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公开(公告)号:US10429719B2
公开(公告)日:2019-10-01
申请号:US16205032
申请日:2018-11-29
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Alex Chuang , Xiaoxu Lu , Baigang Zhang , John Fielden , Vladimir Dribinski
Abstract: An inspection system/method in which first optics direct continuous wave (CW) light at 181-185 nm to an inspected article, and second optics redirect image information affected by the article to detectors. A laser assembly generates the CW light by generating fourth harmonic light from first fundamental CW light having a first wavelength between 1 and 1.1 μm, generating fifth harmonic light by mixing the fourth harmonic light with the first fundamental CW light, and mixing the fifth harmonic light with second light having a second wavelength between 1.26 and 1.82 μm. An external cavity mixes the first light and the fourth harmonic light using a first nonlinear crystal. The CW light is generated using a second cavity that passes circulated second fundamental or signal CW light through a second nonlinear crystal, and directing the fifth harmonic light through the second nonlinear crystal.
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公开(公告)号:US10197501B2
公开(公告)日:2019-02-05
申请号:US13710315
申请日:2012-12-10
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Alex Chuang , Xuefeng Liu , John Fielden , David L. Brown
IPC: G01N21/88 , H01L27/148 , G01N21/95 , H01J31/26 , G01N21/956
Abstract: A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a plurality of ridges between the holes. The control device may be separated from the photocathode by approximately half a shorter dimension of a CCD pixel or less. A plurality of first electrodes may be provided, wherein each first electrode surrounds a given hole and is separated from the given hole by a gap.
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公开(公告)号:US20180191126A1
公开(公告)日:2018-07-05
申请号:US15901388
申请日:2018-02-21
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Chuang , J. Joseph Armstrong , Yujun Deng , Justin Dianhuan Liou , Vladimir Dribinski , John Fielden
IPC: H01S3/30
CPC classification number: H01S3/302 , G01N21/9501 , G02B17/0892 , G02F1/353 , G02F1/395 , G02F2001/354 , H01S3/005 , H01S3/0092 , H01S3/067 , H01S3/06754 , H01S3/10053 , H01S3/11 , H01S3/16 , H01S3/1643 , H01S3/1666 , H01S3/23 , H01S3/2308
Abstract: An optical inspection system that utilizes sub-200 nm incident light beam to inspect a surface of an object for defects is described. The sub-200 nm incident light beam is generated by combining first light having a wavelength of about 1109 nm with second light having a wavelength of approximately 234 nm. An optical system includes optical components configured to direct the incident light beam to a surface of the object, and image relay optics are configured to collect and relay at least two channels of light to a sensor, where at least one channel includes light reflected from the object, and at least one channel includes light transmitted through the object. The sensor is configured to simultaneously detect both the reflected and transmitted light. A laser for generating the sub-200 nm incident light beam includes a fundamental laser, two or more harmonic generators, a frequency doubler and a two frequency mixing stages.
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公开(公告)号:US09966230B1
公开(公告)日:2018-05-08
申请号:US15605308
申请日:2017-05-25
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Chuang , Yinying Xiao-Li , Xuefeng Liu , John Fielden
IPC: H01J37/317 , H01J37/20 , H01J37/244 , H01J37/10 , H01J37/147 , H01J37/04 , H01J37/073
CPC classification number: H01J37/3177 , H01J37/045 , H01J37/073 , H01J37/10 , H01J37/147 , H01J37/20 , H01J37/244 , H01J2237/0435
Abstract: A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitters. The field emitters can take various shapes including a pyramid, a cone, or a rounded whisker. Optional gate layers may be placed on the output surface near the field emitters. The field emitter may be p-type or n-type doped. Circuits may be incorporated into the wafer to control the emission current. A light source may be configured to illuminate the electron source and control the emission current. The multi-column electron beam device may be a multi-column electron beam lithography system configured to write a pattern on a sample.
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公开(公告)号:US20180003647A1
公开(公告)日:2018-01-04
申请号:US15707791
申请日:2017-09-18
Applicant: KLA-Tencor Corporation
Inventor: Abdurrahman Sezginer , Patrick LoPresti , Joe Blecher , Rui-fang Shi , Yalin Xiong , John Fielden
IPC: G01N21/88 , G06T7/00 , G01N21/958
CPC classification number: G01N21/8851 , G01N21/8806 , G01N21/958 , G01N2021/8887 , G01N2201/125 , G06T7/001 , G06T2207/20224 , G06T2207/30148
Abstract: Block-to-block reticle inspection includes acquiring a swath image of a portion of a reticle with a reticle inspection sub-system, identifying a first occurrence of a block in the swatch image and at least a second occurrence of the block in the swath image substantially similar to the first occurrence of the block and determining at least one of a location, one or more geometrical characteristics of the block and a spatial offset between the first occurrence of the block and the at least a second occurrence of the block.
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公开(公告)号:US09860466B2
公开(公告)日:2018-01-02
申请号:US15153543
申请日:2016-05-12
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Alex Chuang , John Fielden , David L. Brown , Jingjing Zhang , Keith Lyon , Mark Shi Wang
IPC: G01N21/00 , H04N5/3722 , G01N21/956
CPC classification number: H04N5/3722 , G01N21/956 , G01N2201/12
Abstract: Pixel aperture size adjustment in a linear sensor is achieved by applying more negative control voltages to central regions of the pixel's resistive control gate, and applying more positive control voltages to the gate's end portions. These control voltages cause the resistive control gate to generate an electric field that drives photoelectrons generated in a selected portion of the pixel's light sensitive region into a charge accumulation region for subsequent measurement, and drives photoelectrons generated in other portions of the pixel's light sensitive region away from the charge accumulation region for subsequent discard or simultaneous readout. A system utilizes optics to direct light received at different angles or locations from a sample into corresponding different portions of each pixel's light sensitive region. Multiple aperture control electrodes are selectively actuated to collect/measure light received from either narrow or wide ranges of angles or locations, thereby enabling rapid image data adjustment.
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公开(公告)号:US09818887B2
公开(公告)日:2017-11-14
申请号:US15182200
申请日:2016-06-14
Applicant: KLA-Tencor Corporation
Inventor: Jehn-Huar Chern , Ali R. Ehsani , Gildardo Delgado , David L. Brown , Yung-Ho Alex Chuang , John Fielden
IPC: G01N21/88 , H01L31/0216 , G01N21/95 , G01N21/956 , H01L27/146
CPC classification number: H01L31/0216 , G01N21/8806 , G01N21/9501 , G01N21/956 , G01N2021/95676 , H01L27/1462 , H01L27/1464 , H01L27/14685 , H01L27/14689 , H01L27/14806
Abstract: An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer on the other surface of the epitaxial layer. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.
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公开(公告)号:US20170295334A1
公开(公告)日:2017-10-12
申请号:US15337604
申请日:2016-10-28
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Alex Chuang , Jingjing Zhang , Sharon Zamek , John Fielden , Devis Contarato , David L. Brown
IPC: H04N5/378 , G01N21/95 , H01L27/148 , H04N5/372 , G06T7/00
CPC classification number: H04N5/378 , G01N21/9501 , G06T7/0008 , G06T2207/30148 , H01L27/14812 , H01L27/14825 , H04N5/361 , H04N5/372
Abstract: A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.
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公开(公告)号:US09766185B2
公开(公告)日:2017-09-19
申请号:US14466688
申请日:2014-08-22
Applicant: KLA-Tencor Corporation
Inventor: Abdurrahman Sezginer , Patrick LoPresti , Joe Blecher , Rui-fang Shi , Yalin Xiong , John Fielden
IPC: G06K9/62 , G01N21/88 , G01N21/958 , G06T7/00
CPC classification number: G01N21/8851 , G01N21/8806 , G01N21/958 , G01N2021/8887 , G01N2201/125 , G06T7/001 , G06T2207/20224 , G06T2207/30148
Abstract: Block-to-block reticle inspection includes acquiring a swath image of a portion of a reticle with a reticle inspection sub-system, identifying a first occurrence of a block in the swatch image and at least a second occurrence of the block in the swath image substantially similar to the first occurrence of the block and determining at least one of a location, one or more geometrical characteristics of the block and a spatial offset between the first occurrence of the block and the at least a second occurrence of the block.
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公开(公告)号:US20170048467A1
公开(公告)日:2017-02-16
申请号:US15210056
申请日:2016-07-14
Applicant: KLA-Tencor Corporation
Inventor: Yung-Ho Alex Chuang , David L. Brown , Devis Contarato , John Fielden , Daniel I. Kavaldjiev , Guoheng Zhao , Jehn-Huar Chern , Guowu Zheng , Donald W. Pettibone , Stephen Biellak
CPC classification number: H04N5/335 , G01N21/9501 , G01N2021/95676 , H04N5/2256 , H04N5/347 , H04N5/3745 , H04N5/3765 , H04N5/378
Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.
Abstract translation: 一种检查系统和方法,其中由图像传感器捕获的模拟图像数据值(电荷)在作为图像传感器的输出感测节点(浮动扩散)之间的输出信号被发送之前或同时被分组(组合),并且其中ADC是 被控制以在输出感测节点的每个复位之间顺序地生成多个对应的数字图像数据值。 根据输出合并方法,驱动图像传感器以在每个复位之间顺序地将多个电荷传送到输出感测节点上,并且在每个电荷被传送到输出感测节点之后,控制ADC转换递增增加的输出信号。 根据多采样方法,在转移到输出感测节点之前,将多个电荷垂直或水平分类(相加/组合),并且ADC对每个对应的输出信号进行多次采样。 可以组合输出合并和多采样方法。
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