公开(公告)号：US12040199B2

公开(公告)日：2024-07-16

申请号：US16202941

申请日：2018-11-28

申请人： ASM IP Holding B.V.

发明人： Jeroen Fluit

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67098 ,  H01L21/67303 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67778 ,  H01L21/68707

摘要： The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured with an elevator to transfer a boat with substrates to the reactor. The apparatus having a boat transfer device to transfer the boat with substrates between a substrate loading station, the first and/or second elevator and a cool down station. The substrate loading station and the cool down station may be arranged on opposite sides of the first and second elevator.

公开(公告)号：US20240234195A9

公开(公告)日：2024-07-11

申请号：US18490741

申请日：2023-10-19

申请人： UTAC Headquarters Pte. Ltd.

发明人： Hua Hong Tan ,  Chee Kay Chow ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Wing Keung Lam

IPC分类号： H01L21/683 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/6838 ,  H01L21/4867 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67766

摘要： A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

公开(公告)号：US20240234189A1

公开(公告)日：2024-07-11

申请号：US18560099

申请日：2022-05-16

申请人： SCREEN Holdings Co., Ltd.

发明人： Tomohiro TAKAHASHI

IPC分类号： H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC分类号： H01L21/67781 ,  H01L21/30604 ,  H01L21/67034 ,  H01L21/6708

摘要： In substrate processing using the batch processing unit and the single substrate processing unit, the entire substrate processing is efficiently advanced. A substrate processing method includes: a process of calculating a required period of time that is a period of time taken for the substrates to complete the substrate processing in the single substrate processing unit according to a standby number that is a number of the substrates after being subjected to chemical liquid processing in the batch processing unit and before being subjected to drying processing in single substrate processing unit; and a process of controlling a start timing of the chemical liquid processing in the batch processing unit to make the required period of time shorter than a period of time taken for the chemical liquid processing in the batch processing unit.

公开(公告)号：US12030759B2

公开(公告)日：2024-07-09

申请号：US17778615

申请日：2020-10-02

申请人： MURATA MACHINERY, LTD.

发明人： Jun Sai ,  Kazuhiro Ishikawa

IPC分类号： B66F9/07 ,  B65G1/04 ,  H01L21/677

CPC分类号： B66F9/07 ,  B65G1/0407 ,  B65G2249/02 ,  H01L21/67766

摘要： In a stacker crane, a cover to cover an elevation area of an elevation portion is integrally attachable to side surface portions of a mast, which includes a reinforcement portion and an adjuster. The reinforcement portion between a pair of the side surface portions in a Y direction extends toward an opposite direction to an elevation surface of an elevation surface defining portion and has a higher stiffness than that of each of the pair of side surface portions. The adjuster is spaced from the elevation surface defining portion in an X direction perpendicular to a Z direction and the Y direction, and both edges thereof extendible in the Y direction are contactable with the reinforcement portion and each of the pair of side surface portions.

公开(公告)号：US20240222166A1

公开(公告)日：2024-07-04

申请号：US18443342

申请日：2024-02-16

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： FU-HSIEN LI ,  CHI-FENG TUNG ,  HSIANG YIN SHEN

IPC分类号： H01L21/67 ,  B65G49/07 ,  B66C7/08 ,  B66C13/18 ,  G05B19/418 ,  H01L21/677

CPC分类号： H01L21/67242 ,  B65G49/07 ,  B66C7/08 ,  B66C13/18 ,  G05B19/41815 ,  H01L21/67727 ,  G05B2219/45031 ,  H01L21/67005

摘要： A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.

公开(公告)号：US20240213089A1

公开(公告)日：2024-06-27

申请号：US18556978

申请日：2022-04-20

申请人： Lam Research Corporation

发明人： Navaneetha Krishnan SUBBAIYAN ,  Patrick LITTLE ,  Daniel Mark DINNEEN ,  Shantinath GHONGADI

IPC分类号： H01L21/768 ,  H01J37/32 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/76862 ,  H01J37/32376 ,  H01J37/3244 ,  H01J37/32825 ,  H01L21/67167 ,  H01L21/6723 ,  H01L21/67745 ,  H01L21/76873 ,  H01L21/02068

摘要： An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footprint or form factor of the semiconductor process tool. The atmospheric plasma treatment station includes a movable atmospheric plasma source such as a linear head for scanning across a surface of a substrate. The atmospheric plasma treatment station provides an enclosed space in a controlled environment with non-reactive gas flowing through the enclosed space. Process gases may be supplied to the linear head based on a surface condition of the substrate being treated.

公开(公告)号：US20240213069A1

公开(公告)日：2024-06-27

申请号：US18528362

申请日：2023-12-04

申请人： SEMES CO., LTD. ,  Daekhon International Inc.

发明人： Nahyun LEE ,  Myungjin LEE ,  Jongsuk CHOI ,  Eunsang YOON ,  Seungwhan SUH ,  Junghag CHA ,  Sungjin LIM ,  Jinkwan HEO

IPC分类号： H01L21/677 ,  B65G49/06

CPC分类号： H01L21/67709 ,  B65G49/061 ,  H01L21/6773 ,  B65G2201/0297

摘要： Provided is a tower lift including a frame extending in a vertical direction, a carriage configured to move along the frame, a first coil arranged on a first surface of the frame, the first surface facing the carriage, a second coil arranged on the first surface of the frame and separated from the first coil, a first magnet connected to the carriage and located between the first coil and the second coil, and a second magnet connected to the carriage, located between the first magnet and the second coil, and separated from the first magnet.

公开(公告)号：US20240213067A1

公开(公告)日：2024-06-27

申请号：US18601423

申请日：2024-03-11

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Guan-Wei HUANG ,  Ping-Yung YEN ,  Hsuan LEE ,  Jiun-Rong PAI

IPC分类号： H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67373 ,  H01L21/67303 ,  H01L21/67706 ,  H01L21/6773 ,  H01L21/67736

摘要： A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

公开(公告)号：US20240213066A1

公开(公告)日：2024-06-27

申请号：US18287996

申请日：2022-02-16

申请人： SEMSYSCO GMBH

发明人： Ulrich Tschinderle ,  Herbert Ötzlinger ,  Louis Wagner

IPC分类号： H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/6734 ,  H01L21/6715 ,  H01L21/67379 ,  H01L21/67736 ,  H01L21/68728

摘要： The present invention relates to a frame system. The frame system is configured for holding a substrate during a chemical and/or electrolytic surface treatment of the substrate. The frame system comprises a frame element and several finger units arranged at the frame element. The frame element is configured to at least partially surround lateral edges of the substrate and to spare at least a first surface or a second surface of the substrate to be accessible for the surface treatment. Each finger unit comprises a first finger and a second finger. The first finger is configured to contact the first surface of the substrate and the second finger is configured to contact the second surface of the substrate opposite to the first surface of the substrate. The first finger is movable relative to the frame element to clamp the substrate between the first finger and the second finger.

公开(公告)号：US20240213048A1

公开(公告)日：2024-06-27

申请号：US18391661

申请日：2023-12-21

申请人： SEMES CO., LTD.

发明人： Jongwha Kang ,  Sunwook Jung ,  Wooram Lee ,  Byoungdoo Choi ,  Arah Cho ,  Dongwoon Park

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67051 ,  H01L21/6719 ,  H01L21/67225 ,  H01L21/67742

摘要： A substrate processing apparatus includes a processing unit including a processing vessel with an internal space and a support unit configured to support a substrate and rotate the substrate in a first rotation direction in the internal space, and an exhaust unit configured to exhaust a gas from the internal space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the internal space, and one or more connectors connecting the processing vessel to the exhaust pipe, and one end of the exhaust pipe is closed, and an open outlet is formed at a remaining end of the exhaust pipe to discharge the gas.