摘要:
A cache system comprising a cache tag buffer 270 for storing a part of a cache tag memory 260. When a memory processing request is issued from a processor 10, a cache control means 280 retrieves both of the cache tag memory 260 and the cache tag buffer 270. If a target cache block is present in the cache tag buffer 270, then, without waiting for a retrieval result of the cache tag memory 260, the cache control circuit 280 accesses the cache data memory 250 using information of the cache block.
摘要:
The bit line overdrive circuit of the present invention comprises a VBLH potential generation circuit generating a bit line final potential relative to a VBLH power supply line for driving a sense amplifier, a charge adjusting capacitance C, a transistor for supplying an overdrive potential to the VBLH power supply line, and a transistor for connecting a PCS node to the VBLH power supply line. The charge pre-charged from the overdrive potential to the VBLH power supply line is shared among the capacitance of the above-noted circuit elements connected to the VBLH power supply line, the bit line capacitance, and the capacitance of a cell capacitor so as to form a VBLH power supply of a substantially one system, thereby avoiding the generation of a power supply noise caused by the power supply switching.
摘要:
A semiconductor integrated circuit device including an integrated circuit portion, a fuse element block, and a data transfer selecting circuit. The fuse element block includes a programmable fuse element. The data transfer selecting circuit selects one of the transfer of data programmed in the fuse element to the integrated circuit portion, transfer of data input from outside to the integrated circuit portion, and transfer of data programmed in the fuse element to outside.
摘要:
A semiconductor memory device comprises a first core section including a plurality of memory cell arrays, a second core section including a plurality of memory cell arrays and provided below the first core section, a third core section including a plurality of memory cell arrays and provided in a right side of the first core section, and a fourth core section including a plurality of memory cell arrays and provided in a right side of the second core section, wherein at least a part of the memory cell arrays of the first core section and at least a part of the memory cell arrays of the fourth core section are simultaneously activated, and at least a part, of the memory cell arrays of the second core section and at least a part of the memory cell arrays of the third core section are simultaneously activated.
摘要:
The control voltage .phi.1 outputted by the control voltage generating circuit 1 is at a low level in a range where an external supply voltage Vcc is lower than the threshold value of the transistor P1, but increases continuously in analog manner when the external supply voltage Vcc rises. After having matched the external supply voltage Vcc, the control voltage .phi.1 increases in the same way as the external supply voltage Vcc. By use of the control voltage provided with the characteristics as described above for an output circuit, controlled is the gate of a transistor P4 of a low-voltage operating output section 6 operative only at a voltage lower than a predetermined value. The transistor P2 of a full-voltage operating output section 5 of the output circuit is always operative on the basis of the control signal .phi.H of the data output control circuit 3. When the external supply voltage is low below the predetermined value, the transistor P4 is perfectly turned on, so that the conductance thereof increases. In the semiconductor integrated circuit device operative on the basis of a plurality of supply voltages, it is possible to prevent the operation margin from being reduced near the switching point of the gate voltages of the driving transistors and the data output transistors.
摘要:
A semiconductor memory device including a memory cell array, bit lines, and sense amplifier groups. The memory cell array is composed of a plurality of memory cells arranged roughly in a matrix pattern. A plurality of the memory cells arranged in a row are activated in response to a row address decode signal. A pair of the bit lines are provided for each column. The data of the corresponding activated memory cells are transmitted to the bit line pair. Each of the sense amplifier groups has n-units of sense amplifiers each connected to the bit line pair, to sense and amplify data read to the bit line pair connected thereto. The respective reference potential terminals of the sense amplifiers of each of the sense amplifier groups are connected to a single common node which can be connected to a reference potential via a sense amplifier activating transistor turned on in response to a row address signal. The sense amplifiers can be operated at high speed, while preventing erroneous operation, because the wiring resistances and the parasitic capacitances of the common source node of the sense amplifiers can be reduced.
摘要:
A semiconductor integrated circuit includes memory cell blocks having memory cells arranged in matrix, sense amplifiers, each located adjacent to the memory cells, and sense amplifier control circuits, each of the sense amplifier control circuit being located on outside of the memory cell block. The sense amplifier control circuit has a standard voltage generating circuit and a control circuit for receiving the standard voltage and for transferring a driver signal to the sense amplifier to control the charging ability of the sense amplifier. The source voltage has three voltage regions, first, intermediate, and second regions. In the first voltage region, the potential of the driver signal increases with the increase of the source voltage. In the intermediate voltage region (2.7 to 3 Volt), the potential of the driver signal is changed oppose to the change of the source voltage, and in the second voltage region, the potential of the driver signal decreases with the increase of the source voltage.
摘要:
In the semiconductor device according to the present invention, bonding pads are arranged on the periphery of the semiconductor chip and power supply inner leads are disposed inwardly of signal inner leads. Since bonding wires for connecting the signal lead to signal pads corresponding thereto do not extend astride of the power supply inner lead, a package of a semiconductor device can be thereby thinned as much as possible.
摘要:
A semiconductor device comprises a rectangular semiconductor chip provided with an integrated circuit, and a plurality of voltage stress examination pads formed on the semiconductor chip for applying stress examination voltage to the integrated circuit, and having the same function, wherein the voltage stress examination pads are provided on opposite sides of the semiconductor chip.
摘要:
A semiconductor device provided with a plurality of sense circuits, each sense circuit including a pair of MOS transistors such that their sources are commonly connected, and that the drain of one transistor and the gate of the other transistor are cross-coupled each other to, thus, sense a difference between potentials applied to the respective gates. The paired transistors respectively include one transistor regions, and are disposed with their source regions being shared among the plurality of sense circuits. These sense circuits are disposed in a manner to share the source regions of the respective transistors. When elimination of only isolation between sense circuits meets with a required miniaturization of the device, paired transistors constituting sense circuits may include two transistor regions or more connected in parallel, respectively.