摘要:
Disclosed herein is a Digital Signal Processor (DSP) having reconfigurable data paths necessary for processing for a specific use. The DSP includes a plurality of Arithmetic Logic Units (ALUs), pairs of input multiplexers, an output multiplexer, and a reconfiguration control unit. The plurality of ALUs performs unit operations. Each of the pairs of input multiplexers selects data, which will be input to a corresponding ALU, from among input data directed to operate by an instruction word, and output data of the ALUs. The output multiplexer selects one from among the output data of the ALUs, and outputs the selected output data. The reconfiguration control unit controls the data selections of the output multiplexer and the input multiplexers.
摘要:
Disclosed herein is an absorbent for separating acid gases, such as CO2, H2S and COS, from a gas mixture containing the acid gases wherein the absorbent comprises sodium glycinate. Further disclosed is a method for separating acid gases from a gas mixture using the absorbent.
摘要翻译:本文公开了一种用于从含有酸性气体的气体混合物中分离酸性气体如CO 2 H 2 S和COS的吸收剂,其中吸收剂包含甘氨酸钠。 还公开了使用吸收剂从气体混合物中分离酸性气体的方法。
摘要:
A variable capacity rotary compressor to securely fix a clutch pin to a rotation shaft includes first and second compression chambers having different inner volumes, a rotation shaft penetrating the first and second compression chambers, first and second eccentric bushes disposed on an outer circumference of the rotation shaft, a slot provided between the first and second eccentric bushes, a clutch pin protruding from the rotation shaft and disposed in the slot, and a fixing pin coupled with the side of the clutch pin in the rotation shaft to securely fix the clutch pin to the rotation shaft. A groove having a predetermined width can be formed at a rear side of the clutch pin and a rear side of the fixing pin can be inserted into the groove to couple with the clutch pin in the rotation shaft.
摘要:
Exemplary embodiments of the invention generally include methods for forming multilayer metal interconnect structures using dual damascene methods that incorporate a via capping process to protect lower interconnection lines from etching damage or oxidation, for example, that may be caused by inadvertent exposure of lower interconnection lines to etching atmospheres.
摘要:
The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.
摘要:
A method of manufacturing a flash memory device wherein before an insulating film spacer of a contact region is removed after a gate line and source/drain are formed, a high quality buffer oxide film formed between the gate line and the insulating film spacer is made dense by means of an annealing process. Abnormal oxidization is thus prevented from occurring due to an exposed metal layer in a gate when the insulating film spacer is removed as at least part of the buffer oxide remains after the spacer is removed.
摘要:
A projection lens unit and a thin projector using the same are disclosed. The projection lens unit includes a plurality of lens sets for emitting light carrying an image, and a reflector arranged between adjacent ones of the lens sets or at a downstream end of the lens sets, and adapted to change a direction of light incident on the reflector.
摘要:
Provided are a current cell and digital-to-analog converter (DAC) using the same. The current cell includes a current source; a first transistor transmitting a current produced from the current source to a first output node based on a first signal; a second transistor transmitting a current produced from the current source to a second output node based on a second signal; a first capacitor coupled between a gate of the first transistor and the second output node; and a second capacitor coupled between a gate of the second transistor and the first output node. A current mode DAC can improve in dynamic performance by using a plurality of current cells each having the above-described configuration.
摘要:
Provided is a method of fabricating a silicon germanium (SiGe) Bi-CMOS device. In the fabrication method, the source and drain of the CMOS device is formed using a silicon germanium (SiGe) heterojunction, instead of silicon, thereby preventing a leakage current resulting from a parasitic bipolar operation. Further, since the source and drain is connected with an external interconnection through the nickel (Ni) silicide layer, the contact resistance is reduced, thereby preventing loss of a necessary voltage for a device operation and accordingly, making it possible to enable a low voltage and low power operation and securing a broad operation region even in a low voltage operation of an analogue circuit.
摘要:
Disclosed herein are methods for forming wall oxide films in flash memory devices and methods for forming isolation films. After trenches are formed in the substrate, an ISSG (In-Situ Steam Generation) oxidization process is performed to form wall oxide films on sidewalls of the trenches. This process prohibits formation of facets at the top and bottom edge portions of the trenches. Thus, the top edges of the trenches are rounded. Furthermore, the ISSG oxidization process is performed at a low temperature for a relatively short time. Therefore, thermal stress due to carrying out an oxidization process for a long time is reduced and a dislocation phenomenon is thus prevented from occurring.