noise decreases. It is also possible to design the charge storage capacity portion so that a part of thereof has a form of a wall substantially vertical to the substrate in order to increase the capacity.
摘要:
A semiconductor memory device having STC cells wherein the major portions of active regions consisting of channel-forming portions are inclined at an angle of 45 degrees with respect to word lines and bit lines that meet at right angles with each other, thereby enabling the storage capacity portions to be arranged very densely and a sufficiently large capacity to be maintained with very small cell areas. Since the storage capacity portions are formed even on the bit lines, the bit lines are shielded, so that the capacity decreases between the bit lines and, hence, the memory array noise decreases. It is also possible to design the charge storage capacity portion so that a part of thereof has a form of a wall substantially vertical to the substrate in order to increase the capacity.