Abstract:
Silicon- and nitrogen-containing compositions prepared by the reaction of an aminoalkylsilane such as 3-aminopropyl- or 3-methylaminopropyltrimethoxysilane with a glycidoxyalkylsilane such as 3-glycidoxypropyltrimethoxysilane are useful as adhesion promoters in addition curable polyorganosiloxane compositions. The latter are illustrated by mixtures of vinyl-substituted polyorganosiloxanes and hydride polyorganosiloxanes, also containing at least one platinum group metal compound as a hydrosilylation catalyst.
Abstract:
Compositions which comprise(A) a polymeric organosilicon compound having 1 to 6 Si-bonded hydrogen atoms per molecule,(B) a polymeric organosilicon compound having at least two alkenyl groups per molecule and a viscosity of not more than 100 mm.sup.2 /s,(C) a polymeric organosilicon compound having on average at least 10 Si-bonded hydrogen atoms per molecule,(D) a catalyst and, optionally(E) an inhibitor,with the proviso thatthe molar ratio of all the Si-bonded hydrogen atoms to all the SiC-bonded alkenyl groups in the composition is on average less than 1,the composition comprises (B) in an amount such that the composition comprises on average at least 1.1 alkenyl radicals of (B) per Si-bonded hydrogen atom of (A)and the content of Si-bonded hydrogen atoms of (C) is 5% to 50%, based on the number of all the Si-bonded hydrogen atoms present.
Abstract:
Addition-curable platinum group metal catalyzed silicone compositions are provided which utilize a bis(trialkyloxysilyl)alpha-amino ester as an adhesion promoter. Cohesive bonding is effected on both plastic and metal substrates at temperatures of about 100.degree. C. in an hour or less.
Abstract:
A method is provided for making a heat curable organopolysiloxane composition, such as a pressure sensitive adhesive composition by blending a benzene soluble resinous copolymer in the form of a spray dried particulate, comprising triorganosiloxy units, such as trimethylsiloxy units, and SiO.sub.2 units with a fluid network mixture of an alkenyl siloxane, a silicon hydride siloxane and a hydrosilylation catalyst.
Abstract:
An adhesion composition comprising:(A) a high molecular weight fluorosilicone polymer containing the unit having the formula (1):RfCH.sub.2 CH.sub.2 (CH.sub.3)SiO-- (1) wherein Rf is a perfluoroalkyl group containing 1 to 8 carbon atoms, in an amount of 30 mol % or more in the molecule, and blocked with the vinyl group at the both ends,(B) a low molecular fluorosilicone polymer containing the unit having the formula (1) in an amount of 30 mol % or more in the molecule, and containing an average of 3 or more units having the following formula (2):CH.sub.2 .dbd.CH(CH.sub.3)SiO-- (2),(C) an organohydrogenpolysiloxane,(D) an organosilane or organopolysiloxane having at least one hydrogen atom or alkenyl group bonded to a silicon atom and having at least one of the oxirane group, dialkoxysilyl groups or trialkoxysilyl groups, and(E) a platinum catalyst. The cured product of the composition has good resistance to gasoline, and therefore useful for automobile parts.
Abstract:
A silicone self-adhesive composition is comprised of (A) high viscosity organopolysiloxane raw rubber, (B) MQ resin, (C) organohydrogenpolysiloxane, (D) platinum catalyst, and (E) high vinyl content organopolysiloxane. It cures at relatively low temperature into an adhesive layer which has good adhesive properties and heat resistance, finding use as heat resistant adhesive tapes and labels.
Abstract:
A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.
Abstract:
An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.
Abstract:
The invention relates to a method of contacting two components to form a pressure-sensitive adhesive (PSA) construction, wherein the first component comprises a conventional PSA and a liquid organohydrogenpolysiloxane and the second component comprises the same PSA and a cure agent for the liquid organohydrogenpolysiloxane. The method provides improved adhesive bond strength over the unmodified PSA, which bond strength generally increases with the passage of time.
Abstract:
Improved primer compositions comprise (A) at least one member of a specified group of ethylenically unsaturated organosilicon compounds containing silicon-bonded alkoxy groups, (B) silicone/organic copolymers prepared from esters of ethylenically unsaturated organic acids and organosilicon compounds derived from these acids, (C) organohydrogensiloxane curing agents and (D) a solvent. The improvement resides in the presence in the solvent of an ethylenically unsaturated alcohol containing from 4 to 6 carbon atoms. The alcohol constitutes at least 50 percent by weight of the solvent.