利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

48 条记录 (耗时 0.033 秒)

    Apparatus and Method for the Singulation of a Semiconductor Wafer
    42.
    发明申请
    Apparatus and Method for the Singulation of a Semiconductor Wafer 审中-公开
    用于单晶半导体晶片的装置和方法

    公开(公告)号：US20130273717A1

    公开(公告)日：2013-10-17

    申请号：US13448648

    申请日：2012-04-17

    申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

    发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

    IPC分类号： H01L21/78 ,  B24B7/10 ,  B23K26/38 ,  B26D7/01

    CPC分类号： B28D5/00 ,  B23K26/02 ,  B23K26/083 ,  B28D5/029 ,  H01L21/67092 ,  Y10T83/748

    摘要： The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

    摘要翻译： 本公开涉及一种用于单个半导体衬底或晶片的装置。 在一些实施例中，分割装置包括多个切割装置。 切割装置被配置为在半导体晶片的表面上并行地形成多个并行切割线。 在一些实施例中，分割装置包括至少两个切割锯或激光模块。 所公开的分割装置可以通过在晶片的整个圆周边缘上的切割方式将半导体晶片切割成单独的芯片，从而减少处理时间并增加产量。

    System and method for dry chamber temperature control
    43.
    发明申请
    System and method for dry chamber temperature control 审中-公开
    干室温度控制系统和方法

    公开(公告)号：US20050016467A1

    公开(公告)日：2005-01-27

    申请号：US10626998

    申请日：2003-07-24

    申请人： Yi-Li Hsiao ,  Mei-Sheng Zhou ,  Chin-Hsin Peng ,  Chien-Ling Huang ,  Tse-Yi Chen ,  Chun-Yi Lee ,  Hsueh-Chang Wu

    发明人： Yi-Li Hsiao ,  Mei-Sheng Zhou ,  Chin-Hsin Peng ,  Chien-Ling Huang ,  Tse-Yi Chen ,  Chun-Yi Lee ,  Hsueh-Chang Wu

    IPC分类号： C23C16/00 ,  H01L21/00

    CPC分类号： H01L21/67248 ,  H01J2237/2001 ,  H01L21/67109

    摘要： A system and method which is capable of compensating for unintended elevations in process temperatures induced in a substrate during a semiconductor fabrication process in order to reduce or eliminate disparities in critical dimensions of device features. The system may be a plasma etching system comprising a process chamber containing an electrostatic chuck (ESC) for supporting a wafer substrate. A chiller outside the process chamber includes a main coolant chamber, which contains a main coolant fluid, as well as an compensation coolant chamber, which contains an compensation coolant fluid. A main circulation loop normally circulates the main coolant fluid from the main coolant chamber through the electrostatic chuck to maintain the chuck at a desired set point temperature.

    摘要翻译： 一种系统和方法，其能够在半导体制造过程期间补偿在衬底中感应的工艺温度中的意外高度，以便减少或消除器件特征的关键尺寸的不均匀性。 该系统可以是包括含有用于支撑晶片衬底的静电吸盘（ESC）的处理室的等离子体蚀刻系统。 处理室外部的冷却器包括主冷却剂室，其包含主冷却剂流体，以及补偿冷却剂室，其包含补偿冷却剂流体。 主循环回路通常使主冷却剂流体从主冷却剂室通过静电吸盘循环，以将卡盘保持在所需的设定点温度。

    Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system
    44.
    发明授权
    Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system 有权
    用于检测晶片传送系统中半导体晶片的正确取向的方法和装置

    公开(公告)号：US06546307B1

    公开(公告)日：2003-04-08

    申请号：US09378288

    申请日：1999-08-20

    申请人： Yi-Li Hsiao

    发明人： Yi-Li Hsiao

    IPC分类号： G06F1900

    CPC分类号： G06F19/00

    摘要： The orientation of a wafer carried on a blade of a semiconductor wafer transfer system is sensed in order to prevent wafer damage during transfer of the wafer from chamber-to-chamber within a semiconductor processing system. A pair of laser beams are used to sense both tilt of the wafer on the blade, and mis-alignment of the blade in the chamber. A control and logic circuit lock out movement of the blade when the laser beams indicate tilt of the wafer or mis-alignment of the blade.

    摘要翻译： 感测承载在半导体晶片传送系统的刀片上的晶片的取向，以便在半导体处理系统内的晶片从腔室转移到晶片期间防止晶片损坏。 一对激光束用于检测刀片上的晶片的倾斜以及刀片在腔室中的错位。 当激光束指示晶片的倾斜或叶片的不对准时，控制和逻辑电路锁定叶片的运动。

    Apparatus for clamping and transporting a semiconductor wafer
    45.
    发明授权
    Apparatus for clamping and transporting a semiconductor wafer 有权
    用于夹持和输送半导体晶片的装置

    公开(公告)号：US06543988B2

    公开(公告)日：2003-04-08

    申请号：US09908528

    申请日：2001-07-18

    申请人： Yi-Li Hsiao ,  Cheng-Chieh Hung ,  Yu-Tsung Fu ,  Weng-Liang Fang

    发明人： Yi-Li Hsiao ,  Cheng-Chieh Hung ,  Yu-Tsung Fu ,  Weng-Liang Fang

    IPC分类号： B25J915

    CPC分类号： H01L21/67259 ,  B25B5/147 ,  B25J9/107 ,  B25J15/10 ,  H01L21/68707

    摘要： A wafer is carried on a blade supported on robotic arms. A plurality of guide clamps both move the wafer into a desired position on the blade and clamp the wafer in place during transport by the arms. The clamps are reciprocally mounted on the blade and are connected with and driven by a rotatable hub carried on the blade and rotated by the movement of the arms. Both the blade and the clamps include beveled surfaces that guide the wafer into place. The operation of the clamps is controlled by a laser that detects when the wafer is out of place or tilted on the blade.

    摘要翻译： 晶片承载在机器人手臂上的刀片上。 多个引导夹具将晶片移动到刀片上的期望位置，并且在通过臂传送期间将晶片夹紧就位。 夹具相互安装在叶片上并与托架在叶片上的可旋转轮毂连接并由其驱动，并通过臂的运动而旋转。 刀片和夹具都包括将晶片引导到位的斜面。 夹具的操作由激光器控制，该激光器检测晶片何时不在位置或在叶片上倾斜。