Abstract:
A new method of forming an amorphous silicon glue layer in the formation of a contact is described. Semiconductor device structures are provided in and on a semiconductor substrate. An insulating layer is deposited overlying the semiconductor device structures. An opening is etched through the insulating layer to contact one of the semiconductor device structures. An amorphous silicon layer is deposited overlying the insulating layer and within the opening. Ions are implanted into the amorphous silicon layer whereby grain sizes within the amorphous silicon layer are reduced. Native oxide on the surface of the amorphous silicon layer is removed. A titanium/titanium nitride layer is deposited overlying the amorphous silicon layer. A metal layer is deposited overlying the titanium/titanium nitride layer and filling the opening. The substrate is annealed whereby the titanium layer reacts with the amorphous silicon layer and the silicon semiconductor substrate to form titanium silicide. The metal layer is etched back or patterned to complete metallization in the fabrication of an integrated circuit device.
Abstract:
A fuse structure is described in which a metallic frame is inserted between the insulation layers, through which the fuse window passes, and the final passivation layer. This frame is used as a mask during fuse window formation so alignment is simplified and problems arising from the presence of insulating residues on the surface of the fuse window layer are avoided.
Abstract:
A process for the formation of a planar epitaxial cobalt silicide and for the formation of shallow conformal junctions for use in semiconductor processing. A cobalt silicide and titanium nitride bilayer is formed. The titanium nitride layer is chemically removed. Ions with or without a dopant are then implanted into the cobalt silicide layer. During the ion implantation, at least a portion of the cobalt silicide layer is transformed into an amorphous cobalt silicon mixture while the non-amorphous portion remains single crystal. If the ion implantation contains dopants, then after the implantation is completed, both the amorphous and non-amorphous portions of the cobalt silicide layer contain the dopants. The substrate is then annealed in either an ambient comprising a nitrogen gas or in an oxidizing ambient. During the anneal, the amorphous portion of the silicon substrate recrystallizes into a single crystal cobalt silicide layer. If the cobalt silicide layer after the ion implantation contain dopants, then during the anneal the dopants are driven out of the cobalt silicide layer and diffuse into the silicon substrate to form a conformal shallow junction. The resulting structure can be used in the vertical integration of microelectronic devices. In other words, the resulting structure is suitable for growing selective epitaxial silicon, for growing epitaxial insulators, for processing devices above the silicide in that epitaxial silicon, and for processing devices with buried conductors.
Abstract:
A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.
Abstract:
The present invention discloses a disparity estimation optimization method based on upsampling and exact rematching, which conducts exact rematching within a small range in an optimized network, improves previous upsampling methods such as neighbor interpolation and bilinear interpolation for disparity maps or cost maps, and works out a propagation-based upsampling method by the way of network so that accurate disparity values can be better restored from disparity maps in the upsampling process.
Abstract:
A point cloud attribute encoding method, a decoding method, an encoding device and a decoding device are disclosed, the point cloud attribute encoding method including: constructing an N-layer binary tree by partitioning a target point cloud according to positions of points within the point cloud, N being an integer greater than 1; for a target node at layer P of the binary tree, obtaining child nodes of the target node, determining a first attribute coefficient and second attribute coefficients of the target node by transforming first attribute coefficients of the child nodes, P being an integer greater than or equal to 1 and less than or equal to N−1; using the first attribute coefficient of a root node and the second attribute coefficients of each target node in the binary tree as output coefficients of the point cloud attribute encoding method.
Abstract:
This disclosure provides systems, devices, apparatus, and methods, including computer programs encoded on storage media, for protocol stacks and bearer modeling for assisted Uu connectivity. A UE and a PN may each establish a first connection with an AN and, based on the first connections with the AN, establish a second connection with each other. Based on a bearer configuration, the UE may determine whether to route data to the PN via the first connection with the AN or directly to the PN via the second connection with the PN. Accordingly, the UE may transmit the data to at least one of the AN or the PN based on the determination of whether to route the data to the PN via the first connection with the AN or directly to the PN via the second connection with the PN.
Abstract:
A method can include receiving, by a first controller component of a memory sub-system, a read operation, responsive to receiving the read operation, interrupting, by the first controller component, one or more program operations being performed by the memory sub-system, receiving, by the first controller component, a control sequence from a second controller component, wherein the control sequence is based on context data associated with the interrupted one or more program operations, and performing, by the first controller component, the control sequence by copying data of the interrupted one or more program operations from a first memory location to a second memory location of a memory component associated with the memory sub-system, and performing the read operation.
Abstract:
The present disclosure relates to wireless communications implemented by a user equipment (UE). The UE may receive a demodulation reference signal (DMRS) sequence grouping from a base station, select a DMRS sequence for transmission of DMRS based on the DMRS sequence grouping, and transmit uplink (UL) data along with the DMRS for UL transmission using contention-based protocol, wherein the DMRS is transmitted based on the selected DMRS sequence.
Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may receive bandwidth part configuration information configuring a dormancy profile for a first bandwidth part of a plurality of bandwidth parts; communicate, on a second bandwidth part, a plurality of types of signaling; and communicate, on the first bandwidth part, a subset of the plurality of types of signaling, such that at least one type of signaling, of the plurality of types of signaling, is suppressed in accordance with the dormancy profile. Numerous other aspects are provided.