公开(公告)号：US20200220042A1

公开(公告)日：2020-07-09

申请号：US16734175

申请日：2020-01-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/64

Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

公开(公告)号：US20190357395A1

公开(公告)日：2019-11-21

申请号：US16414521

申请日：2019-05-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H05K13/04 ,  H01L27/32 ,  H01L33/36 ,  H01L33/08 ,  H01L33/00

Abstract: The present invention provides a system for transferring a micro LED, the system transferring more efficiently a micro LED dropped in a solution.

公开(公告)号：US20190304853A1

公开(公告)日：2019-10-03

申请号：US16370584

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01L21/66 ,  G01R31/26

Abstract: The present invention relates to an inspection method for a micro LED, the method being configured to inspect whether the micro LED is defective.

公开(公告)号：US20190097090A1

公开(公告)日：2019-03-28

申请号：US16144857

申请日：2018-09-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

IPC: H01L33/48 ,  H01L33/58

Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.

公开(公告)号：US20190076854A1

公开(公告)日：2019-03-14

申请号：US15699681

申请日：2017-09-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: B05B1/18 ,  C25D11/04 ,  B05B1/00 ,  C23C16/455

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

公开(公告)号：US20180073999A1

公开(公告)日：2018-03-15

申请号：US15702673

申请日：2017-09-12

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N27/12 ,  B01L3/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/32

CPC classification number: G01N27/128 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/10 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/123 ,  B01L2300/161 ,  H01L2224/18 ,  H01L2924/15153 ,  H05K1/145 ,  H05K1/183 ,  H05K3/32 ,  H05K3/368 ,  H05K3/462 ,  H05K2201/10151

Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package, in which a sensing chip is packaged by using PCBs stacked on top of one another, whereby the thickness of the package slim can be kept slim, and at the same time, it can be manufactured at a low cost and can be easily manufactured.

公开(公告)号：US20240222418A1

公开(公告)日：2024-07-04

申请号：US18537830

申请日：2023-12-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L27/15 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L27/15 ,  H01L33/44 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: Proposed is a vertically stacked electronic device that enables the implementation of high-resolution displays by stacking individual LEDs vertically, and a method for manufacturing the vertically stacked electronic device.

公开(公告)号：US20240192253A1

公开(公告)日：2024-06-13

申请号：US18284524

申请日：2022-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06761 ,  G01R1/07342

Abstract: Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which the electrically conductive contact pin has improved physical or electrical characteristics.

公开(公告)号：US20230290740A1

公开(公告)日：2023-09-14

申请号：US18015711

申请日：2021-07-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L23/00 ,  H01L23/14 ,  H01L23/32 ,  H01L23/498 ,  H01L23/525 ,  H01L23/528 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L23/14 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/525 ,  H01L23/528 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: The present invention relates to an anodized film substrate base made of an anodized oxide film, an anodized film substrate part including a vertical conductive part provided inside the anodized film substrate base, an anodized film-based interposer having same, and a semiconductor package having same.

公开(公告)号：US20210199696A1

公开(公告)日：2021-07-01

申请号：US17131443

申请日：2020-12-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01R3/00 ,  G01R31/26 ,  G01R1/073

Abstract: A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.