Abstract:
Methods and systems for measuring degradation includes measuring an initial electrical characteristic of a test device in a ring oscillator that includes multiple oscillator stages, each having a delay stage and one or more fan-out devices, and a test stage having a delay stage and the test device. The ring oscillator is operated for a period of time. The electrical characteristic of the test device is measured after operating the ring oscillator. A level of degradation in the test device is determined using a processor based on the measurements of the electrical characteristic of the test device.
Abstract:
A test structure and method to detect open circuits due to electromigration or burn-out in test wires and inter-level vias. Electromigration occurs when current flows through circuit wires leading to a circuit interruption within the wire. The test structure is a passive test wire arranged in one of several configurations within the circuit of a computer chip. The dimensions and resistances of test wires can vary according to the test structure configuration. Each test wire is measured for an electrical discontinuity after the computer chip is powered-on. If a wiring interruption is detected, it is concluded that the chip had been powered-on before.
Abstract:
A method of measuring semiconductor output characteristics is provided that includes connecting a pulse generator to the gate structure of a semiconductor device, and applying a plurality of voltage pulses at least some of which having a different pulse width to the gate structure of the semiconductor device. The average current is measured from the drain structure of the device for a duration of each pulse of the plurality of pulses. From the measured values for the average current, a self-heating curve of the average current divided by the pulse width is plotted as a function of the pulse width. The self-heating curve is then extrapolated to a pulse width substantially equal to zero to provide a value of drain current measurements without self-heating effects.
Abstract:
An integrated circuit includes a test block which in turn includes a plurality of identical paths; a counter selectively coupled to the plurality of identical paths to selectively obtain a count of at least one of correctly operating paths and incorrectly operating paths from each of the plurality of identical paths; and a plurality of count latches selectively coupled to the counter to store output of the counter. Each path in turn includes a first clocked latch; a clocked logic path beginning and ending at the first clocked latch; and a clocked detection circuit coupled to the first clocked latch and the counter, which determines whether the clocked logic path is operating properly in a given clock period.
Abstract:
A method and circuit of monitoring an effective age of a target circuit are provided. A standby mode is activated in the target circuit. A standby current of a first number of circuit blocks of the target circuit is measured. The measured standby current of the first number of circuit blocks is compared to a first baseline standby current of the first number of circuit blocks. Upon determining that the measured standby current of the first number of circuit blocks is below a first predetermined factor of a baseline standby current of the first number of circuit blocks, the first number of circuit blocks is identified to have a bias temperature instability (BTI) degradation concern.
Abstract:
A computer-implemented method for analyzing customer satisfaction is presented. The computer-implemented method may include capturing visual images related to individuals and order consumables, determining, by a processor, at least one measurable metric to predict variations indicating different satisfaction levels, and dynamically refining parameters if the variations exceed one or more thresholds. The computer-implemented method further includes receiving the captured visual images of the individuals and the order consumables by least one camera in communication with the processor.
Abstract:
A method and system are provided for chip testing. The method includes selectively deploying a chip for future use or discarding the chip to prevent the future use, responsive to a stress history of the chip determined using a non-destructive test procedure. The test procedure includes ordering each of a plurality of functional patterns by a respective minimum operating period corresponding thereto. The test procedure further includes ranking each of the plurality of patterns based on at least one preceding available pattern to provide a plurality of pattern ranks. The test procedure also includes calculating a sum by summing the plurality of pattern ranks. The sum calculated during an initial performance of the test procedure is designated as a baseline, and the sum calculated during a subsequent performance of the test procedure is compared to a threshold derived from the baseline to determine the stress history of the chip.
Abstract:
A method for gaining access beyond a restricted access gateway includes an access key sequence stored on memory of a device. The access key sequence includes a sequence of key entries and key touch movements. An entered request sequence including keys activated by touch on a keyboard of the device and directions of touch movements made on the keyboard is recorded. With an access controller, it is determined whether the recorded entered request sequence matches the access key sequence. Access beyond the restricted access gateway is granted to functions when the recorded entered request sequence matches the access key sequence.
Abstract:
Methods and systems for measuring degradation includes measuring an initial electrical characteristic of a test device in a ring oscillator that includes multiple oscillator stages and a test stage having a delay stage and the test device. The ring oscillator is operated for a period of time. The electrical characteristic of the test device is measured after operating the ring oscillator. A level of degradation in the test device is determined using a processor based on the measurements of the electrical characteristic of the test device.
Abstract:
Over at least part of a lifetime of a product circuit, quiescent current to a product circuit is periodically measured. Over the part of the lifetime of the product circuit, voltage to the product circuit is periodically adjusted based on the monitored quiescent current. Methods, apparatus, and computer program product are disclosed. A calibration procedure may also be performed as part of manufacturing the product circuit, in order to provide values for the quiescent current and corresponding voltage to which the voltage should be adjusted.