公开(公告)号：US10964447B1

公开(公告)日：2021-03-30

申请号：US16918358

申请日：2020-07-01

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Samuel R. Connor ,  Stuart Brett Benefield

IPC: H01B7/02 ,  H01P1/201 ,  H01B7/18 ,  H04L25/02

Abstract: A differential transmission line cable includes a notch filter to manage common-mode energy. The cable includes a narrow portion with two adjacent electrical conductors each having a narrow cross-sectional area and spaced at a narrow spacing. The cable also includes a wide portion longitudinally adjacent to the narrow portion. The wide portion includes the two adjacent electrical conductors each having a wide cross-sectional area greater than the narrow cross-sectional area and spaced at a wide spacing greater than the narrow spacing. The wide and narrow cross-sectional areas and spacings are specified so that the differential-mode impedance of the differential transmission line cable is uniform throughout both the narrow and wide portions and so that differences in the common-mode impedances of the narrow and wide portions create a notch filter to manage common-mode energy in the differential transmission line cable.

公开(公告)号：US10834828B2

公开(公告)日：2020-11-10

申请号：US15881205

申请日：2018-01-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew Doyle ,  Mark Jeanson

IPC: G03F1/20 ,  G03F7/20 ,  H05K3/30 ,  H01F41/04 ,  H01F17/00 ,  H01F27/28 ,  G02B6/46 ,  H01B1/02 ,  H01F27/06 ,  H01G2/06 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  G03F1/00

Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

公开(公告)号：US10750622B2

公开(公告)日：2020-08-18

申请号：US16373693

申请日：2019-04-03

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H01K3/10 ,  H05K3/38 ,  H01L21/02 ,  H05K3/42 ,  H05K1/02 ,  H05K3/40

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US10712664B2

公开(公告)日：2020-07-14

申请号：US16569903

申请日：2019-09-13

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Darryl Becker ,  Mark Jeanson

IPC: G03F7/20 ,  H05K3/42 ,  G03F1/38 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/26 ,  G03F7/40 ,  H05K3/40

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

公开(公告)号：US20190239358A1

公开(公告)日：2019-08-01

申请号：US15881205

申请日：2018-01-26

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew Doyle ,  Mark Jeanson

IPC: H05K3/30 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H01B1/02 ,  G02B6/46 ,  H01F27/06 ,  H01G2/06

Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

公开(公告)号：US20190230797A1

公开(公告)日：2019-07-25

申请号：US16373693

申请日：2019-04-03

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H05K3/38 ,  H01L21/02 ,  H05K3/42

CPC classification number: H05K3/386 ,  H01L21/02118 ,  H05K1/0251 ,  H05K1/0292 ,  H05K1/0298 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/0329 ,  Y10T29/49165

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US10334741B2

公开(公告)日：2019-06-25

申请号：US15796888

申请日：2017-10-30

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H01K3/10 ,  H05K3/38 ,  H01L21/02 ,  H05K3/42

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US12174240B2

公开(公告)日：2024-12-24

申请号：US18062125

申请日：2022-12-06

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  John R. Dangler

IPC: H01L21/44 ,  G01R19/25 ,  G01R31/28 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  B23K101/42

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

公开(公告)号：US20240186671A1

公开(公告)日：2024-06-06

申请号：US18060746

申请日：2022-12-01

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  John R. Dangler ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  Trevor Timpane

IPC: H01P1/20 ,  H01P3/06 ,  H01P11/00

CPC classification number: H01P1/20 ,  H01P3/06 ,  H01P11/005

Abstract: One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.

公开(公告)号：US11619665B2

公开(公告)日：2023-04-04

申请号：US16736192

申请日：2020-01-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeffrey N. Judd ,  Matthew Doyle ,  Matthew S. Kelly ,  Henry M. Newshutz ,  Timothy J. Tofil ,  Mark J. Jeanson

IPC: G01R31/28 ,  H05K3/34 ,  H05K3/30

Abstract: An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.