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公开(公告)号：US20230211390A1
公开(公告)日：2023-07-06
申请号：US18068940
申请日：2022-12-20
Applicant: SEMES CO., LTD.
Inventor： Ki-Moon Kang , Seung Un Oh
CPC classification number: B08B13/00 , B08B7/0021
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes first treating a substrate in a treating space according to a reference recipe; second treating a substrate in the treating space according to the reference recipe after the first treating; and optimizing an inner ambient of the treating space according to the reference recipe, and wherein the optimizing includes a purge operation of supplying and discharging a treating fluid to/from the treating space.
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公开(公告)号：US20230211261A1
公开(公告)日：2023-07-06
申请号：US17941018
申请日：2022-09-09
Applicant: SEMES CO., LTD.
Inventor： Seong Hyeon KIM , Gi Hun Choi , Seung Tae Yang , So Young Park , Kyung Hwan Min
CPC classification number: B01D29/668 , B08B3/02 , B08B15/00 , B01D29/94 , B01D29/90
Abstract: The present disclosure provides a substrate processing apparatus capable of stabilizing the particle level when re-supplying a chemical solution. The substrate processing apparatus includes a circulation line connected to a chemical supply unit to circulate a chemical solution, a filter installed in the circulation line to filter particles in the chemical solution, a supply line connected to a first node of the circulation line and configured to supply the chemical solution to the chamber, and a drain line connected, in the circulation line, to a second node located between the filter and the first node, and configured to drain the chemical solution, the apparatus being configured to operate, during a first duration, from when a pump of the chemical supply unit is restarted after the pump had stopped, to drain the chemical solution that passes through the filter.
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公开(公告)号：US20230207361A1
公开(公告)日：2023-06-29
申请号：US18083179
申请日：2022-12-16
Applicant: SEMES CO., LTD.
Inventor： Sung Ho LEE , No Jae PARK
IPC: H01L21/673 , H01L21/677
CPC classification number: H01L21/67393 , H01L21/67775 , H01L21/67769
Abstract: Provided are a flow supply apparatus and supply method. The flow supply apparatus, comprising: a rail; a transport unit disposed on the rail, where an object is loaded; and a gas treatment unit provided on the transport unit and configured to purge the object. The object includes a FOUP with a substrate accommodated therein, and fume is removed from the substrate through the purging.
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公开(公告)号：US20230207351A1
公开(公告)日：2023-06-29
申请号：US18147416
申请日：2022-12-28
Applicant: SEMES CO., LTD.
Inventor： Seung Un OH , In Ki JUNG , Shin Hwa KANG , Sang Hyeon RYU , Young Ho PARK
IPC: H01L21/67
CPC classification number: H01L21/67115 , H01L21/6715 , H01L21/67259 , H01L21/67253
Abstract: Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.
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公开(公告)号：US20230207350A1
公开(公告)日：2023-06-29
申请号：US18147400
申请日：2022-12-28
Applicant: SEMES CO., LTD.
Inventor： Tae Shin KIM , Young Dae Chung , Won-Geun Kim , Jee Young Lee , Ji Hoon Jeong
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67115 , H01L21/67248 , H01L21/6715 , H01L21/68764
Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.
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Patent Agency Ranking
公开(公告)号：US20230207271A1
公开(公告)日：2023-06-29
申请号：US18055917
申请日：2022-11-16
Inventor： Yoon Seok CHOI , Sun Wook JUNG , Jong Won PARK , Ho-Jun LEE , Min Sang PARK
IPC: H01J37/32
CPC classification number: H01J37/32201 , H01J37/3244 , H01J37/32229 , H01J2237/327
Abstract: The apparatus includes a process chamber having a treating space therein, a support unit for supporting the substrate in the treating space, a gas supply unit for supplying treating gas to the treating space, and a microwave application unit for applying microwaves to the treating gas to generate plasma. The microwave application unit may include first power supply for applying a first microwave, a support plate having a groove formed on an upper surface thereof and combined with the process chamber above the support unit to define the treating space, a first transmission plate inserted into the groove to radiate the first microwave to the treating space, and a first waveguide disposed to overlap with an upper portion of the first transmission plate and coupled to the first power supply, wherein a plurality of grooves may be formed along a circumferential direction in an edge region of the support plate.
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507.发明公开公开(公告)号：US20230206426A1
公开(公告)日：2023-06-29
申请号：US18146613
申请日：2022-12-27
Applicant: SEMES CO., LTD.
Inventor： Seung Won KIM , Ji Soo PARK , Jun Cheol PARK , Yong Hun SIM
CPC classification number: G06T7/001 , H01L21/67253 , H01L21/681 , H01L21/67259 , G06T2207/30148 , G06T2207/20081
Abstract: Disclosed are a semiconductor manufacturing facility and a teaching method of the semiconductor manufacturing facility, which prevent partial whitening of image information for obtaining a teaching reference point of a teaching target during a teaching operation of a transfer device that transfers a wafer or a mask, thereby improving readability. The semiconductor manufacturing facility includes: a teaching target in which a first teaching reference point and a second teaching reference point are formed; a transfer device on which the teaching target is mounted; and a teaching inspection unit for image-analyzing the first teaching reference point and the second teaching reference point of the teaching target, calculating center coordinates of each of the first teaching reference point and the second teaching reference point, and teaching the transfer device with an angle value of a line connecting the respective center coordinates.
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公开(公告)号：US20230206415A1
公开(公告)日：2023-06-29
申请号：US18076401
申请日：2022-12-07
Applicant: SEMES CO., LTD.
Inventor： Ji Hoon YOO , Kwang Sup KIM , Jong Min LEE , Yeon Chul SONG , Jun Ho OH , Young Ho PARK , Myeong Jun LIM
IPC: G06T7/00 , H04N1/034 , G06V10/44 , G06V10/762 , G06V10/764
CPC classification number: G06T7/0002 , H04N1/034 , G06V10/44 , G06V10/762 , G06V10/764
Abstract: Provided are a substrate inspecting unit capable of reducing image data labeling work time through training image data set verification and semi-automatic image labeling, and at the same time, improving prediction performance by improving classification accuracy for data sets, and a substrate treating apparatus including the same. The substrate inspecting unit comprises a feature extracting module for extracting a feature from training data included in each class in response to a plurality of training data related to image data of a substrate being classified according to a predefined class, a validity evaluating module for evaluating validity of the feature, a class verifying module for verifying the predefined class, and a data reconstructing module for reconstructing the plurality of training data based on a feature determined as valid and a verified class, wherein reconstructed training data is utilized when inspecting the substrate.
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公开(公告)号：US20230204648A1
公开(公告)日：2023-06-29
申请号：US17837027
申请日：2022-06-10
Applicant: SEMES CO., LTD.
Inventor： Jun Ho OH , Kwang Sup KIM , Jae Hong KIM , Kyung Hun JANG , Young Ho PARK , Jong Min LEE , Yeon Chul SONG , Sang Min HA , Ji Hoon YOO , Myeong Jun LIM
IPC: G01R29/24
CPC classification number: G01R29/24
Abstract: A static electricity visualization apparatus capable of visually identifying a measured level of static electricity is provided. The static electricity visualization apparatus comprises a photographing unit for generating a first photographed image obtained by photographing a measurement target at a first distance from the measurement target in a first mode, and generating a second photographed image obtained by photographing the measurement target at a second distance from the measurement target in a second mode, a static electricity sensor for measuring a static electricity level of the measurement target at the second distance from the measurement target, a processor for matching the second photographed image with the first photographed image, and an output unit for outputting a static electricity visualization image that visualizes a static electricity level measured by the static electricity sensor on the first photographed image, wherein the static electricity visualization image comprises a color corresponding to the static electricity level of the measurement target measured by the static electricity sensor at a position where the second photographed image matches on the first photographed image.
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公开(公告)号：US20230204414A1
公开(公告)日：2023-06-29
申请号：US17979149
申请日：2022-11-02
Applicant: SEMES CO., LTD.
Inventor： Hyun YOON , Ki Hoon CHOI , Tae Hee KIM , Ji Hoon JEONG
CPC classification number: G01J1/4257 , G01J1/0271 , G03F7/2053
Abstract: The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.
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