公开(公告)号：US20090072366A1

公开(公告)日：2009-03-19

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。

公开(公告)号：US08120150B2

公开(公告)日：2012-02-21

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。

公开(公告)号：US20090002961A1

公开(公告)日：2009-01-01

申请号：US11769520

申请日：2007-06-27

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

IPC分类号： H05K7/00 ,  H01L23/495

CPC分类号： H01L23/49551 ,  H01L23/047 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04R31/00 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.

摘要翻译： 一种包装系统，包括：形成端子引线; 通过用化合物部分地封装端子引线来配置空腔; 在空腔中附接集成电路器件，微机电系统，微机械系统或其组合; 以及将盖结合到用于封闭空腔的端子引线。

公开(公告)号：US20100140764A1

公开(公告)日：2010-06-10

申请号：US12328764

申请日：2008-12-04

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/85191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.

摘要翻译： 一种线引线封装系统的制造方法包括：提供具有沿芯片附接板周边分布的焊盘延伸部的管芯附接焊盘，提供围绕管芯附接焊盘的引线管，将半导体管芯附接到管芯附着焊盘 其中所述半导体管芯大于所述管芯附接焊盘，以及在所述半导体管芯和引线管之间以及所述半导体管芯和所述焊盘延伸部之间连接接合线。

公开(公告)号：US08203214B2

公开(公告)日：2012-06-19

申请号：US11769691

申请日：2007-06-27

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/49537 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package in package system includes a package in package lead with a package in package lead surface substantially planar, attaching a first integrated circuit package having a first encapsulant surface substantially coplanar with the package in package lead surface, attaching a second integrated circuit near the first integrated circuit package, and forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit.

摘要翻译： 封装系统中的集成电路封装包括封装在封装引线中，封装在封装引线表面上基本上是平面的，将第一集成电路封装与第一封装表面大致共面与封装引线表面基本共面，将第二集成电路附近 第一集成电路封装，以及在第一集成电路封装和第二集成电路上形成封装封装的封装。

公开(公告)号：US08493748B2

公开(公告)日：2013-07-23

申请号：US11769520

申请日：2007-06-27

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

IPC分类号： H05K5/02 ,  H05K7/18

CPC分类号： H01L23/49551 ,  H01L23/047 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04R31/00 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.

摘要翻译： 一种包装系统，包括：形成端子引线; 通过用化合物部分地封装端子引线来配置空腔; 在空腔中附接集成电路器件，微机电系统，微机械系统或其组合; 以及将盖结合到用于封闭空腔的端子引线。

公开(公告)号：US08362601B2

公开(公告)日：2013-01-29

申请号：US12328764

申请日：2008-12-04

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/85191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.

摘要翻译： 一种线引线封装系统的制造方法包括：提供具有沿芯片附接板周边分布的焊盘延伸部的管芯附接焊盘，提供围绕管芯附接焊盘的引线管，将半导体管芯附接到管芯附着焊盘 其中所述半导体管芯大于所述管芯附接焊盘，以及在所述半导体管芯和引线管之间以及所述半导体管芯和所述焊盘延伸部之间连接接合线。

公开(公告)号：US20090001563A1

公开(公告)日：2009-01-01

申请号：US11769691

申请日：2007-06-27

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/49537 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package in package system includes a package in package lead with a package in package lead surface substantially planar, attaching a first integrated circuit package having a first encapsulant surface substantially coplanar with the package in package lead surface, attaching a second integrated circuit near the first integrated circuit package, and forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit.

摘要翻译： 封装系统中的集成电路封装包括封装在封装引线中，封装在封装引线表面上基本上是平面的，将第一集成电路封装与第一封装表面大致共面与封装引线表面基本共面，将第二集成电路附近 第一集成电路封装，以及在第一集成电路封装和第二集成电路上形成封装封装的封装。

公开(公告)号：US20090085178A1

公开(公告)日：2009-04-02

申请号：US11864826

申请日：2007-09-28

申请人： Jong-Woo Ha ,  Koo Hong Lee ,  Soo Won Lee ,  JuHyun Park ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

发明人： Jong-Woo Ha ,  Koo Hong Lee ,  Soo Won Lee ,  JuHyun Park ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/495 ,  H01L23/02

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.

摘要翻译： 一种集成电路封装系统，包括：形成具有开口的基座结构; 将基座结构装置安装在开口中; 将集成电路装置连接在所述基座结构装置上; 以及在所述基座结构，所述基座结构装置和所述集成电路装置上模制密封剂。

公开(公告)号：US20080303123A1

公开(公告)日：2008-12-11

申请号：US12134179

申请日：2008-06-05

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Jeffrey D. Punzalan

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Jeffrey D. Punzalan

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.

摘要翻译： 集成电路封装系统包括：提供引线端子; 在引线端子附近形成虚拟引线; 将基座集成电路定位在引线端子和虚拟引线附近; 将管芯连接器连接到基底集成电路和虚拟引线; 在基础集成电路上安装可堆叠集成电路; 并将另一个模具连接器连接到可堆叠集成电路和虚拟引线。