SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    42.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20100084709A1

    公开(公告)日:2010-04-08

    申请号:US11993862

    申请日:2006-06-30

    摘要: When a bulk silicon substrate and an SOI substrate are used separately, a board area is increased and so it is impossible to reduce the size of a semiconductor device as a whole. On the other hand, when an SOI-type MISFET and a bulk-type MISFET are formed on a same substrate, the SOI-type MISFET and the bulk-type MISFET should be formed in separate steps respectively, and thus the process gets complicated. A single crystal semiconductor substrate and an SOI substrate separated from the single crystal semiconductor substrate by a thin buried insulating film and having a thin single crystal semiconductor thin film (SOI layer) are used, and well diffusion layer regions, drain regions, gate insulating films and gate electrodes of the SOI-type MISFET and the bulk-type MISFET are formed in same steps. Since the bulk-type MISFET and the SOI-type MISFET can be formed on the same substrate, the board area can be reduced. A simple process can be realized by making manufacturing steps of the SOI-type MISFET and the bulk-type MISFET common.

    摘要翻译: 当单独使用体硅衬底和SOI衬底时,板面积增加,因此整体上不可能减小半导体器件的尺寸。 另一方面,当在同一衬底上形成SOI型MISFET和体型MISFET时,分别将SOI型MISFET和体型MISFET分别形成,因此工艺变得复杂。 使用通过薄埋入绝缘膜与单晶半导体衬底分离并具有薄单晶半导体薄膜(SOI层)的单晶半导体衬底和SOI衬底,以及良好扩散层区域,漏极区域,栅极绝缘膜 并且以相同的步骤形成SOI型MISFET和体型MISFET的栅电极。 由于可以在同一基板上形成体型MISFET和SOI型MISFET,所以可以减小电路板面积。 可以通过制造SOI型MISFET和体型MISFET的制造步骤来实现简单的工艺。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    43.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20080258218A1

    公开(公告)日:2008-10-23

    申请号:US12105226

    申请日:2008-04-17

    IPC分类号: H01L27/01

    摘要: A MIS transistor having an inclined stacked source/drain structure increased in speed is provided. The MIS transistor comprises: a gate electrode formed on a substrate; a first sidewall insulating film formed on the substrate and along a sidewall of the gate electrode; source/drain semiconductor regions formed on a main surface of the substrate and respectively having one edge positioned under the sidewall of the gate electrode; a first stacked layer formed on the source/drain semiconductor regions and in contact with the first sidewall insulating film; a second sidewall insulating film formed on the stacked layer and in contact with the first sidewall insulating film; and a second stacked layer formed on the first stacked layer and in contact with the second sidewall insulating layer.

    摘要翻译: 提供了具有倾斜堆叠的源极/漏极结构的MIS晶体管,其速度提高。 MIS晶体管包括:形成在衬底上的栅电极; 形成在所述基板上并沿着所述栅电极的侧壁的第一侧壁绝缘膜; 源极/漏极半导体区域,形成在基板的主表面上,并且分别具有位于栅电极的侧壁下方的一个边缘; 形成在所述源极/漏极半导体区域上并与所述第一侧壁绝缘膜接触的第一堆叠层; 形成在所述层叠层上并与所述第一侧壁绝缘膜接触的第二侧壁绝缘膜; 以及形成在第一堆叠层上并与第二侧壁绝缘层接触的第二堆叠层。

    Semiconductor integrated circuit device and process for manufacturing the same
    46.
    发明授权
    Semiconductor integrated circuit device and process for manufacturing the same 有权
    半导体集成电路器件及其制造方法

    公开(公告)号:US06770535B2

    公开(公告)日:2004-08-03

    申请号:US09767830

    申请日:2001-01-24

    IPC分类号: H01L21336

    摘要: A reduction of the junction electric field intensity is accomplished in the semiconductor regions for the sources and drains of field effects transistors. For this purpose, a structure is provided where the gate electrodes 9 of the MIS.FETQs for memory cell selection of a DRAM are buried within the trenches 7a and 7b created in the semiconductor substrate 1. The bottom corners within the trench 7b are rounded so as to have a radius of curvature in accordance with the sub-threshold coefficient of the MIS.FETQs for memory cell selection. In addition, the gate insulating film 8 within the trench 7b is made to have a laminated structure of a thermal oxide film and a CVD film.

    摘要翻译: 在场效应晶体管的源极和漏极的半导体区域中实现结电场强度的降低。 为此,提供了一种结构,其中用于DRAM的存储单元选择的MIS.FETQ的栅电极9被埋在在半导体衬底1中形成的沟槽7a和7b内。沟槽7b内的底角被倒圆 具有根据用于存储器单元选择的MIS.FETQ的子阈值系数的曲率半径。 此外,使沟槽7b内的栅极绝缘膜8具有热氧化膜和CVD膜的层叠结构。

    Semiconductor memory device
    49.
    发明授权
    Semiconductor memory device 失效
    半导体存储器件

    公开(公告)号:US5591998A

    公开(公告)日:1997-01-07

    申请号:US443106

    申请日:1995-05-17

    摘要: A semiconductor memory device having STC cells wherein the major portions of active regions consisting of channel-forming portions are inclined at an angle of 45 degrees with respect to word lines and bit lines that meet at right angles with each other, thereby enabling the storage capacity portions to be arranged very densely and a sufficiently large capacity to be maintained with very small cell areas. Since the storage capacity portions are formed even on the bit lines, the bit lines are shielded, so that the capacity decreases between the bit lines and, hence, the memory array noise decreases. It is also possible to design the charge storage capacity portion so that a part of thereof has a form of a wall substantially vertical to the substrate in order to increase the capacity.

    摘要翻译: 具有STC单元的半导体存储器件,其中由沟道形成部分组成的有源区的主要部分相对于彼此成直角相交的字线和位线以45度的角度倾斜,从而使得存储容量 部分布置非常密集,并且具有足够大的容量以保持非常小的单元格区域。 由于存储容量部分甚至在位线上形成,所以位线被屏蔽,使得位线之间的容量减小,因此存储器阵列噪声减小。 也可以设计电荷存储容量部分,使得其一部分具有基本上垂直于衬底的壁的形式,以增加容量。

    Semiconductor memory device having stacked capacitors
    50.
    发明授权
    Semiconductor memory device having stacked capacitors 失效
    具有层叠电容器的半导体存储器件

    公开(公告)号:US5583358A

    公开(公告)日:1996-12-10

    申请号:US324352

    申请日:1994-10-17

    摘要: A semiconductor memory device having STC cells wherein the major portions of active regions consisting of channel-forming portions are inclined at an angle of 45 degrees with respect to word lines and bit lines that meet at right angles with each other, thereby enabling the storage capacity portions to be arranged very densely and a sufficiently large capacity to be maintained with very small cell areas. Since the storage capacity portions are formed even on the bit lines, the bit lines are shielded, so that the capacity decreases between the bit lines and, hence, the memory array noise decreases. It is also possible to design the charge storage capacity portion so that a part of thereof has a form of a wall substantially vertical to the substrate in order to increase the capacity.

    摘要翻译: 具有STC单元的半导体存储器件,其中由沟道形成部分组成的有源区的主要部分相对于彼此成直角相交的字线和位线以45度的角度倾斜,从而使得存储容量 部分布置非常密集,并且具有足够大的容量以保持非常小的单元格区域。 由于存储容量部分甚至在位线上形成,所以位线被屏蔽,使得位线之间的容量减小,因此存储器阵列噪声减小。 也可以设计电荷存储容量部分,使得其一部分具有基本上垂直于衬底的壁的形式,以增加容量。