-
51.发明授权Sensor semiconductor device and fabrication method of the sensor semiconductor device 有权传感器半导体器件及传感器半导体器件的制造方法公开(公告)号：US07446307B2
公开(公告)日：2008-11-04
申请号：US11373723
申请日：2006-03-10
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14632 , H01L27/14687 , H01L2224/24225 , H01L2224/97 , H01L2224/82
摘要： A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.
摘要翻译： 提供了一种传感器半导体器件及其制造方法。 制造方法包括将传感器芯片安装在基板的表面上; 在传感器芯片上形成透明盖; 在基板上形成电介质层和电路层，其中传感器芯片通过电路层与基板电连接，透明盖从电介质层露出，使得光可透过透明盖到达传感器区域 的传感器芯片，并允许传感器芯片工作; 以及在所述基板的另一表面上植入多个焊球，以将所述传感器芯片电连接到外部设备。 可以成本有效地制造传感器半导体器件，并且可以避免现有技术的电路破裂和已知的良好裸片（KGD）问题。
-
52.发明授权Method for fabricating wafer level semiconductor package with build-up layer 有权用于制造具有堆积层的晶片级半导体封装的方法公开(公告)号：US07445957B2
公开(公告)日：2008-11-04
申请号：US11580560
申请日：2006-10-12
CPC分类号： H01L21/6835 , H01L21/568 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/20 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/97 , H01L2924/01029 , H01L2924/01033 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/351 , H01L2924/3511 , H01L2224/82 , H01L2924/00
摘要： A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.
摘要翻译： 提供具有积层的晶片级半导体封装，其包括具有用于接收其中的半导体芯片的通孔的玻璃框架，填充在形成在半导体芯片和玻璃框架之间的空间内的低模量缓冲材料， 形成在所述玻璃框架和所述半导体芯片上的堆积层，使得所述积层层电连接到所述半导体芯片，以及安装在所述积层层上的多个导电元件，使得所述半导体芯片电连接 到外部设备。 通过使用玻璃框架和低模量缓冲材料，由此获得的晶片级半导体封装没有翘曲，芯片裂纹和分层问题，并且其可靠性得到提高。 还提供了一种用于制造晶片级半导体封装的方法。
-
53.发明申请Heat dissipation unit and a semiconductor package that has the heat dissipation unit 审中-公开散热单元和具有散热单元的半导体封装公开(公告)号：US20080246142A1
公开(公告)日：2008-10-09
申请号：US12080798
申请日：2008-04-04
IPC分类号： H01L23/367
CPC分类号： H01L23/4334 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.
摘要翻译： 公开了一种散热单元和具有该散热单元的半导体封装。 半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起 从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。
-
公开(公告)号：US20080176358A1
公开(公告)日：2008-07-24
申请号：US12009866
申请日：2008-01-23
IPC分类号： H01L21/56
CPC分类号： H01L25/0657 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/4945 , H01L2224/73265 , H01L2224/83136 , H01L2224/83191 , H01L2224/838 , H01L2224/92247 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/07802 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a fabrication method of a multi-chip stacking structure. The method includes steps of: stacking the first chips on the chip carrier in a step-like manner to form a first chip module; electrically connecting the first chip module to the chip carrier by a plurality of first bonding wires; stacking the second chips on the first chip module in step-like manner to form a second chip module, wherein a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive layer with the bottom chip deviated from the top chip horizontally in a direction toward the first bonding wires; and electrically connecting the bond pads of the second chip module to the chip carrier by a plurality of second bonding wires.
摘要翻译： 本发明提供一种多芯片堆叠结构的制造方法。 该方法包括以下步骤：以阶梯状方式堆叠芯片载体上的第一芯片以形成第一芯片模块; 通过多个第一接合线将第一芯片模块电连接到芯片载体; 在第一芯片模块上堆叠第二芯片以形成第二芯片模块，其中第二芯片模块的底部芯片通过粘合剂层堆叠在第一芯片模块的顶部芯片上，底部芯片偏离 从顶部芯片沿着朝向第一接合线的方向水平地; 以及通过多个第二接合线将所述第二芯片模块的所述接合焊盘电连接到所述芯片载体。
-
55.发明申请公开(公告)号：US20080166831A1
公开(公告)日：2008-07-10
申请号：US12048079
申请日：2008-03-13
IPC分类号： H01L31/18
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/24226
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。
-
公开(公告)号：US20070272994A1
公开(公告)日：2007-11-29
申请号：US11838723
申请日：2007-08-14
IPC分类号： H01L31/0203
CPC分类号： H01L27/14683 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14634 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/14 , H01L2924/00
摘要： A sensor semiconductor device is proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.
摘要翻译： 提出了一种传感器半导体器件。 多个金属凸块和传感器芯片安装在基板上。 在基板上形成电介质层和电路层，其中电路层电连接到金属凸块和传感器芯片。 因此，传感器芯片经由电路层和金属凸块电连接到基板。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 多个焊球安装在基板的表面上，无需安装传感器芯片，用于将传感器芯片电连接到外部设备。
-
公开(公告)号：US07205485B2
公开(公告)日：2007-04-17
申请号：US10831247
申请日：2004-04-23
IPC分类号： H05K1/16
CPC分类号： H05K3/305 , H05K3/28 , H05K3/284 , H05K2201/0187 , H05K2201/09072 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask layer covers the core layer and fills the openings, with recessed portions formed at positions of the solder mask layer on the openings during curing of the solder mask layer. When a small passive component is mounted on the printed circuit board, a space is formed between the bottom of the passive component and the recessed portions of the solder mask layer. An encapsulating resin can flow into the space to form an insulating barrier between the bond pads to prevent bridging between the bond pads and short circuiting of the passive component.
摘要翻译： 提供一种印刷电路板及其制造方法。 制备具有芯层和其上的多对接合焊盘的衬底，其中在每对接合焊盘之间的芯层上形成有至少一个开口。 焊接掩模层覆盖芯层并填充开口，其中凹陷部分形成在焊料掩模层固化期间在开口上的焊料掩模层的位置处。 当将小的无源部件安装在印刷电路板上时，在无源部件的底部和焊料掩模层的凹部之间形成空间。 封装树脂可以流入空间，以在接合焊盘之间形成绝缘屏障，以防止接合焊盘之间的桥接和无源部件的短路。
-
公开(公告)号：US20070035655A1
公开(公告)日：2007-02-15
申请号：US11200089
申请日：2005-08-10
申请人： Chang-Fu Chen , Chih-Ming Huang , Yi-Cheng Su , Chien-Cheng Chen , Chih-Hao Chen , Tomas-Gavin Melia
发明人： Chang-Fu Chen , Chih-Ming Huang , Yi-Cheng Su , Chien-Cheng Chen , Chih-Hao Chen , Tomas-Gavin Melia
IPC分类号： H04N5/225
CPC分类号： H04N1/04 , H04N2201/0081 , H04N2201/0436 , H04N2201/0446 , H04N2201/045
摘要： A multi-functional scanning camera comprises a rear cover; a front cover combined to the rear cover; a main back casing; a left telescopic rod; a right telescopic rod; a left fixing unit and a right fixing unit locked to two sides of the back casing; a main front casing assembled to a main back casing; and a lower side of a rear end of the main back casing being installed with a left rotary retaining seat and a right rotary retaining seat. The scanning operation will not affect the operation of network operation. The scanner is extendable and foldable. The plurality of light emitting diodes serves to illuminate the documents located below and the adjusting button serves to adjust the illumination so that the words on the document are shown clearly.
摘要翻译： 多功能扫描照相机包括后盖; 一个前盖组合在后盖上; 主后套 左伸缩杆 右伸缩杆 左固定单元和右固定单元，锁定在后壳的两侧; 组装到主后壳的主前壳; 并且主后壳的后端的下侧安装有左旋转保持座和右旋转保持座。 扫描操作不会影响网络运行。 扫描仪是可扩展和可折叠的。 多个发光二极管用于照亮位于下方的文件，并且调节按钮用于调节照明，使得文档上的单词被清楚地示出。
-
公开(公告)号：US20060223216A1
公开(公告)日：2006-10-05
申请号：US11208269
申请日：2005-08-18
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L27/14618 , H01L24/97 , H01L25/167 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
摘要翻译： 提出了一种传感器模块结构及其制造方法。 提供了包括多个芯片载体的芯片载体模块板，每个芯片载体具有第一表面和第二表面。 至少一个半导体芯片安装在每个芯片载体的第一表面上并电连接到每个芯片载体的第一表面。 形成用于完全封装半导体芯片和芯片载体的第一表面的封装体。 执行单个处理以形成与半导体芯片集成的单个封装单元。 传感器芯片，相应的透镜套件和柔性印刷电路板（FPC）板安装在每个芯片载体的第二表面上，其中传感器芯片和FPC基板电连接到芯片载体。 这提供了以简单的工艺制造的传感器模块结构，低成本和高产量。
-
公开(公告)号：USD529031S1
公开(公告)日：2006-09-26
申请号：US29210201
申请日：2004-07-27
-
-
-
-
-
-
-
-
-
搜索结果
120 条记录 (耗时 0.02 秒)