公开(公告)号：US07569838B2

公开(公告)日：2009-08-04

申请号：US12068484

申请日：2008-02-07

申请人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

发明人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

IPC分类号： H01J37/00 ,  H01J37/30

CPC分类号： H01J37/28 ,  H01J37/224 ,  H01J37/244 ,  H01J2237/006 ,  H01J2237/20221 ,  H01J2237/2445 ,  H01J2237/2817

摘要： An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

公开(公告)号：US20080308729A1

公开(公告)日：2008-12-18

申请号：US12216160

申请日：2008-06-30

申请人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

发明人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC分类号： G01N23/20

CPC分类号： H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

摘要翻译： 本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过具有至少一个自由度的平台26-1连续移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。 因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

公开(公告)号：US07411191B2

公开(公告)日：2008-08-12

申请号：US11806573

申请日：2007-06-01

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Masahiro Hatakeyama ,  Toshifumi Kimba ,  Hiroshi Sobukawa ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Yuichiro Yamazaki ,  Takamitsu Nagai ,  Ichirota Nagahama

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Masahiro Hatakeyama ,  Toshifumi Kimba ,  Hiroshi Sobukawa ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Yuichiro Yamazaki ,  Takamitsu Nagai ,  Ichirota Nagahama

IPC分类号： H01J37/26

CPC分类号： H01J29/70 ,  G01N23/225 ,  G01N23/2251 ,  G01N23/227 ,  H01J37/06 ,  H01J37/073 ,  H01J37/141 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/266 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L21/6719 ,  H01L21/67213

摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.

摘要翻译： 电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器， 光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在微环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

公开(公告)号：US07391036B2

公开(公告)日：2008-06-24

申请号：US10511396

申请日：2003-04-17

申请人： Masahiro Hatakeyama ,  Kenji Watanabe ,  Takeshi Murakami ,  Tohru Satake ,  Nobuharu Noji

发明人： Masahiro Hatakeyama ,  Kenji Watanabe ,  Takeshi Murakami ,  Tohru Satake ,  Nobuharu Noji

IPC分类号： G01N13/10 ,  B05D1/36

CPC分类号： G03F7/162 ,  G01N23/225 ,  H01J37/285 ,  H01J2237/204 ,  H01J2237/2812 ,  H01J2237/2814 ,  H01J2237/2855 ,  H01J2237/2857

摘要： The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t1 is first coated on a surface of a sample. Thereafter, a part of the resistive film having the arbitrarily determined thickness t1 is dissolved in a solvent, to thereby reduce the thickness of the resistive film to a desired level. This enables precise control of a value of resistance of the resistive film and suppresses distortion of an image to be detected.

公开(公告)号：US07351969B2

公开(公告)日：2008-04-01

申请号：US11290688

申请日：2005-12-01

申请人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

发明人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

IPC分类号： G21K7/00

CPC分类号： H01J37/28 ,  H01J37/224 ,  H01J37/244 ,  H01J2237/006 ,  H01J2237/20221 ,  H01J2237/2445 ,  H01J2237/2817

摘要： An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

摘要翻译： 图像投影型的电子束检查系统包括用于将从电子枪发射的电子束成形为矩形构造的一次电子光学系统，并将成形的电子束施加到要检查的样品表面。 二次电子光学系统收敛从样品发射的二次电子。 检测器通过荧光屏将会聚的二次电子转换成光学图像，并将图像聚焦到线传感器。 一个控制器控制线传感器的电荷转移时间，该线传感器在行传感器中设置的每对相邻像素行之间与用于移动样本的平台的移动速度相关联地传送拾取线图像。

公开(公告)号：US20080023651A1

公开(公告)日：2008-01-31

申请号：US11896519

申请日：2007-09-04

申请人： Masahiro Hatakeyama ,  Tohru Satake ,  Takeshi Murakami ,  Kenji Watanabe ,  Nobuharu Noji

发明人： Masahiro Hatakeyama ,  Tohru Satake ,  Takeshi Murakami ,  Kenji Watanabe ,  Nobuharu Noji

IPC分类号： G01J1/00

CPC分类号： H01J37/222 ,  G01N21/956 ,  H01J37/224 ,  H01J37/244 ,  H01J2237/2445 ,  H01J2237/2447 ,  H01R13/2421 ,  H04N5/2253 ,  Y10S439/935

摘要： An electron beam apparatus comprises a TDI sensor 64 and a feed-through device 50. The feed-through device has a socket contact 54 for interconnecting a pin 52 attached to a flanged 51 for separating different environments and the other pin 53 making a pair with the pin 52, in which the pin 52, the other pin 53 and the socket contact 54 together construct a connecting block, and the socket contact 54 has an elastic member 61. Accordingly, even if a large number of connecting blocks are provided, the connecting force may be kept to such a low level as to prevent the breakage in the sensor. The pin 53 is connected with the TDI sensor 64, in which a pixel array has been adaptively configured based on the optical characteristic of an image projecting optical system. That sensor has a number of integration stages that can reduce the field of view of the image projecting optical system to as small as possible so that a maximal acceptable distortion within the field of view may be set larger. Further, the number of integration stage may be determined such that the data rate of the TDI sensor would not be reduced but the number of pins would not be increased as much as possible. Preferably, the number of line count may be almost equal to the number of integration stages.

摘要翻译： 电子束装置包括TDI传感器64和馈通装置50.馈通装置具有插座触点54，用于互连连接到凸缘51的引脚52，用于分离不同的环境，而另一个引脚53与 销52，销52，另一销53和插座接触54一起构成连接块，插座触头54具有弹性构件61.因此，即使设置了大量的连接块， 连接力可以保持在如此低的水平，以防止传感器中的破损。 引脚53与TDI传感器64连接，其中像素阵列已经基于图像投影光学系统的光学特性被自适应地配置。 该传感器具有可以将图像投影光学系统的视野尽可能地减小的多个积分级，使得视野内的最大可接受失真可以被设定得更大。 此外，可以确定积分级的数量，使得TDI传感器的数据速率不会降低，但是引脚的数量不会尽可能多地增加。 优选地，行计数的数量可以几乎等于积分级数。

公开(公告)号：US20070192057A1

公开(公告)日：2007-08-16

申请号：US11783793

申请日：2007-04-12

申请人： Tohru Satake ,  Nobuharu Noji ,  Masahiro Hatakeyama ,  Kenji Watanabe

发明人： Tohru Satake ,  Nobuharu Noji ,  Masahiro Hatakeyama ,  Kenji Watanabe

IPC分类号： G01B15/00

CPC分类号： H01L22/22 ,  G01R31/307 ,  H01L21/31116 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a method for enabling repair of a defect in a substrate, particularly the invention provides a method and apparatus for enabling repair of a pattern shape in a semiconductor device, which has not been able to be practiced because of lack of a suitable method, and further provides a method for manufacturing the semiconductor device using those. A method for repairing the pattern shape of a substrate having an imperfect pattern is used, which includes (a) a step for inspecting the substrate and thus detecting the imperfect pattern, and (b) a step for repairing the pattern shape by performing etching or deposition to the detected imperfect-pattern using radiation rays. Moreover, apparatus for repairing a pattern shape of a via-hole in a wafer having an imperfect via-hole is used, which has a defect inspection section for detecting the imperfect via-hole, and an etching section for etching the imperfect via-hole using a fast atom beam.

摘要翻译： 本发明涉及能够修复基板中的缺陷的方法，特别是本发明提供一种能够修复半导体器件中的图案形状的方法和装置，其由于缺乏合适的方式而无法实践 方法，并且还提供了使用这些方法制造半导体器件的方法。 使用修复具有不完美图案的基板的图案形状的方法，其包括（a）检查基板并因此检测不完美图案的步骤，以及（b）通过进行蚀刻来修复图案形状的步骤 使用辐射线沉积到检测到的不完美图案。 此外，使用在具有不良通孔的晶片中修复通孔的图案形状的装置，其具有用于检测不良通孔的缺陷检查部和用于蚀刻不完美通孔的蚀刻部 使用快速原子束。

公开(公告)号：US20070045536A1

公开(公告)日：2007-03-01

申请号：US11350009

申请日：2006-02-09

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima

IPC分类号： G21K7/00

CPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： The present invention relates to a substrate inspection apparatus for inspecting a pattern formed on a substrate by irradiating a charged particle beam onto the substrate. The substrate inspection apparatus comprises: an electron beam apparatus including a charged particle beam source for emitting a charged particle beam, a primary optical system for irradiating the charged particle beam onto the substrate, a secondary optical system into which a secondary charged particle beam is introduced, the secondary charged particle beam being emitted from the substrate by an irradiation of the charged particle beam, a detection system for detecting the secondary charged particle beam introduced into said secondary optical system and outputting as an electric signal, and a process control system for processing and evaluating the electric signal; a stage unit for holding the substrate and moving the substrate relatively to said electron beam apparatus; a working chamber capable of shielding at least an upper region of the stage unit form outside to control under desired atmosphere; and a substrate load-unload mechanism for transferring the substrate into or out of the stage.

摘要翻译： 本发明涉及一种基板检查装置，用于通过将带电粒子束照射到基板上来检查形成在基板上的图案。 基板检查装置包括：电子束装置，其包括用于发射带电粒子束的带电粒子束源，用于将带电粒子束照射到基板上的主光学系统，引入二次带电粒子束的二次光学系统 通过照射带电粒子束从基板发射的二次带电粒子束，用于检测引入到所述二次光学系统中并输出作为电信号的二次带电粒子束的检测系统和用于处理的过程控制系统 并评估电信号; 用于保持基板并相对于所述电子束装置移动基板的载物台单元; 能够至少屏蔽舞台单元的上部区域的工作室形成外部以在期望的气氛下进行控制; 以及用于将衬底转移到或离开工作台的衬底装载 - 卸载机构。

公开(公告)号：US07098457B2

公开(公告)日：2006-08-29

申请号：US11134330

申请日：2005-05-23

申请人： Ichirota Nagahama ,  Yuichiro Yamazaki ,  Kenji Watanabe ,  Masahiro Hatakeyama ,  Tohru Satake ,  Nobuharu Noji

发明人： Ichirota Nagahama ,  Yuichiro Yamazaki ,  Kenji Watanabe ,  Masahiro Hatakeyama ,  Tohru Satake ,  Nobuharu Noji

IPC分类号： G01N23/00

CPC分类号： H01J37/28 ,  H01J2237/0044 ,  H01J2237/2817

摘要： A defect inspecting apparatus is provided for generating a less distorted test image to reliably observe a surface of a sample for detecting defects thereon. The defect detecting apparatus comprises a primary electron beam source for irradiating a sample, electrostatic lenses for focusing secondary electrons emitted from the surface of the sample irradiated with the primary electron beam, a detector for detecting the secondary electrons, and an image processing unit for processing a signal from the detector. Further, a second electron source may be provided for emitting an electron beam irradiated to the sample, wherein the sample may be irradiated with the electron beam from the second electron source before it is irradiated with the primary electron beam from the first electron source for observing the sample. A device manufacturing method is also provided for inspecting devices under processing with high throughput using the defect detecting apparatus.

公开(公告)号：US06992290B2

公开(公告)日：2006-01-31

申请号：US09985317

申请日：2001-11-02

申请人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

发明人： Kenji Watanabe ,  Hirosi Sobukawa ,  Nobuharu Noji ,  Tohru Satake ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Mamoru Nakasuji ,  Masahiro Hatakeyama ,  Takeshi Murakami ,  Yuichiro Yamazaki ,  Ichirota Nagahama ,  Takamitsu Nagai ,  Kazuyoshi Sugihara

IPC分类号： H01J37/26

CPC分类号： H01J37/28 ,  H01J37/224 ,  H01J37/244 ,  H01J2237/006 ,  H01J2237/20221 ,  H01J2237/2445 ,  H01J2237/2817

摘要： An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.