摘要:
The present invention is a storage element for controlling a logic circuit and a logic device having a plurality of storage elements. The storage element has a first and a second non-volatile memory cells connected in series at an output node. Each of the first and second non-volatile memory cells is for storing a state opposite to the other. A demultiplexer has an input, a switched input and two outputs. The output node is connected to the input of the demultiplexer. One of the outputs is used to control the logic circuit. The other output is connected to a bit line which is connected to a sense amplifier. Finally, the switched input receives a switch signal and outputs the signal from the output node to either the one output or the other output.
摘要:
A first embodiment of a word line voltage boosting circuit for use with an array of non-volatile memory cells has a capacitor, having two ends, connected to the word line. One end of the capacitor is electrically connected to the word line. The other end of the capacitor is electrically connected to a first voltage source. The word line is also connected through a switch to a second source voltage source. A sequencing circuit activates the switch such that the word line is connected to the second voltage source, and the other end of the capacitor is not connected to the first voltage source. Then the sequencing circuit causes the switch to disconnect the word line from the second voltage source, and connect the second end of the capacitor to the first voltage source. The alternate switching of the connection boosts the voltage on the word line. In a second embodiment, a first word line is electrically connected to a first switch to a first voltage source. An adjacent word line, capacitively coupled to the first word line, is electrically connected to a second switch to a second voltage source. A sequencing circuit activates the first switch and the second switch such that the first word line is connected to the first voltage source, and the second word line is disconnected from the second voltage source. Then the sequencing circuit causes the first switch to disconnect the first word line from the first voltage source, and causes the second word line to be electrically connected to the second voltage source. The alternate switching of the connection boosts the voltage on the first word line, caused by its capacitive coupling to the second word line. A boosted voltage on the word line may be used to improve cycling and yield, where the memory cells of the array are of the floating gate type and erase through the mechanism of Fowler-Nordheim tunneling from the floating gate to a control gate which is connected to the word line.
摘要:
A method of trimming down the volume of a semiconductor resistor element using electrical resistance feedback. After forming conductive material disposed between a pair of electrodes, a voltage is applied to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion of the conductive material. By reducing the volume of the conductive material, its resistance is increased. The application of the voltage is ceased once the desired dimensions (and thus resistivity) of the conductive material is reached. The resulting semiconductor resistor element could have a fixed resistance, or could have a variable resistance (by using phase change memory material).
摘要:
A method of forming an array of floating gate memory cells, and an array formed thereby, wherein a trench is formed into a surface of a semiconductor substrate. The source region is formed underneath the trench, the drain region is formed along the substrate surface, and the channel region therebetween includes a first portion extending vertically along the trench sidewall and a second portion extending horizontally along the substrate surface. The floating gate is disposed in the trench adjacent to and insulated from the channel region first portion. The control gate is disposed over and insulated from the channel region second portion. The trench sidewall meets the substrate surface at an acute angle to form a sharp edge. The channel region second portion extends from the second region in a direction toward the sharp edge and the floating gate to define a path for programming the floating gate with electrons via hot electron injection.
摘要:
A method of forming an array of floating gate memory cells, and an array formed thereby, wherein a trench is formed into a surface of a semiconductor substrate. The source region is formed underneath the trench, the drain region is formed along the substrate surface, and the channel region therebetween includes a first portion extending vertically along the trench sidewall and a second portion extending horizontally along the substrate surface. The floating gate is disposed in the trench adjacent to and insulated from the channel region first portion. The control gate is disposed over and insulated from the channel region second portion. The trench sidewall meets the substrate surface at an acute angle to form a sharp edge. The channel region second portion extends from the second region in a direction toward the sharp edge and the floating gate to define a path for programming the floating gate with electrons via hot electron injection.
摘要:
A nonvolatile reprogrammable switch for use in a PLD or FPGA has a nonvolatile memory cell connected to the gate of an MOS transistor with the terminals of the MOS transistor connected to the source of the signal and to the circuit. The nonvolatile memory cell is of a split gate type having a first region and a second region, with a channel therebetween. The cell has a floating gate positioned over a first portion of the channel, which is adjacent to the first region and a control gate positioned over a second portion of the channel, which is adjacent to the second region. The second region is connected to the gate of the MOS transistor. The cell is programmed by injecting electrons from the channel onto the floating gate by hot electron injection mechanism. The cell is erased by Fowler-Nordheim tunneling of the electrons from the floating gate to the control gate. As a result, no high voltage is ever applied to the second region during program or erase. In addition a MOS FET transistor connects the gate of the MOS transistor to a voltage when the non-volatile memory cell is turned off. The floating gate of the non-volatile memory cell is connected to the gate of the MOS FET transistor.
摘要:
A phase change memory device, and method of making the same, that includes contact holes formed in insulation material that extend down to and exposes source regions for adjacent FET transistors. Spacer material is disposed in the holes with surfaces that define openings each having a width that narrows along a depth of the opening. Lower electrodes are disposed in the holes. A layer of phase change material is disposed along the spacer material surfaces and along at least a portion of the lower electrodes. Upper electrodes are formed in the openings and on the phase change material layer. Voids are formed into the spacer material to impede heat from the phase change material from conducting through the insulation material. For each contact hole, the upper electrode and phase change material layer form an electrical current path that narrows in width as the current path approaches the lower electrode.
摘要:
A nonvolatile reprogrammable switch for use in a PLD or FPGA has a nonvolatile memory cell connected to the gate of an MOS transistor with the terminals of the MOS transistor connected to the source of the signal and to the circuit. The nonvolatile memory cell is of a split gate type having a floating gate positioned over a first portion of the channel and a control gate positioned over a second portion of the channel with electrons being injected onto the floating gate by hot electron injection mechanism. The nonvolatile memory cell is erased by the action of the electrons from the floating gate being tunneled through Fowler-Nordheim tunneling onto the control gate, which is adjacent to the second region. As a result, no high voltage is ever applied to the second region during program or erase. Thus, the nonvolatile memory cell with the second region can be connected directly to the gate of the MOS transistor, which together therewith forms a nonvolatile reprogrammable switch.
摘要:
A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end, a floating gate insulated from a first portion of the channel region and adjacent to the second region, a first control gate adjacent to the floating gate and insulated therefrom, and insulated from a second portion of the channel region, and adjacent to the first region, a second control gate capacitively coupled to the floating gate, and positioned over the floating gate. A method programming the cell to one of a plurality of MLC states comprises applying a current source to the first region. A first voltage is applied to the first control gate sufficient to turn on the second portion of the channel region. A second voltage is applied to the second region, sufficient to cause electrons to flow from the first region towards the second region. A third voltage is applied to the second control gate sufficient to cause electrons in the channel region to be injected onto the floating gate. The third voltage is applied uninterrupted until the floating gate is programmed to the one state.
摘要:
A first embodiment of an Electrostatic Discharge (ESD) structure for an integrated circuit for protecting the integrated circuit from an ESD signal, has a substrate of a first conductivity type. The substrate has a top surface. A first region of a second conductivity type is near the top surface and receives the ESD signal. A second region of the second conductivity type is in the substrate, separated and spaced apart from the first region in a substantially vertical direction. A third region of the first conductivity type, heavier in concentration than the substrate, is immediately adjacent to and in contact with the second region, substantially beneath the second region. In a second embodiment, a well of a second conductivity type is provided in the substrate of the first conductivity type. The well has a top surface. A first region of the second conductivity type is near the top surface. A second region of the second conductivity type is in the well, substantially along the bottom of the well. A third region of the first conductivity type, is immediately adjacent to and in contact with the second region, substantially beneath the second region. A fourth region of the first conductivity type is in the well, along the top surface thereof, and spaced apart from the first region. The first region and the fourth region receive the ESD signal.