公开(公告)号：US10276646B2

公开(公告)日：2019-04-30

申请号：US15612811

申请日：2017-06-02

Applicant: Samsung Display Co., Ltd.

Inventor： Hun Kim ,  Yong Jin Kim ,  Soon Jung Wang ,  Keun Soo Lee ,  Jae Ho Lee ,  Kyung Chan Chae

IPC: H01L23/32 ,  H01L27/32 ,  H01L51/52

Abstract: A display is provided. The display device includes a display area and a non-display area located around the display area; a base layer; an organic light-emitting diode (OLED) that is located on the base layer in the display area; and a first crack detection line that is located on the base layer in the non-display area; wherein the first crack detection line comprises a first line that extends substantially in a first direction along a first edge of the display area, a second line that is separated from the first line and extends substantially in the first direction, and a third line that is connected to an end of the first line and an end of the second line, wherein a cross-sectional shape of the first line in a second direction crossing the first direction is inversely tapered.

公开(公告)号：US10276472B2

公开(公告)日：2019-04-30

申请号：US15476976

申请日：2017-04-01

Applicant: IXYS, LLC

Inventor： Thomas Spann

IPC: H01L23/367 ,  H01L23/495 ,  H01L21/48 ,  H01L23/34 ,  H01L23/32 ,  H01L23/38 ,  H01L23/36 ,  H01L23/373 ,  H01L25/07 ,  H01L23/40

Abstract: A power semiconductor device module includes, among other parts, a DMB structure. The DMB structure includes a ceramic sheet, a top metal plate that is directly bonded to the top of the ceramic, and a bottom metal plate that is directly bonded to the bottom of the ceramic. A power semiconductor device die is attached to the top metal plate. The bottom surface of the bottom metal plate has a plurality small cavities. When the bottom metal plate is attached to another metal member, a material between the plate and the member (for example, thermal grease or a PCM or solder) is forced into the cavities. This results in an improvement in thermal transfer between the plate and the member. Such cavities can alternatively, or in addition, be included on a metal surface other than a DMB, such as the bottom surface of a baseplate of the module.

公开(公告)号：US10205292B2

公开(公告)日：2019-02-12

申请号：US15716356

申请日：2017-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/498

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

公开(公告)号：US20190019678A1

公开(公告)日：2019-01-17

申请号：US16080156

申请日：2016-03-22

Applicant: EV Group E. Thallner GmbH

Inventor： Thomas Wagenleitner ,  Thomas Plach ,  Jurgen Markus Suss

IPC: H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L23/32

Abstract: A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

公开(公告)号：US10159144B2

公开(公告)日：2018-12-18

申请号：US15549107

申请日：2015-08-20

Applicant: Renesas Electronics Corporation

Inventor： Shuuichi Kariyazaki ,  Wataru Shiroi ,  Kenichi Kuboyama

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/32 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K7/02

Abstract: A semiconductor device according to an embodiment has a first semiconductor component and a second semiconductor component which are electrically connected with each other via an interposer. The interposer has a plurality of first signal wiring paths, and a plurality of second signal wiring paths each having a path distance smaller than each of the plurality of first signal wiring paths. Furthermore, the first semiconductor component includes a first electrode, a second electrode, and a third electrode arranged in order in a first direction. Furthermore, the second semiconductor component includes a fourth electrode, a fifth electrode, and a sixth electrode arranged in order in the first direction. Furthermore, the first electrode is connected with the fourth electrode via the first signal wiring path, the second electrode is connected with the fifth electrode via the first signal wiring path, and the third electrode is connected with the sixth electrode via the first signal wiring path.

公开(公告)号：US10143086B2

公开(公告)日：2018-11-27

申请号：US15351234

申请日：2016-11-14

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. Rogers ,  Seung-Kyun Kang ,  SukWon Hwang ,  Jianjun Cheng ,  Yanfeng Zhang ,  Hanze Ying

IPC: H01L21/70 ,  H01L21/56 ,  H01L23/29 ,  H01L23/32 ,  A61B5/00 ,  H05K1/02 ,  H05K5/06 ,  H05K1/18 ,  H05K13/00 ,  A61M5/44 ,  G06K19/077 ,  H05K1/03 ,  H05K3/22 ,  H05K3/28 ,  H01L21/02 ,  H01L21/311 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

Abstract: The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

公开(公告)号：US20180294212A1

公开(公告)日：2018-10-11

申请号：US15640987

申请日：2017-07-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ming-Fa Chen ,  Chen-Hua Yu

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/14 ,  G01R1/04 ,  H01L23/32 ,  H05K7/10

Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

公开(公告)号：US20180286778A1

公开(公告)日：2018-10-04

申请号：US15476976

申请日：2017-04-01

Applicant: IXYS Corporation

Inventor： Thomas Spann

IPC: H01L23/367 ,  H01L23/495 ,  H01L21/48 ,  H01L23/34 ,  H01L23/32 ,  H01L23/38

CPC classification number: H01L23/32 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/07 ,  H01L2023/405 ,  H01L2023/4068

Abstract: A power semiconductor device module includes, among other parts, a DMB structure. The DMB structure includes a ceramic sheet, a top metal plate that is directly bonded to the top of the ceramic, and a bottom metal plate that is directly bonded to the bottom of the ceramic. A power semiconductor device die is attached to the top metal plate. The bottom surface of the bottom metal plate has a plurality small cavities. When the bottom metal plate is attached to another metal member, a material between the plate and the member (for example, thermal grease or a PCM or solder) is forced into the cavities. This results in an improvement in thermal transfer between the plate and the member. Such cavities can alternatively, or in addition, be included on a metal surface other than a DMB, such as the bottom surface of a baseplate of the module.

公开(公告)号：US10068826B2

公开(公告)日：2018-09-04

申请号：US15334393

申请日：2016-10-26

Applicant: Guangzhou Kingyi Metal Product Co., Ltd.

Inventor： Yaowen He

IPC: H01L23/14 ,  H01L23/32 ,  H01L23/053

Abstract: Provided is a package device, relating to the technical field of lamp beads. The package device comprises an SMD holder, wherein the SMD holder is a hollow housing with one end opened; and the material of sidewalls of the SMD holder is transparent plastic. In the package device provided by the present invention, a transparent material is provided as the material of the sidewalls of the SMD holder, and light generated after a chip is powered on can be partially transmitted out through the sidewalls of the SMD holder, avoiding blocking of the light generated after the chip is powered on by the sidewalls of the SMD holder, thereby increasing transmittance of light from the chip.

公开(公告)号：US10044124B2

公开(公告)日：2018-08-07

申请号：US15432072

申请日：2017-02-14

Applicant: YAMAICHI ELECTRONICS CO., LTD.

Inventor： Hideki Sagano ,  Hideki Sato

IPC: H01R13/193 ,  H01R12/89 ,  G01R1/04 ,  H01L23/32 ,  H01L23/00 ,  H01R13/24 ,  H05K7/10

Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.