Automatic developing apparatus
    54.
    发明授权
    Automatic developing apparatus 失效
    自动显影装置

    公开(公告)号:US4806962A

    公开(公告)日:1989-02-21

    申请号:US122535

    申请日:1987-11-12

    IPC分类号: G03D3/06

    CPC分类号: G03D3/06

    摘要: An automatic developing apparatus for developing photosensitive materials, wherein a water supply tank for storing water used to dilute or dissolve processing agents and a waste fluid tank for storing waste fluids after the processes thereof are housed therein. The waste fluid tank is removably incorporated in the apparatus.

    摘要翻译: 一种用于显影感光材料的自动显影装置,其中容纳用于储存用于稀释或溶解处理剂的水的供水箱和用于在其处理之后储存废液的废液箱。 废液箱可移除地结合在装置中。

    Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof
    55.
    发明申请
    Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof 审中-公开
    纤维包含热固性聚酰胺树脂组合物,无纺织物及其生产方法

    公开(公告)号:US20120178332A1

    公开(公告)日:2012-07-12

    申请号:US13395972

    申请日:2010-10-22

    摘要: The present invention relates to a fiber comprising a heat curable polyamide resin composition containing both a) a phenolic hydroxy group-containing polyamide and b) an epoxy resin having two or more epoxy groups in one molecule, a nanofiber comprising said resin composition obtained by electrospinning method, a nonwoven fabric obtained by applying heat treatment to a laminate of said nanofiber, a method for producing said nanofiber by electrospinning method and a heat curable polyamide resin composition for fiber. A nonwoven fabric can be obtained only by subjecting a deposit of the nanofiber obtained by electrospinning method to heat treatment, nanofibers in the obtained nonwoven fabric are bonded to each other by heat-curing, and the nonwoven fabric has such characteristics that its mechanical strength, heat resistance and chemical resistance are excellent and that it has a high strength.

    摘要翻译: 本发明涉及包含含有a)含酚羟基的聚酰胺和b)在一分子中具有两个或更多个环氧基的环氧树脂的热固化性聚酰胺树脂组合物的纤维,包含通过静电纺丝得到的所述树脂组合物的纳米纤维 方法,通过对所述纳米纤维的层压体进行热处理获得的无纺布,通过静电纺丝法生产所述纳米纤维的方法和用于纤维的热固化性聚酰胺树脂组合物。 通过将通过静电纺丝法得到的纳米纤维的沉积物进行热处理,可以得到无纺布,通过热固化将得到的无纺布中的纳米纤维彼此接合,无纺布的机械强度, 耐热性和耐化学性优异,强度高。

    Rubber-modified polyamide resin, epoxy resin composition and cured product thereof
    56.
    发明授权
    Rubber-modified polyamide resin, epoxy resin composition and cured product thereof 有权
    橡胶改性聚酰胺树脂,环氧树脂组合物及其固化物

    公开(公告)号:US08114940B2

    公开(公告)日:2012-02-14

    申请号:US12083529

    申请日:2006-10-26

    IPC分类号: C08G81/00

    摘要: The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2), —(CH2—CH═CH—CH2)X—  (B-1) —(CH2—CH═CH—CH2)Y—(CH2—CH(CN))Z—  (B-2) (wherein, each of x, y and z is an average value and 0.01≦z/(y+z)≦0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.

    摘要翻译: 本发明涉及一种含酚羟基的橡胶改性聚酰胺树脂,其分子中含有具有由下式(A)表示的结构的含酚羟基的芳族聚酰胺链段(其中m和n分别为 平均值,Ar表示二价芳族基团)和选自下式(B-1)或(B-2)的丁二烯(共)聚合物片段, - (CH 2 -CH = CH-CH 2) 1) - (CH 2 -CH = CH-CH 2)Y-(CH 2 -CH(CN))Z-(B-2)(其中,x,y和z各自为平均值,0.01≦̸ z /( y + z)≦̸ 0.13,x表示5〜200的正数,y + z为10〜200的正数),以及含有所述树脂,特别是环氧树脂组合物的树脂组合物; 所述环氧树脂组合物的固化物的柔软性,耐热性和电特性优异,特别是在高温高湿下。

    PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    57.
    发明申请
    PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 失效
    用于半导体器件和半导体器件的PRIMER树脂

    公开(公告)号:US20100207282A1

    公开(公告)日:2010-08-19

    申请号:US12733635

    申请日:2008-09-18

    摘要: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3′,4′-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3′,4′-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4′-hydroxydiphenylsulfone, 4,4′-diamino-3,3′5,5′-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.

    摘要翻译: 本发明涉及一种半导体器件用底漆树脂,其包含下述式(1)表示的聚酰胺树脂:(其中,R1表示选自均苯四酸,3,4,...的四价芳香族四羧酸残基 ',4'-二苯基醚四羧酸,2,3,6,7-萘四甲酸和3,4,3',4'-二苯甲酮四羧酸,R2表示选自以下的至少一种二价二胺残基: 的二氨基-4,4'-羟基二苯基砜,4,4'-二氨基-3,3'5,5'-四乙基二苯基甲烷和1,3-双 - (氨基苯氧基)苯,n为重复数,表示正数 10至1000),并具有包括铜或42合金的引线框架,在包括铜或42合金的引线框架和密封树脂的固化产物之间具有所述底漆树脂层的半导体器件和含有 说底线 树脂; 并且所述半导体器件在所述引线框与密封树脂组合物的固化产物之间具有非常改善的粘合性,并且还具有优异的耐热性和低吸湿性。

    PHOTOSENSITIVE RESIN COMPOSITION
    58.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
    感光树脂组合物

    公开(公告)号:US20100035182A1

    公开(公告)日:2010-02-11

    申请号:US12450319

    申请日:2008-04-07

    IPC分类号: G03F7/004

    摘要: The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided.

    摘要翻译: 本发明涉及一种正型感光性聚酰亚胺树脂组合物,其包含由四元酸二酐(a)形成的含酚羟基的可溶性聚酰亚胺树脂(A),具有至少两个氨基的氨基苯酚化合物和至少一种酚羟基 在一个分子(b)中的基团和二氨基化合物(c); 重氮基正型光敏剂(B); 和环氧树脂(C)。 使用本发明的正型感光性聚酰亚胺树脂组合物,能够容易地进行图案化的树脂组合物满足阻燃性,耐热性,机械性能,柔软性等各种性能,能够应对各种电子器件的高功能化, 并且可以提供其固化产物。

    Flame-retardant epoxy resin composition and cured product obtained therefrom
    60.
    发明授权
    Flame-retardant epoxy resin composition and cured product obtained therefrom 有权
    阻燃环氧树脂组合物和由其获得的固化产物

    公开(公告)号:US07608336B2

    公开(公告)日:2009-10-27

    申请号:US11148471

    申请日:2005-06-09

    摘要: The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component.Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, l and m are averages, satisfying the formula: m/(l+m)=0.01; and l+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: -ph(R1)n- or -ph(R2)n-X-ph(R3)n-, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO2 or a single bond).

    摘要翻译: 本发明涉及包含(a)环氧树脂和(b)具有由式(1)表示的结构的含酚羟基的聚酰胺树脂的环氧树脂组合物,该组合物的固化方法,清漆,预浸料或 和具有由式(1)表示的聚酰胺树脂作为活性成分的环氧树脂组合物。 根据本发明的环氧树脂组合物的固化产物在形成薄膜时具有足够的高柔性,即使固化组合物不含卤素阻燃剂,锑化合物等,也具有阻燃性,并且是 耐热性和粘合性优异,因此在广泛的应用中非常有用,例如作为模制材料,铸造材料,层压材料,油漆,粘合剂,抗蚀剂等。 (其中,l和m是平均值,满足公式:m /(1 + m)= 0.01; l + m是2〜200的正数.Ar1表示二价芳基; Ar2表示酚羟基 - 含有二价芳基; Ar 3表示-ph(R 1)n或-ph(R 2)n X-ph(R 3)n - ,其中-ph(R 1)n - ,-ph(R 2) ph(R3)n-分别表示R1取代的,R2取代的和R3取代的亚苯基或未取代的亚苯基; n是0-3的整数; R1,R2和R3各自独立地表示C1〜C3烷基 基团或C1-C3烷氧基; X表示O,S,CO,SO2或单键)。