公开(公告)号：US08809180B2

公开(公告)日：2014-08-19

申请号：US11816186

申请日：2005-12-21

申请人： Karl Weidner ,  Robert Weinke

发明人： Karl Weidner ,  Robert Weinke

IPC分类号： H01L21/44 ,  H01L21/66 ,  H01L21/00 ,  H01L21/48 ,  H01L21/04

CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

公开(公告)号：US08570748B2

公开(公告)日：2013-10-29

申请号：US13002110

申请日：2009-06-16

申请人： Friedrich Lupp ,  Karl Weidner

发明人： Friedrich Lupp ,  Karl Weidner

IPC分类号： H05K7/20 ,  H01L23/48

CPC分类号： H01L23/49861 ,  H01L23/15 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

摘要翻译： 对于电子部件，特别是电源模块，以及用于制造或接触所述部件的相应方法中，组件（1）被紧固到具有至少一个第一无机材料的电绝缘载体膜（3） 以及至少一个开口（5），其中提供组件（1）的至少一个电接触连接（7）到组件（1）外部。 这使得可以在> 175℃的温度范围内提供电子部件（1），特别是功率模块。

公开(公告)号：US08415802B2

公开(公告)日：2013-04-09

申请号：US12805361

申请日：2010-07-27

申请人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

发明人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

IPC分类号： H01L29/41

CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。

公开(公告)号：US08395257B2

公开(公告)日：2013-03-12

申请号：US12310070

申请日：2007-07-31

申请人： Jens-Christian Holst ,  Jens Dahl Jensen ,  Karl Weidner ,  Robert Weinke

发明人： Jens-Christian Holst ,  Jens Dahl Jensen ,  Karl Weidner ,  Robert Weinke

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/32 ,  C23C24/04 ,  H01L23/552 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/102 ,  H05K3/14 ,  H05K2203/1344 ,  H05K2203/1469

摘要： An electric functional layer is produced on a surface of a substrate, having at least an electronic component, particularly a semiconductor chip, provided thereof. The electric functional layer is formed using particles in powder of an electrically conductive material. The functional layer is blown on the surface of the substrate to form a thick and strong adhesive layer on impact with the substrate.

摘要翻译： 在基板的表面上制造电功能层，至少具有设置有电子部件的电子部件，特别是半导体芯片。 电功能层使用导电材料的粉末形成。 在衬底的表面上吹送功能层，以在与衬底冲击时形成厚而坚固的粘合剂层。

公开(公告)号：US08191243B2

公开(公告)日：2012-06-05

申请号：US12224094

申请日：2006-12-20

申请人： Ladislaus Bittmann ,  Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

发明人： Ladislaus Bittmann ,  Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

IPC分类号： H05K3/36

CPC分类号： H01L23/3164 ,  H01L21/481 ,  H01L21/486 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/82 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/2402 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/281 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1062

摘要： In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips.

摘要翻译： 在本发明的一个实施例中，公开了一种用于接触衬底的表面上和/或布置在衬底上的半导体芯片的表面上的至少一个电接触表面的方法。 根据本发明的一个实施例，将电绝缘塑料材料的膜层压在表面上。 然后，通过一层导电材料，可以通过薄膜中的开口自由接触的接触表面的大面积接触。 平面电接触方法的目的是在短时间内在绝缘体中产生开口。 特别地，开口应位于接触表面的精确位置。 为了实现这一点，在电绝缘塑料材料的膜中，在接触表面的区域中产生开口，以通过激光切割和层压之前接触。 该方法适用于所有平面接触过程。 可以制造相应接触的基板或半导体芯片。 所使用的半导体芯片尤其可以是功率半导体芯片。

公开(公告)号：US20100289152A1

公开(公告)日：2010-11-18

申请号：US12805361

申请日：2010-07-27

申请人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

发明人： Michael Kaspar ,  Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

IPC分类号： H01L23/498

CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。

公开(公告)号：US07649272B2

公开(公告)日：2010-01-19

申请号：US10566438

申请日：2004-07-12

申请人： Franz Auerbach ,  Karl Weidner

发明人： Franz Auerbach ,  Karl Weidner

IPC分类号： H01L23/29

CPC分类号： H01L24/82 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/24 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： An electrical component is placed on a substrate. At least one film comprising a plastic material is connected to the component and to the substrate in such a way that a surface contour defined by the component and the substrate is represent is represented in a surface contour of the part of the film. Said film is laminated onto the component and the substrate in such a way that the film follows the topology of the arrangement consisting of the component and the substrate. Said film is in contact with the component and the substrate in a positive and non-positive manner, and comprises a composite material containing a filler that is different to the plastic material. The processability and electrical properties of the film are influenced by the filler or the composite material obtained thereby. In this way, other functions can be integrated into the film. Said component is, for example, a power semiconductor component. An electrically insulating and thermoconductive film is used, for example. A contact surface of the power semiconductor is electrically contracted through the film. The thermal conductivity of the film enables heat created during the operation of the power semiconductor component to be efficiently carried away.

摘要翻译： 将电气部件放置在基板上。 包括塑料材料的至少一个薄膜以这样的方式连接到部件和基板上，使得由部件和基板限定的表面轮廓表示为薄膜部分的表面轮廓。 所述薄膜以这样的方式层压在组件和基底上，使得薄膜遵循由组件和基底组成的布置的拓扑结构。 所述膜以正极和非正性方式与组分和基底接触，并且包含含有与塑料材料不同的填料的复合材料。 膜的加工性和电性能受到由此获得的填料或复合材料的影响。 以这种方式，其他功能可以集成到电影中。 所述部件例如是功率半导体部件。 例如，使用电绝缘和导热膜。 功率半导体的接触表面通过膜电接收。 该膜的导热性使得在功率半导体部件的操作期间产生的热能够被有效地带走。

公开(公告)号：US20090029035A1

公开(公告)日：2009-01-29

申请号：US12224175

申请日：2006-12-20

申请人： Jorg Naundorf ,  Karl Weidner ,  Hans Wulkesch

发明人： Jorg Naundorf ,  Karl Weidner ,  Hans Wulkesch

IPC分类号： B05D5/12

CPC分类号： H01L23/3164 ,  B29C63/02 ,  B29C2793/00 ,  B29L2031/3061 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T156/1054 ,  Y10T156/1092 ,  Y10T156/1093 ,  H01L2924/00

摘要： A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.

摘要翻译： 一种用于选择性地生产用于包装和用于绝缘未封装的电子部件和功能图案以及相应的装置的薄膜层压板的方法。 布置在衬底和/或布置在衬底上的半导体芯片的表面区域上的功能图案的方法涂层表面区域。 绝缘材料的特性要适应功能图案和/或电子部件的不同要求。 膜区域以这样的方式层压在表面区域上，使得膜区域的塑料材料的性质适合于膜的功能。 这种适应是个人和选择性的。 使用各种胶片。 该方法特别适用于涂覆或包装电子部件或主动和被动装置。

公开(公告)号：US20080191360A1

公开(公告)日：2008-08-14

申请号：US11884231

申请日：2005-12-22

申请人： Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

发明人： Karl Weidner ,  Robert Weinke ,  Hans Wulkesch

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/38 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K2201/2072 ,  H01L2924/00

摘要： A device is disclosed with at least one electrically insulating layer on which at least one conductor structure made of electrically conductive material is placed. In at least one embodiment, the conductor structure on the side facing the insulating layer has at least one elevation that is accommodated in at least one recess in the insulating layer.

摘要翻译： 公开了具有至少一个电绝缘层的器件，在绝缘层上放置由导电材料制成的至少一个导体结构。 在至少一个实施例中，面向绝缘层的一侧上的导体结构具有至少一个放置在绝缘层中的至少一个凹部中的高度。

公开(公告)号：US20080124527A1

公开(公告)日：2008-05-29

申请号：US11791687

申请日：2005-09-07

申请人： Ladislaus Bittmann ,  Karl Weidner

发明人： Ladislaus Bittmann ,  Karl Weidner

IPC分类号： B32B3/02 ,  B32B37/10

CPC分类号： H05K3/284 ,  H01L21/56 ,  H01L23/3135 ,  H01L2224/75315 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H05K2203/082 ,  H05K2203/1311 ,  Y10T156/103 ,  Y10T428/24851

摘要： A method for enveloping components arranged on a substrate, with a film which is made of an electrically insulating plastic material, and the substrate. The film is placed on the components to be enveloped on the side thereof facing away from the substrate. Elastically or plastically deformable impression material is placed onto the film on the side thereof which faces away from the components to be enveloped. The impression material is pressed against the film in the direction of the components and the substrate and the impression material is removed.

摘要翻译： 一种用于包封布置在基板上的组件的方法，其中由电绝缘塑料材料制成的薄膜和该基板。 将膜放置在要被包封的部件上，其背面背离基板。 将弹性或塑性变形的印模材料放置在薄膜上，其侧面远离要包封的部件。 印模材料沿着组件和基底的方向压在薄膜上，并且去除印模材料。