公开(公告)号：US11652034B2

公开(公告)日：2023-05-16

申请号：US17132041

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Darryl Becker ,  Mark J. Jeanson ,  Gerald Bartley ,  Matthew Doyle

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/58 ,  H05K1/02 ,  H05K3/34 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01L23/49811 ,  H01L23/58 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/3436 ,  H01G4/232 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/1053 ,  H05K2201/10378 ,  H05K2201/10515

Abstract: A method of attaching an integrated circuit (IC) package to a printed circuit board (PCB) with a set of direct current (DC) blocking capacitors includes: applying a conductive attachment material to a first set of attachment pads located on a first planar surface of the IC package; aligning the set of DC blocking capacitors in accordance with corresponding positions of the first set of attachment pads; attaching the set of DC blocking capacitors to the IC package by: positioning the aligned set of DC blocking capacitors so that a first surface of a first DC blocking capacitor of the set of DC blocking capacitors is adjacent to a corresponding attachment pad of the first set of attachment pads; and connecting the conductive attachment material to the IC package and to the first surface of the first DC blocking capacitor to create an IC package assembly.

公开(公告)号：US11614497B2

公开(公告)日：2023-03-28

申请号：US16702077

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00 ,  H02H7/20

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US10834828B2

公开(公告)日：2020-11-10

申请号：US15881205

申请日：2018-01-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew Doyle ,  Mark Jeanson

IPC: G03F1/20 ,  G03F7/20 ,  H05K3/30 ,  H01F41/04 ,  H01F17/00 ,  H01F27/28 ,  G02B6/46 ,  H01B1/02 ,  H01F27/06 ,  H01G2/06 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  G03F1/00

Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

公开(公告)号：US10712664B2

公开(公告)日：2020-07-14

申请号：US16569903

申请日：2019-09-13

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Darryl Becker ,  Mark Jeanson

IPC: G03F7/20 ,  H05K3/42 ,  G03F1/38 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/26 ,  G03F7/40 ,  H05K3/40

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

公开(公告)号：US20190239358A1

公开(公告)日：2019-08-01

申请号：US15881205

申请日：2018-01-26

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew Doyle ,  Mark Jeanson

IPC: H05K3/30 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H01B1/02 ,  G02B6/46 ,  H01F27/06 ,  H01G2/06

Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

公开(公告)号：US12079377B2

公开(公告)日：2024-09-03

申请号：US17189857

申请日：2021-03-02

Applicant: International Business Machines Corporation

Inventor： Eric J. Campbell ,  Matthew Doyle ,  Mark J. Jeanson ,  Gerald Bartley ,  Darryl Becker

IPC: G06F21/72 ,  C01G5/02 ,  C09D7/61 ,  C09K5/14 ,  G01J1/42 ,  G01R31/00 ,  G01R31/28 ,  G01T1/17 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: G06F21/72 ,  C01G5/02 ,  C09D7/61 ,  C09K5/14 ,  G01J1/429 ,  G01R31/002 ,  G01T1/17 ,  H01L23/576 ,  H05K1/0275 ,  H05K1/181 ,  G01R31/2801

Abstract: A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

公开(公告)号：US20200314997A1

公开(公告)日：2020-10-01

申请号：US16368926

申请日：2019-03-29

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Gerald Bartley ,  Darryl Becker ,  Mark J. Jeanson

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K1/14 ,  H05K3/32

Abstract: An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.

公开(公告)号：US10157527B1

公开(公告)日：2018-12-18

申请号：US15824592

申请日：2017-11-28

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew S. Doyle ,  Mark Jeanson

IPC: G08B13/24 ,  G06F11/30 ,  G06F21/82 ,  H05K7/02 ,  G08B29/04 ,  G06F11/34

Abstract: An embossed printed circuit board (PCB) for intrusion detection including a first security trace layer comprising a first serpentine trace monitored by a security sense circuit; a second security trace layer comprising a second serpentine trace monitored by the security sense circuit; a protected circuitry layer comprising circuitry protected from intrusion by the first security trace layer and the second security trace layer; and at least one embossed edge, wherein the at least one embossed edge comprises a fixed bend in at least one PCB layer, and wherein the fixed bend displaces at least one point of the at least one PCB layer a distance at least equivalent to a thickness of the at least one PCB layer.

公开(公告)号：US10834830B2

公开(公告)日：2020-11-10

申请号：US16274565

申请日：2019-02-13

Applicant: International Business Machines Corporation

Inventor： Mark J. Jeanson ,  Darryl Becker ,  Gerald Bartley ,  Matthew S. Doyle

IPC: H01K3/10 ,  H05K3/46 ,  H05K3/06 ,  H05K3/42

Abstract: Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.

公开(公告)号：US20200257005A1

公开(公告)日：2020-08-13

申请号：US16270631

申请日：2019-02-08

Applicant: International Business Machines Corporation

Inventor： Gerald Bartley ,  Matthew Doyle ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01T1/24 ,  H01L27/30 ,  H01L51/42 ,  H01G9/20 ,  H01L51/00

Abstract: Disclosed is a device for detecting non-intrusive inspections. The device includes an electrical component with a first end cap and a second end cap. Additionally, the device includes an x-ray sensitive material electrically coupling the first end cap and the second end cap. The x-ray sensitive material has a first state having a first conductivity and a second state having a second conductivity. The sensing material is configured to transform from the first state to the second state when exposed to an initiating voltage.