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公开(公告)号：US07796847B2
公开(公告)日：2010-09-14
申请号：US10721724
申请日：2003-11-24
CPC分类号： G02B6/3508 , G02B6/357 , G02B6/358 , G02B6/3584 , G02B2006/12145
摘要： Methods for applying electrical stimuli to optical micro-electro-mechanical system (MEMS) devices are disclosed. Electrical stimuli may be applied to one or more released current carrying elements mounted above a supporting substrate biased to minimize electrostatic force between the one or more current released current carrying elements and the supporting substrate. Additionally, the electrical stimuli bias minimizes electrical potential difference between the one or more released current carrying elements and one or more non-current carrying elements mounted above the supporting substrate that come in contact or close proximity during operation of the one or more released current carrying elements.
摘要翻译： 公开了将电刺激应用于光学微机电系统（MEMS）装置的方法。 可以将电刺激施加到安装在支撑基板上方的一个或多个释放的载流元件，偏置以最小化一个或多个电流释放的载流元件与支撑基板之间的静电力。 此外，电刺激偏压最小化一个或多个释放的载流元件与安装在支撑基板上方的一个或多个非电流承载元件之间的电势差，该一个或多个非电流承载元件在一个或多个释放的电流载体的操作期间接触或接近 元素。
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公开(公告)号：US20080242004A1
公开(公告)日：2008-10-02
申请号：US11694886
申请日：2007-03-30
IPC分类号： H01L21/00
CPC分类号： H01L24/82 , H01L23/3185 , H01L23/552 , H01L23/66 , H01L24/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/82104 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.
摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。
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公开(公告)号：US07108354B2
公开(公告)日：2006-09-19
申请号：US10873125
申请日：2004-06-23
申请人： Peter M. Gulvin , Joel A. Kubby
发明人： Peter M. Gulvin , Joel A. Kubby
CPC分类号： B41J2/14314
摘要： An electrostatic actuator includes a segmented flexible membrane associated with individually addressable electrodes, one for each membrane segment. The electrodes are provided beneath a corresponding one of the membrane segments to define a plurality of actuator chambers between each of the electrodes and the corresponding membrane segment. Control electronics independently provide a bias voltage to select ones or all of the electrodes to generate an electrostatic field between any bias electrode and the corresponding membrane segment to attract the corresponding membrane segment toward the respective electrode. Upon elimination of the bias voltage, the corresponding membrane segments are elastically restored to their previous position. This structure can be incorporated into a fluid drop ejector to achieve variable drop size by control of the number of segments actuated. Additionally, by control of the time and space domain of the segment firing, the pressure pulse created by the fluid drop ejector can be precisely controlled.
摘要翻译： 静电致动器包括与单独可寻址电极相关联的分段柔性膜，每个膜片段一个。 电极设置在相应的一个膜段之下，以在每个电极和相应的膜段之间限定多个致动器室。 控制电子器件独立地提供偏置电压以选择一个或所有电极，以在任何偏置电极和相应的膜片段之间产生静电场，以将相应的膜段吸引到相应的电极。 在消除偏置电压时，相应的膜段被弹性恢复到其先前的位置。 这种结构可以被结合到流体液滴喷射器中，以通过控制致动段的数量来实现可变的液滴尺寸。 另外，通过控制段燃烧的时间和空间域，可以精确地控制由液滴喷射器产生的压力脉冲。
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54.发明授权公开(公告)号：US07060522B2
公开(公告)日：2006-06-13
申请号：US09986107
申请日：2001-11-07
IPC分类号： H01L21/00
CPC分类号： B81C1/00476 , B81B2203/0127 , B81C2201/053
摘要： A structure for a micro-device is fabricated by forming: a first layer of sacrificial material, a layer of structural material over the first sacrificial material layer, a second layer of sacrificial material over the structural material layer and a protective layer over the second sacrificial material layer. A release etch is used to remove the first and second sacrificial material layers at approximately the same rate. A structural feature may also be fabricated by forming: a first layer of a first material; a layer of structural material over the first layer of the first material; at least one cut in the structural material layer; and, a first layer of a sacrificial material, different from the first material, over the structural material layer such that an interface is created between the first layer of the sacrificial material and the first layer of the first material at the at least one cut.
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55.发明授权公开(公告)号：US06479315B1
公开(公告)日：2002-11-12
申请号：US09724514
申请日：2000-11-27
申请人： Andrew J. Zosel , Peter M. Gulvin , Jingkuang Chen , Joel A. Kubby , Chuang-Chia Lin , Alex T. Tran
发明人： Andrew J. Zosel , Peter M. Gulvin , Jingkuang Chen , Joel A. Kubby , Chuang-Chia Lin , Alex T. Tran
IPC分类号： H01L2100
CPC分类号： B81C1/00666 , B81B2203/058 , B81C2201/014 , B81C2201/0164 , B81C2201/056 , G02B26/0833
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
摘要翻译： 本发明提供一种微机械或微机电结构。 该结构通过包括在衬底层上限定由绝缘体层分离的单晶硅层上的结构的方法制造; 沉积和蚀刻单晶硅层上的多晶硅层，剩余的多晶硅形成结构的机械或光学元件; 暴露单晶硅层的选定区域; 并释放形成的结构。
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56.发明授权Method of forming protrusions on single crystal silicon structures built on silicon-on-insulator wafers 失效在绝缘体上硅晶片上形成的单晶硅结构上形成突起的方法公开(公告)号：US06413793B1
公开(公告)日：2002-07-02
申请号：US09858469
申请日：2001-05-17
IPC分类号： H01L2100
CPC分类号： B81B3/001
摘要： A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.
摘要翻译： 半导体结构包括衬底，形成在衬底上或衬底上的牺牲层以及形成在牺牲层上或之上的结构层。 在结构层中形成至少一个开口。 在结构层中的至少一个开口下方的牺牲层中形成至少一个开口。 结构层中的至少一个开口和牺牲层中的至少一个开口至少部分地填充有填充材料。 去除结构层的至少一部分以限定至少一个微结构。 去除牺牲层，使得至少一个微结构从衬底释放并且填充材料在至少一个微结构上形成一个或多个突起，和/或一个或多个将至少一个微结构锚定到衬底的锚固件。
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57.发明授权Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads 有权高度集成的晶片粘合MEMS器件，具有无释放膜制造用于高密度打印头公开(公告)号：US08455271B2
公开(公告)日：2013-06-04
申请号：US11693209
申请日：2007-03-29
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639
摘要： A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
摘要翻译： 公开了制造MEMS喷墨型打印头的方法和所得到的装置。 该方法包括提供驱动器部件并且单独地提供可致动的膜部件，可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。 单独提供的致动膜部件被结合到驱动器部件，并且在接合之后将喷嘴板附接到可致动膜部件。 单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。
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公开(公告)号：US08132892B2
公开(公告)日：2012-03-13
申请号：US12536196
申请日：2009-08-05
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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59.发明申请公开(公告)号：US20110242218A1
公开(公告)日：2011-10-06
申请号：US12751077
申请日：2010-03-31
CPC分类号： B41J2/14314 , B41J2/1433 , B41J2002/14475
摘要： Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more stepped nozzles each with an associated entrance diameter and exit diameter. Ink can be received into the printhead and formed into ink drops in the stepped nozzles. The ink drops can each have an associated drop mass and drop speed. The stepped nozzles can be provided such that the exit diameter can independently dictate the drop mass and the entrance diameter can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.
摘要翻译： 公开了从喷墨打印机喷出墨滴的方法和系统。 方法和系统可以包括具有一个或多个阶梯式喷嘴的打印头，每个具有相关联的入口直径和出口直径。 油墨可以被接收到打印头中并且形成为阶梯式喷嘴中的墨滴。 墨滴可以各自具有相关联的液滴质量和液滴速度。 可以设置阶梯喷嘴，使得出口直径可以独立地决定液滴质量，并且入口直径可以独立地决定液滴速度。 因此，喷射设计优化的复杂性降低。
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公开(公告)号：US07681985B2
公开(公告)日：2010-03-23
申请号：US12422532
申请日：2009-04-13
IPC分类号： B41J2/25
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。
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