Methods and apparatus for thermal management of an integrated circuit die
    55.
    发明授权
    Methods and apparatus for thermal management of an integrated circuit die 有权
    集成电路管芯的热管理方法和装置

    公开(公告)号:US06980918B2

    公开(公告)日:2005-12-27

    申请号:US10821292

    申请日:2004-04-09

    IPC分类号: G01K7/01 G06F1/20 G06F15/00

    摘要: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.

    摘要翻译: 集成的片上热管理系统,提供IC器件的闭环温度控制和执行IC器件热管理的方法。 热管理系统包括温度检测元件,功率调制元件,控制元件和可见度元件。 温度检测元件包括用于检测管芯温度的温度传感器。 功率调制元件可以通过直接降低IC器件的功耗来限制IC器件执行指令的速度,通过限制由IC器件执行的指令的数量,或者通过 这些技术的组合。 控制元件允许控制热管理系统的行为,并且可见性元件允许外部设备监视热管理系统的状态。

    Programmable thermal management of an integrated circuit die
    57.
    发明授权
    Programmable thermal management of an integrated circuit die 有权
    集成电路管芯的可编程热管理

    公开(公告)号:US06393374B1

    公开(公告)日:2002-05-21

    申请号:US09281237

    申请日:1999-03-30

    IPC分类号: G01N2500

    摘要: A method and apparatus for power throttling to manage the temperature of an IC. A temperature sensor is manufactured on the same die as the IC components. The temperature sensor generates an output in response to junction temperature of the IC components. A state machine is coupled to receive the output of the temperature sensor and to provide power reduction functions in response to the temperature sensor output exceeding a maximum thermal value. The maximum thermal value is less than the maximum allowable temperature of the IC corresponding to maximum power consumption. Thus, the invention reduces power consumption at a thermal value lower that a potentially catastrophic value rather than shutting down the IC when catastrophic failure is imminent.

    摘要翻译: 用于节电控制IC的温度的方法和装置。 温度传感器在与IC部件相同的芯片上制造。 温度传感器响应于IC组件的结温而产生输出。 状态机被耦合以接收温度传感器的输出并且响应于温度传感器输出超过最大热值而提供功率降低功能。 最大热值小于对应于最大功耗的IC的最大允许温度。 因此,本发明降低了低于潜在灾难性值的热值的功率消耗,而不是在灾难性故障即将发生时关闭IC。

    Method and apparatus for dynamically adjusting the power consumption of
a circuit block within an integrated circuit
    58.
    发明授权
    Method and apparatus for dynamically adjusting the power consumption of a circuit block within an integrated circuit 失效
    用于动态调整集成电路内的电路块的功耗的方法和装置

    公开(公告)号:US5781783A

    公开(公告)日:1998-07-14

    申请号:US672544

    申请日:1996-06-28

    IPC分类号: G06F1/32 G06F9/30 G06F9/38

    摘要: A method of dynamically adjusting the power consumption of a circuit block within an integrated circuit includes the step of incrementing a count total maintained by a counter on the occurrence of a first type of trigger event. The occurrence of a predetermined event is detected when the count total maintained by the counter equals, or transcends, a predetermined threshold value. The predetermined event provides a speculative indication of a future state of activity of the circuit block by reason of a predicted proximity of the predetermined event to the future state of activity of the circuit block. The power consumption of the circuit block is adjusted in response to the occurrence of the predetermined event.

    摘要翻译: 动态地调整集成电路内的电路块的功耗的方法包括在发生第一类型的触发事件时递增由计数器维持的计数总计的步骤。 当由计数器维持的计数总计等于或超过预定阈值时,检测到预定事件的发生。 由于预定事件与电路块的活动的未来状态的预测接近度,预定事件提供电路块的未来活动状态的推测指示。 响应于预定事件的发生,调整电路块的功耗。

    Mechanisms for enabling power management of embedded dynamic random access memory on a semiconductor integrated circuit package
    60.
    发明授权
    Mechanisms for enabling power management of embedded dynamic random access memory on a semiconductor integrated circuit package 有权
    用于在半导体集成电路封装上实现嵌入式动态随机存取存储器的电源管理的机制

    公开(公告)号:US08879346B2

    公开(公告)日:2014-11-04

    申请号:US13341864

    申请日:2011-12-30

    摘要: Power management of an embedded dynamic random access memory (eDRAM) by receiving an eDRAM power state transition event and determining both the current power state of the eDRAM and the next power state of the eDRAM from the power states of: a power-on state, a power-off state, and a self-refresh state. Using the current power state and the next power state to determine whether a power state transition is required, and, in the case that a power state transition is required, transition the eDRAM to the next power state. Power management is achieved because transitioning to a power-off state or self-refresh state reduces the amount of power consumed by the eDRAM as compared to the power-on state.

    摘要翻译: 通过接收eDRAM功率状态转换事件并且从以下功率状态确定eDRAM的当前功率状态和eDRAM的下一个功率状态的功率管理来实现嵌入式动态随机存取存储器(eDRAM)的电源管理:电源接通状态, 断电状态和自刷新状态。 使用当前功率状态和下一个功率状态来确定是否需要功率状态转换,并且在需要功率状态转换的情况下,将eDRAM转换到下一个功率状态。 实现电源管理是因为转换到掉电状态或自刷新状态可以减少与上电状态相比eDRAM消耗的功耗。