公开(公告)号：US08120150B2

公开(公告)日：2012-02-21

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。

公开(公告)号：US08106502B2

公开(公告)日：2012-01-31

申请号：US12272751

申请日：2008-11-17

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated circuit over the first planar terminal; connecting the first integrated circuit with the external interconnect; and forming an encapsulation over the first planar terminal covering the first integrated circuit and with the external interconnect extending from a non-horizontal side of the encapsulation and with the first planar terminal coplanar with the adjacent portion of the encapsulation exposing the first planar terminal.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成外部互连; 形成与所述外部互连相邻并且与所述外部互连的一部分非平面的第一平面端子; 在所述第一平面端子上安装第一集成电路; 将第一集成电路与外部互连连接; 以及在覆盖所述第一集成电路的所述第一平面端子上以及从所述封装的非水平侧延伸的所述外部互连以及与所述第一平面端子的所述封装的相邻部分共面的第一平面端子形成封装。

公开(公告)号：US07763493B2

公开(公告)日：2010-07-27

申请号：US11768730

申请日：2007-06-26

申请人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes a die pad with leads; attaching an integrated circuit over the die pad; attaching a connector to the integrated circuit and the leads; and forming an encapsulant, over the integrated circuit, having a connection cavity over the leads leaving an exposed portion of the leads.

摘要翻译： 集成电路封装系统包括具有引线的管芯焊盘; 在芯片焊盘上附加集成电路; 将连接器连接到集成电路和引线; 以及在所述集成电路上形成密封剂，所述密封剂在所述引线上具有连接空腔，留下所述引线的暴露部分。

公开(公告)号：US20100140764A1

公开(公告)日：2010-06-10

申请号：US12328764

申请日：2008-12-04

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/85191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.

摘要翻译： 一种线引线封装系统的制造方法包括：提供具有沿芯片附接板周边分布的焊盘延伸部的管芯附接焊盘，提供围绕管芯附接焊盘的引线管，将半导体管芯附接到管芯附着焊盘 其中所述半导体管芯大于所述管芯附接焊盘，以及在所述半导体管芯和引线管之间以及所述半导体管芯和所述焊盘延伸部之间连接接合线。

公开(公告)号：US07723840B2

公开(公告)日：2010-05-25

申请号：US11759227

申请日：2007-06-07

申请人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

发明人： Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/12

CPC分类号： H01L23/49548 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming an external interconnect, providing a contoured integrated circuit die having both an extension and a base portion with the extension extending beyond the base portion, placing the contoured integrated circuit die with the base portion coplanar with the external interconnect and the extension overhanging the external interconnect, connecting the contoured integrated circuit die and the external interconnect, and forming a package encapsulation over the contoured integrated circuit die and the external interconnect with both partially exposed.

摘要翻译： 提供了一种集成电路封装系统，包括形成外部互连，提供具有延伸部和基部部分的成型集成电路管芯，延伸部延伸超出基部部分，将成形的集成电路管芯与底部共面与外部 互连和伸出外部互连的延伸部分，连接轮廓化的集成电路管芯和外部互连，以及在轮廓化的集成电路管芯和外部互连部分暴露部分之间形成封装封装。

公开(公告)号：US20100052131A1

公开(公告)日：2010-03-04

申请号：US12198491

申请日：2008-08-26

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L23/00

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/24 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24247 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An integrated circuit package system includes forming a first external interconnect having both a first side and a second side that is an opposing side to the first side; forming a first encapsulation around a first integrated circuit and the first external interconnect with the first side, the second side, and the first active side of the first integrated circuit exposed; forming a planar interconnect between the first active side and the second side; forming a second encapsulation covering the planar interconnect and the first active side; connecting a second integrated circuit over the first integrated circuit and the first side; and forming a top encapsulation over the second integrated circuit.

摘要翻译： 一种集成电路封装系统，包括形成第一外部互连，其具有与第一侧相对的第一侧和第二侧; 在第一集成电路周围形成第一封装，并且暴露第一集成电路的第一侧，第二侧和第一有源侧的第一外部互连; 在所述第一主动侧和所述第二侧之间形成平面互连; 形成覆盖所述平面互连和所述第一有源侧的第二封装; 连接第一集成电路和第一侧上的第二集成电路; 以及在第二集成电路上形成顶部封装。

公开(公告)号：US20090294935A1

公开(公告)日：2009-12-03

申请号：US12131037

申请日：2008-05-30

申请人： Lionel Chien Hui Tay ,  Seng Guan Chow ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Seng Guan Chow ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package system includes: providing a leadframe having inner frame bars, outer frame bars, a die pad, tiebars, and rows of leads, the inner frame bars being coplanar with outer frame bars; attaching a semiconductor chip to the die pad; attaching bond wires between the semiconductor chip and the rows of leads; encapsulating the semiconductor chip, the bond wires, the inner frame bars, the outer frame bars, the die pad, the tiebars, and the rows of leads in an encapsulant; cutting a groove to remove the inner frame bars; and singulating the leadframe and the encapsulant to remove the outer frame bars.

摘要翻译： 半导体封装系统包括：提供具有内框架条，外框架条，管芯焊盘，拉杆和一排引线的引线框架，内框架杆与外框架杆共面; 将半导体芯片附接到芯片焊盘; 在半导体芯片和引线列之间附加接合线; 在封装材料中封装半导体芯片，接合线，内框架条，外框架条，管芯焊盘，拉杆和引线列; 切割凹槽以移除内框架条; 并且分离引线框和密封剂以去除外框架条。

公开(公告)号：US20090289335A1

公开(公告)日：2009-11-26

申请号：US12124793

申请日：2008-05-21

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Guruprasad Badakere Govindaiah

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Guruprasad Badakere Govindaiah

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield connected to the tie bar; and encapsulating the integrated circuit and the shield. An integrated circuit package system also includes: forming a lead and a support structure with substantially the same material as the lead and elevated above the lead; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield on the support structure; and encapsulating the integrated circuit and the shield.

摘要翻译： 集成电路封装系统包括：提供与其相邻的连接杆和引线; 连接集成电路和引线; 将屏蔽件安装在集成电路上，屏蔽层连接到连接杆上; 并封装集成电路和屏蔽。 集成电路封装系统还包括：形成具有与引线基本上相同的材料并在引线上方升高的引线和支撑结构; 连接集成电路和引线; 将集成电路上的屏蔽件与屏蔽件安装在支撑结构上; 并封装集成电路和屏蔽。

公开(公告)号：US20090166845A1

公开(公告)日：2009-07-02

申请号：US11965550

申请日：2007-12-27

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L23/495 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.

摘要翻译： 一种集成电路封装系统，包括：形成管芯焊盘，其中所述管芯焊盘在拐角处具有连接杆; 形成引线，其中引线连接到连接杆; 将集成电路管芯连接到管芯焊盘; 以及在所述集成电路裸片上形成具有边缘的封装，所述引线从所述边缘延伸出并超过所述边缘。

公开(公告)号：US20090032918A1

公开(公告)日：2009-02-05

申请号：US11833898

申请日：2007-08-03

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Jr Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Jr Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.

摘要翻译： 集成电路封装系统包括：形成管芯附接焊盘，外部互连和内部互连，使芯片附着焊盘超出外部互连; 将集成电路装置安装在芯片附接板上; 将集成电路装置连接到内部互连和外部互连; 将所述集成电路器件封装在所述管芯附接焊盘上; 在外部互连下方附加外部互连; 以及将电路装置附接在所述管芯附接桨下方并且横向延伸超过所述管芯附着桨的相对侧。