Abstract:
A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
Abstract:
A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
Abstract:
A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair.
Abstract:
A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape.
Abstract:
A dielectric resonator includes a dielectric block having an open surface at one of the surfaces thereof, the remaining surfaces being plated with a conductor. The dielectric block has an inner conductor hole formed at a surface of the dielectric block opposite to the open surface, the inner conductor hole extending a predetermined depth toward the open surface such that it does not perforate through the open surface. An electrode pattern is formed on the open surface such that it faces an end surface of the inner conductor hole, the electrode pattern being adapted to provide an input/output capacitor. The dielectric block has a coupling window formed on a predetermined portion of one of the surfaces of the dielectric block, except for the open surface and the surface formed with the inner conductor hole, at a position adjacent to one of the open surface and the surface formed with the inner conductor hole. The coupling window is free of the plated conductor and adapted to control a coupling degree of the resonator to another resonator. Other embodiments include integral type filters having resonators in a single dielectric block.
Abstract:
A push button which is employed in a control panel includes button body, a pushing finger, and a core. The button body has hollow space formed at an inner portion thereof and a bellows portion formed around a side portion thereof. The pushing finger protrudes upwardly from an outer surface of an upper end portion of the button body for receiving a pushing force. The core is retained in the hollow space, and fixed at an inner surface of the closed upper end portion. When the bellows portion of the button body is elastically compressed by a pushing force, an other end portion of the core is protruded from the lower end portion of the button body, and when the pushing force is removed from the pushing finger, the other end portion of the core is retained in the hollow space.
Abstract:
A material for microwave band devices used by the general people and in industrial electronic apparatuses is disclosed. Particularly, a magnetic ceramic composition for use in microwave devices, a magnetic ceramics for use in microwave devices and a preparation method therefore are disclosed, in which the saturation magnetization can be easily controlled, and a low ferri-magnetic resonance half line width and an acceptable curie temperature are ensured. The magnetic ceramic composition for microwave devices includes yttrium oxide (Y.sub.2 O.sub.3), iron oxide (Fe.sub.2 O.sub.3), tin oxide (SnO.sub.2), aluminum oxide (Al.sub.2 O.sub.3) and a calcium supply source. The magnetic ceramics for the microwave devices are manufactured by carrying out a forming and a sintering after mixing: yttrium oxide, iron oxide, tin oxide, aluminum oxide and calcium carbonate (or calcium oxide) based on a formula shown below. It has a saturation magnetization of 100-1,800 G at the normal temperature, a temperature coefficient for the saturation magnetization of 0.2%/.degree.C., and a ferri-magnetic resonance half line width of less than 60 Oe, Y.sub.3-x Ca.sub.x/2 Sn.sub.x/2 Fe.sub.5-y Al.sub.y O.sub.12 where 0.1.ltoreq.x.ltoreq.1, and 0.1.ltoreq.y.ltoreq.1.5.
Abstract translation:公开了一般用户和工业电子设备中使用的微波带装置的材料。 特别地,公开了一种用于微波器件的磁性陶瓷组合物,用于微波器件的磁性陶瓷及其制备方法,其中可以容易地控制饱和磁化强度,并且低铁磁共振半线宽度和 确保可接受的居里温度。 用于微波器件的磁性陶瓷组合物包括氧化钇(Y 2 O 3),氧化铁(Fe 2 O 3),氧化锡(SnO 2),氧化铝(Al 2 O 3)和钙供应源。 用于微波器件的磁性陶瓷通过以下所示的配方在混合之后进行成形和烧结来制造:氧化钇,氧化铁,氧化锡,氧化铝和碳酸钙(或氧化钙)。 在正常温度下饱和磁化强度为100-1800G,饱和磁化强度的温度系数为0.2%/℃,铁磁共振半线宽度小于60Oe,Y3-xCax / 2Snx / 2Fe5-yAlyO12,其中0.1≤x≤1,0.1≤y≤1.5。