APPARATUS AND METHOD FOR TREATING SUBSTRATE
    51.
    发明公开

    公开(公告)号:US20240216940A1

    公开(公告)日:2024-07-04

    申请号:US18342797

    申请日:2023-06-28

    CPC classification number: B05C9/06 B05C11/1042 B05C13/02 B05D1/22

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a liquid treating chamber; a support configured to support a substrate within the liquid treating chamber; a first treating liquid supply unit configured to supply a first treating liquid to the liquid treating chamber to treat the substrate with the first treating liquid; and a second treating liquid supply unit configured to supply a second treating liquid to the liquid treating chamber to treat the substrate with the second treating liquid, and wherein the second treating liquid supply unit includes a cooler for cooling the second treating liquid.

    Cooling unit, substrate treating apparatus including the same, and substrate treating method using the same

    公开(公告)号:US12025921B2

    公开(公告)日:2024-07-02

    申请号:US17487170

    申请日:2021-09-28

    CPC classification number: G03F7/40

    Abstract: The inventive concept provides a cooling unit. In an embodiment, the cooling unit comprises: a cooling plate with a seating surface; a pin member arranged at the cooling plate and supporting a substrate; a decompression hole formed on the seating surface; a decompression path formed within the cooling plate and connected to the decompression hole; a decompression member for decompressing the decompression path; and a controller for controlling the decompression member, wherein the controller controls the decompression member to decompress a space between the substrate and the seating surface of the cooling plate and thereby adjusting a distance between the substrate and the seating surface of the cooling plate.

    SUBSTRATE PROCESSING APPARATUS
    54.
    发明公开

    公开(公告)号:US20240213048A1

    公开(公告)日:2024-06-27

    申请号:US18391661

    申请日:2023-12-21

    Abstract: A substrate processing apparatus includes a processing unit including a processing vessel with an internal space and a support unit configured to support a substrate and rotate the substrate in a first rotation direction in the internal space, and an exhaust unit configured to exhaust a gas from the internal space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the internal space, and one or more connectors connecting the processing vessel to the exhaust pipe, and one end of the exhaust pipe is closed, and an open outlet is formed at a remaining end of the exhaust pipe to discharge the gas.

    SUBSTRATE PROCESSING APPARATUS AND METHOD THEREOF

    公开(公告)号:US20240210836A1

    公开(公告)日:2024-06-27

    申请号:US18501265

    申请日:2023-11-03

    CPC classification number: G03F7/422 H01L21/67051

    Abstract: Provided is a substrate processing apparatus and method capable of improving photoresist removal efficiency by using two different types of chemical liquids. The substrate processing apparatus comprises a substrate support unit for supporting and rotating a substrate; and a spray unit for discharging a substrate processing liquid onto the substrate using a nozzle structure, wherein the nozzle structure comprises a first inlet pipe for providing a first chemical liquid; a second inlet pipe for providing a second chemical liquid;
    a reaction space module where the first chemical liquid and the second chemical liquid are mixed; and a discharge pipe for discharging a mixture solution of the first chemical liquid and the second chemical liquid into the substrate processing liquid, wherein the first chemical liquid contains ozone gas, and the second chemical liquid contains an OH component.

    DROPLET PROCESSING DEVICE
    57.
    发明公开

    公开(公告)号:US20240208240A1

    公开(公告)日:2024-06-27

    申请号:US18390705

    申请日:2023-12-20

    Inventor: Yong-Deuk CHEONG

    CPC classification number: B41J2/2128 B41J2/2132

    Abstract: Disclosed is a droplet processing device which improves an operation of generating a droplet image during the conventional operation of generating a droplet image for forming a thin film on a substrate, thereby significantly reducing the generation time of the droplet image.
    The droplet processing device includes: an inkjet system for receiving input of a droplet image and applying ink to cause the droplet image to be printed on a substrate; and a droplet image generating terminal for transmitting the droplet image to the inkjet system, in which the droplet image is generated by collecting a plurality of cell print data printed on the substrate and peripheral print data printed on a periphery of the cell into single polygonal information, and rasterising and halftoning the collected polygonal information.

    PRESSURE CONTROL DEVICE AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240208211A1

    公开(公告)日:2024-06-27

    申请号:US18182577

    申请日:2023-03-13

    CPC classification number: B41J2/04583 B41J2/14451

    Abstract: Provided is a pressure control device for stably controlling the internal air pressure of a reservoir. The pressure control device includes: an input terminal receiving source air pressure; an intake valve connected between the input terminal and an output terminal; an exhaust valve connected to the output terminal; a pressure sensor connected to the output terminal and generating a sensed value by sensing pressure at the output terminal; and a controller simultaneously operating the intake valve and the exhaust valve by simultaneously operating a first control loop for adjusting the degree of opening of the intake valve by comparing the sensed value with a first target value and a second control loop for adjusting the degree of opening of the exhaust valve by comparing the sensed value with a second target value.

    Nozzle apparatus and apparatus for treating substrate

    公开(公告)号:US12017234B2

    公开(公告)日:2024-06-25

    申请号:US17225892

    申请日:2021-04-08

    Inventor: Min Jung Park

    CPC classification number: B05B1/044 B05B3/025 B05C5/0254

    Abstract: A nozzle apparatus may comprise a nozzle body having a nozzle tip with a discharge port for spraying a treatment fluid onto a substrate; a nozzle moving member for moving the nozzle body relative to the substrate; a rotating member for rotating the nozzle body or the nozzle tip so that a treatment fluid is sprayed onto the substrate during rotation; and a control unit configured to control an operation of the nozzle moving member and the rotating member.

    THERMAL PROCESSING APPARATUS USING MICROWAVES AND METHOD OF OPERATING SAME

    公开(公告)号:US20240206027A1

    公开(公告)日:2024-06-20

    申请号:US18538765

    申请日:2023-12-13

    CPC classification number: H05B6/6402

    Abstract: A thermal processing apparatus using microwaves and a method of operating the same are proposed. Provided is the thermal processing apparatus and an operation method thereof capable of converting a mode of the microwaves emitted into a processing space without changing equipment design. The thermal processing apparatus using microwaves includes a chamber configured to form the thermal processing space for a substrate and have an inner wall to which an electrophoresis film attached, a substrate support unit positioned on a lower part of the thermal processing space and supporting the substrate, a microwave unit positioned on an upper part of the thermal processing space and forming an electromagnetic field generated by the microwaves in the thermal processing space, and a controller for controlling the electrophoretic film so as to control movement paths of the microwaves on the basis of a process condition and a size of the substrate.

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