公开(公告)号：US08259278B2

公开(公告)日：2012-09-04

申请号：US12508031

申请日：2009-07-23

Applicant: Sung-Woon Kim ,  Hwa-Sung Woo ,  Joo-Nyung Jang ,  Mi-Jeong Song ,  Hwang-Yul Kim ,  Cheol Shin ,  Dong-Chul Shin ,  Hee-Seop Kim ,  Jung-Hyeon Kim

Inventor： Sung-Woon Kim ,  Hwa-Sung Woo ,  Joo-Nyung Jang ,  Mi-Jeong Song ,  Hwang-Yul Kim ,  Cheol Shin ,  Dong-Chul Shin ,  Hee-Seop Kim ,  Jung-Hyeon Kim

IPC: G02F1/1339 ,  G02F1/1337 ,  G02F1/1343

CPC classification number: G02F1/133707 ,  G02F2001/133397 ,  G02F2001/134345 ,  G02F2001/13706 ,  G09G3/3614 ,  G09G3/3659 ,  G09G2300/0434 ,  G09G2300/0823 ,  G09G2320/0247 ,  G09G2320/0252 ,  G09G2320/028

Abstract: A liquid crystal display includes; first and second substrates facing each other, a liquid crystal layer interposed between the first and second substrates and including liquid crystal molecules, a first subpixel electrode disposed on the first substrate, the first subpixel electrode receiving a first data voltage, a second subpixel electrode disposed on the first substrate, the second subpixel electrode receiving a second data voltage; and a short protrusion disposed on the second substrate and simultaneously facing the first and second subpixel electrodes, wherein the liquid crystal layer is vertically aligned and has positive dielectric anisotropy.

Abstract translation: 液晶显示器包括： 第一和第二基板彼此面对，夹在第一和第二基板之间并包括液晶分子的液晶层，设置在第一基板上的第一子像素电极，第一子像素电极接收第一数据电压，第二子像素电极设置 在所述第一基板上，所述第二子像素电极接收第二数据电压; 以及设置在所述第二基板上并同时面对所述第一和第二子像素电极的短突起，其中所述液晶层垂直取向并具有正的介电各向异性。

公开(公告)号：US08137059B2

公开(公告)日：2012-03-20

申请号：US12222452

申请日：2008-08-08

Applicant: Jin Baek Kim ,  Hyun Seok Jung ,  Jun Young Lee ,  Jung Hyeon Kim ,  Hyun Ho Park

Inventor： Jin Baek Kim ,  Hyun Seok Jung ,  Jun Young Lee ,  Jung Hyeon Kim ,  Hyun Ho Park

IPC: F03B11/08 ,  F03B1/00 ,  F01D5/00 ,  F04D29/70 ,  B63H7/00

CPC classification number: F24F1/38 ,  F04D29/703 ,  F24F1/40 ,  F24F1/48 ,  F24F1/50

Abstract: An outdoor unit for an air conditioner is disclosed. The outdoor unit according to the present invention comprises a housing which has an air inlet and an air outlet, a ventilation fan rotatably mounted in the housing, and a fan guard connected to the housing to cover the air outlet. Here, the fan guard comprises a plurality of closed ribs arranged sequentially and concentrically between a center and an outline thereof, and a plurality of radial ribs arranged in radial directions to interconnect the plurality of closed ribs, in such a manner that some of the closed ribs, which are disposed at intermediate positions near tips of the ventilation fan, are at a further distance from the ventilation fan than the other closed ribs, which are disposed near the center and the outline. Accordingly, since the fan guard is convexly raised at a position corresponding to the tips of the ventilation fan, thereby guaranteeing a predetermined space between the fan guard and the tips where the airflow is fastest, the flow resistance and the flow-induced noise can be reduced.

Abstract translation: 公开了一种用于空调的室外机。 根据本发明的室外机包括具有空气入口和空气出口的壳体，可旋转地安装在壳体中的通风扇和连接到壳体以覆盖空气出口的风扇防护罩。 这里，风扇防护罩包括顺序并同心地布置在其中心和轮廓之间的多个封闭肋，以及沿径向布置的多个径向肋，以使多个封闭肋互相连接，使得一些闭合 设置在通风扇的顶端附近的中间位置处的肋与设置在中心和轮廓附近的其它封闭肋相比距离通风扇更远。 因此，由于风扇护罩在与通气风扇的前端相对应的位置处凸起地升高，所以能够确保风扇防护件与气流最快的端部之间的预定空间，所以流动阻力和流动感应噪声可以是 减少

公开(公告)号：US20110142239A1

公开(公告)日：2011-06-16

申请号：US13059227

申请日：2009-08-14

Applicant: Kyung Joo Suh ,  Sung Ho Choi ,  Jung Hyeon Kim ,  Jae Chon Yu ,  Eun Hui Bae

Inventor： Kyung Joo Suh ,  Sung Ho Choi ,  Jung Hyeon Kim ,  Jae Chon Yu ,  Eun Hui Bae

IPC: H04K1/00

CPC classification number: H04W12/04 ,  H04W12/02 ,  H04W60/00

Abstract: The present invention relates to a method and system for the management of the mobility, the management of an idle mode, the registration management (management of attachment and detachment), and the location management (management of tracking area) of a terminal by using a non-access stratum (i.e., network stratum, hereinafter referred to as “NAS”) in a mobile telecommunication network. To this end, the method for the management of mobility, the management of an idle mode, the registration management, and the location management of a terminal by using a NAS protocol, i.e., messages, according to an embodiment of the present invention, includes a terminal (hereinafter, referred to as “UE”) and a mobility management entity (hereinafter, referred to as “MME”), and addresses to a method for efficiently processing security protected NAS messages if received messages are security protected NAS messages, in a case of sending or receiving messages serving as EMM (EPS Mobility Management) messages, i.e., mobility management messages, in a network such as an EPS (Evolved Packet System) of 3GPP, when the terminal performs handover in an active mode, performs location management in an idle mode, and registers to a network, thereby achieving improved efficiency in the mobility management, the position management, and the registration management of a terminal.

Abstract translation: 本发明涉及一种用于管理移动性的方法和系统，空闲模式的管理，登记管理（附件和分离的管理）以及终端的位置管理（跟踪区域的管理） 移动电信网络中的非接入层（即，网络层，以下称为“NAS”）。 为此，根据本发明的实施例，通过使用NAS协议即消息来管理移动性的方法，空闲模式的管理，注册管理和终端的位置管理包括 终端（以下称为“UE”）和移动性管理实体（以下称为“MME”），以及如果接收到的消息是安全保护的NAS消息，则有效地处理安全保护的NAS消息的方法的地址， 在终端以活动模式进行切换的情况下，在诸如3GPP的EPS（演进分组系统）的网络中发送或接收用作EMM（EPS移动性管理）消息（即移动性管理消息）的消息，执行位置 在空闲模式下进行管理，并登记到网络，从而提高终端的移动管理，位置管理和登记管理的效率。

公开(公告)号：US07791178B2

公开(公告)日：2010-09-07

申请号：US11984762

申请日：2007-11-21

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

IPC: H01L23/495

CPC classification number: H01L23/3107 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

Abstract translation: 提供引线框单元，具有引线框单元的半导体封装，具有半导体封装的堆叠半导体封装及其制造方法。 层叠半导体封装中的引线框架单元可以包括：支撑半导体芯片的管芯焊盘，与半导体芯片电连接的内部引线;从内部引线延伸的外部引线;以及围绕连接部分的耐热绝缘构件。 外引线可以包括连接到内引线的连接部分和连接到连接部分的接合部分和电路板。 外部信号可以施加到接合部分。 如果在叠层半导体封装中使用引线框架单元，则堆叠半导体封装中的外引线和虚外外引线可以具有基本相同的形状。

公开(公告)号：US07755181B2

公开(公告)日：2010-07-13

申请号：US11872810

申请日：2007-10-16

Applicant: Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

Inventor： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC: H01L23/538

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

Abstract translation: 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US20100155729A1

公开(公告)日：2010-06-24

申请号：US12637658

申请日：2009-12-14

Applicant: Sung-Hoon Yang ,  So-Woon Kim ,  Yeon-Ju Kim ,  So-Hyun Lee ,  Kwang-Hoon Lee ,  Mun-Soo Park ,  Jung-Hyeon Kim

Inventor： Sung-Hoon Yang ,  So-Woon Kim ,  Yeon-Ju Kim ,  So-Hyun Lee ,  Kwang-Hoon Lee ,  Mun-Soo Park ,  Jung-Hyeon Kim

IPC: H01L27/13 ,  H01L29/786

CPC classification number: G02F1/1345 ,  H01L27/124 ,  H05K1/0265 ,  H05K1/167 ,  H05K2201/0784 ,  H05K2201/09263

Abstract: A fan-out unit which can control a resistance difference among channels with efficient space utilization and a thin-film transistor (TFT) array substrate having the fan-out unit are presented. The fan-out unit includes: an insulating substrate; a first wiring layer which is formed on the insulating substrate and connected to a pad; a second wiring layer which is formed on the insulating substrate and connected to a TFT; and a resistance controller which is connected between the first wiring layer and the second wiring layer and includes a plurality of first resistors extending parallel to the first wiring layer and a plurality of second resistors extending perpendicular to the first resistors and alternately connecting to the first resistors, wherein the first resistors are longer than the second resistors.

Abstract translation: 提出了一种能够控制具有高效空间利用的通道之间的电阻差的扇出单元和具有扇出单元的薄膜晶体管（TFT）阵列基板。 扇出单元包括：绝缘基板; 第一布线层，其形成在所述绝缘基板上并连接到焊盘; 第二布线层，其形成在绝缘基板上并连接到TFT; 以及电阻控制器，其连接在第一布线层和第二布线层之间，并且包括平行于第一布线层延伸的多个第一电阻器和垂直于第一电阻器延伸的多个第二电阻器，并交替地连接到第一电阻器 ，其中所述第一电阻器比所述第二电阻器长。

公开(公告)号：US07728923B2

公开(公告)日：2010-06-01

申请号：US11515043

申请日：2006-09-05

Applicant: Su-gun Kim ,  Tae-hee Cho ,  Ki-bum Seong ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Su-gun Kim ,  Tae-hee Cho ,  Ki-bum Seong ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: G02F1/1335 ,  G01D11/28 ,  F21V7/04

CPC classification number: G02B6/0076 ,  G02B6/0046 ,  G02B6/0055 ,  G02B6/0078 ,  G02F1/133603 ,  G02F1/133609

Abstract: A backlight unit and method of use are provided having a first light guide plate, a linear light source disposed along at least one side edge of the first light guide plate, a plurality of second light guide plates facing the first light guide plate, and a point light source disposed along at least one side edge of each second light guide plate. Accordingly, the present invention can provide a backlight unit using both a point light source and a linear light source at substantially the same time, and having superior color reproducibility and low power consumption.

Abstract translation: 提供一种背光单元和使用方法，其具有第一导光板，沿着第一导光板的至少一个侧边缘设置的线性光源，面向第一导光板的多个第二导光板，以及 沿着每个第二导光板的至少一个侧边缘设置的点光源。 因此，本发明可以基本上同时提供使用点光源和线性光源两者的背光单元，并且具有优异的颜色再现性和低功耗。

公开(公告)号：US20090200357A1

公开(公告)日：2009-08-13

申请号：US12320964

申请日：2009-02-10

Applicant: Sung-Soo Lee ,  Ki-Taik Oh ,  Jung-Hyeon Kim

Inventor： Sung-Soo Lee ,  Ki-Taik Oh ,  Jung-Hyeon Kim

IPC: B23K37/04

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arms with respect to a process to be performed, a clamping section in each clamp arm, the clamping section having concave portions facing the interval between the clamp arms, the concave portions being configured to contact the bonding wire when the clamp arms are brought close together, and at least one abrasion prevention member in each clamping section, the abrasion prevention members being configured to prevent abrasion during contact with the bonding wire.

Abstract translation: 电线夹具包括彼此隔开预定距离的一对夹持臂，以在其间限定用于接合线的间隔，联接到夹紧臂的夹具本体，夹具主体被配置为相对于夹具臂之间的预定距离调整 对于要执行的处理，每个夹持臂中的夹持部分，夹持部分具有面对夹紧臂之间的间隔的凹部，凹部被构造成在夹紧臂靠近在一起时与接合线接触，并且在 每个夹紧部分中的至少一个防磨损构件，所述防磨构件被构造成防止在与所述接合线接触期间的磨损。

公开(公告)号：US20090191042A1

公开(公告)日：2009-07-30

申请号：US12350705

申请日：2009-01-08

Applicant: Jun-Sig Park ,  Jung-Hyeon Kim ,  Jin-Ho Shin ,  Gennady Ivanov

Inventor： Jun-Sig Park ,  Jung-Hyeon Kim ,  Jin-Ho Shin ,  Gennady Ivanov

IPC: H01L21/677 ,  C23C16/458 ,  H01L21/30

CPC classification number: C23C16/4583 ,  H01L21/67109 ,  H01L21/67383 ,  Y10S414/136 ,  Y10S414/141

Abstract: A semiconductor manufacturing apparatus and a wafer loading/unloading method thereof increase productivity. The semiconductor manufacturing apparatus includes a first boat and a second boat having a plurality of first slots and a plurality of second slots, respectively, and disposed such that the first slots and the second slots alternate each other, the first boat mounting a plurality of first wafers in the first slots to direct front faces of the first wafers in a predetermined direction, the second boat mounting a plurality of second wafers in the second slots to direct back faces of the second wafers in the predetermined direction; a reaction tube having an opening and containing the first and second boats mounting the first and second wafers; a plate sealing up the opening of the reaction tube containing the first boat and the second boat; a reaction gas supplier supplying reaction gas into the sealed reaction tube for a predetermined process; and a reaction gas exhauster exhausting the reaction gas from the reaction tube to the external of the reaction tube after the predetermined process.

Abstract translation: 半导体制造装置及其晶片装载/卸载方法提高了生产率。 半导体制造装置包括分别具有多个第一槽和多个第二槽的第一船和第二船，并且被布置成使得第一槽和第二槽彼此交替，第一船安装多个第一槽 在所述第一槽中的晶片在预定方向上引导所述第一晶片的前表面，所述第二船在所述第二槽中安装多个第二晶片以沿所述预定方向引导所述第二晶片的背面; 反应管，其具有开口并且容纳安装所述第一和第二晶片的所述第一和第二船; 密封包含第一船和第二船的反应管的开口的板; 将反应气体供给到密封反应管中以进行预定处理的反应气体供给装置; 以及反应气体排出器，其在预定处理之后将反应气体从反应管排出到反应管的外部。

公开(公告)号：US20080176492A1

公开(公告)日：2008-07-24

申请号：US12009817

申请日：2008-01-22

Applicant: Ki-Su Kim ,  Jung-Hyeon Kim

Inventor： Ki-Su Kim ,  Jung-Hyeon Kim

IPC: B24B7/00

CPC classification number: C23C16/4412 ,  B01D45/02 ,  B01D45/04 ,  H01L21/67103

Abstract: A collection unit includes an exhaust conduit providing a path through which a process gas flows, a trap installed in the exhaust conduit, and a collection line connected to the trap. The trap has an inlet through which particles in the process are introduced into the trap, and the collection line penetrates a portion of the exhaust conduit to extend toward an outside region of the exhaust conduit. An apparatus including the collection unit and a method for collecting particles using the same are also provided.

Abstract translation: 收集单元包括排气管道，其提供工艺气体通过的路径，安装在排气管道中的捕集器和连接到捕集器的收集管线。 捕集器具有入口，通过该入口将过程中的颗粒引入到捕集器中，并且收集管线穿过排气管道的一部分以朝向排气管道的外部区域延伸。 还提供了一种包括收集单元的装置和使用其的收集颗粒的方法。