Temperature control system for semiconductor manufacturing system
    49.
    发明授权
    Temperature control system for semiconductor manufacturing system 有权
    半导体制造系统温度控制系统

    公开(公告)号:US09520308B2

    公开(公告)日:2016-12-13

    申请号:US14263498

    申请日:2014-04-28

    Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

    Abstract translation: 提供了一种温度控制系统,其被配置为混合低温加热介质和高温加热介质,以将加热介质在根据工艺配方的温度下提供给静电卡盘(ESC),静电卡盘(ESC)被配置为保持温度并支撑晶片 其中执行半导体晶片处理工艺的室和通过将通过热电元件冷却的加热介质和通过加热器加热的加热介质按照第一比率和第二比率混合到期望目标温度而获得的加热介质是 提供给负载并从负载中回收,并且加热介质根据混合比例的第一比率和第二比率分配到热电元件和加热器,从而优化用于冷却或加热的功率消耗。

    Thermoelectric-enhanced, inlet air-cooled thermal conductors
    50.
    发明授权
    Thermoelectric-enhanced, inlet air-cooled thermal conductors 有权
    热电增强型入口风冷导热体

    公开(公告)号:US09504189B1

    公开(公告)日:2016-11-22

    申请号:US14824401

    申请日:2015-08-12

    Abstract: A cooling apparatus is provided, which includes: a thermal conductor to cool a heat-dissipating component(s) of an electronics enclosure, the enclosure including an air inlet side through which airflow ingresses. The thermal conductor includes a first conductor portion coupled to the heat-dissipating component(s), and a second conductor portion positioned along the enclosure's air inlet side. The apparatus further includes one or more air-cooled heat sinks coupled to the second conductor portion to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure, and one or more thermoelectric devices coupled to at least one of the first or second conductor portions to selectively provide auxiliary cooling. A controller controls operation of the thermoelectric device(s) and selectively switches operation of the cooling apparatus between an active cooling mode, where the thermoelectric device(s) is active, and a passive cooling mode, where the thermoelectric device is inactive.

    Abstract translation: 提供了一种冷却装置,其包括:用于冷却电子设备外壳的散热部件的热导体,所述外壳包括气流入口的空气入口侧。 热导体包括耦合到散热部件的第一导体部分和沿壳体的空气入口侧定位的第二导体部分。 该装置还包括一个或多个空气冷却的散热器,其联接到第二导体部分,以便于将热量从第二导体部分传递到进入外壳的气流,以及耦合到第一导体部分 或第二导体部分以选择性地提供辅助冷却。 控制器控制热电装置的操作,并且在热电装置有效的主动冷却模式和热电装置不活动的被动冷却模式之间选择性地切换冷却装置的操作。

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