-
公开(公告)号:US20230133968A1
公开(公告)日:2023-05-04
申请号:US17841603
申请日:2022-06-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghun YI , Sangwon Kim , Youngkook Kim
IPC: G06F3/14
Abstract: A display module configured to form a portion of a modular display device including a plurality of display modules includes first to third I2C communication interfaces and a processor. The processor is configured to: receive, via the first I2C communication interface from a first display module adjacent in a first direction, an x coordinate value of the first display module; receive, via the second I2C communication interface from a second display module adjacent in a second direction, a y coordinate value of the second display module; identify x and y coordinate values of the display module based on the received x and y coordinate values; transmit, via the third I2C communication interface, the identified x coordinate value to a third display module adjacent in a third direction; and transmit, via the third I2C communication interface, the identified y coordinate value to a fourth display module adjacent in a fourth direction.
-
公开(公告)号:US11626502B2
公开(公告)日:2023-04-11
申请号:US17398363
申请日:2021-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeonjin Shin , Sangwon Kim , Kyung-Eun Byun , Hyunjae Song , Keunwook Shin , Eunkyu Lee , Changseok Lee , Yeonchoo Cho , Taejin Choi
IPC: H01L29/45 , H01L29/40 , H01L29/15 , H01L27/108
Abstract: An interconnect structure for reducing a contact resistance, an electronic device including the same, and a method of manufacturing the interconnect structure are provided. The interconnect structure includes a semiconductor layer including a first region having a doping concentration greater than a doping concentration of a peripheral region of the semiconductor layer, a metal layer facing the semiconductor layer, a graphene layer between the semiconductor layer and the metal layer, and a conductive metal oxide layer between the graphene layer and the semiconductor and covering the first region.
-
公开(公告)号:US11360730B2
公开(公告)日:2022-06-14
申请号:US17230059
申请日:2021-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangwon Kim , Youngkook Kim , Jeongryeol Seo
Abstract: A modular display apparatus may include a docking station having a plurality of spaces; a plurality of back plates provided in the plurality of spaces; a plurality of power boards provided on the plurality of back plates, each power board of the plurality of power boards including an interface including a plurality of pins; a plurality of display apparatuses connected to the interfaces of the plurality of power boards and mounted in the plurality of spaces; and a processor.
-
公开(公告)号:US11356818B2
公开(公告)日:2022-06-07
申请号:US17084960
申请日:2020-10-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Keonyoung Lee , Sangwon Kim
Abstract: An electronic device according to various embodiments may include: a wireless communication circuit, and a processor operatively connected to the wireless communication circuit, wherein the processor is configured to: receive first system information broadcast from a first base station supporting a first cellular network using the wireless communication circuit, identify whether the first base station is broadcasting second system information including information of a second base station supporting a second cellular network neighboring the first base station from the first system information, establish a connection with the second base station based on the second system information being received using the wireless communication circuit based on identifying that the first base station is broadcasting the second system information, and establish the connection with the second base station based on third system information being received using the wireless communication circuit based on identifying that the first base station is not broadcasting the second system information.
-
55.
公开(公告)号:US11282792B2
公开(公告)日:2022-03-22
申请号:US16805890
申请日:2020-03-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Kun Jee , Hae-Jung Yu , Sangwon Kim , Un-Byoung Kang , Jongho Lee , Dae-Woo Kim , Wonjae Lee
IPC: H01L23/538 , H01L25/18 , H01L23/498
Abstract: A semiconductor package includes a package substrate, a plurality of package terminals disposed on the bottom surface of the package substrate, and an interposer substrate disposed on the top surface of the package substrate, a plurality of interposer terminals disposed on the bottom surface of the interposer substrate and electrically connected to the package substrate, a first semiconductor chip disposed on the top surface of the interposer substrate, a second semiconductor chip disposed on the top surface of the interposer substrate and disposed to be horizontally separated from the first semiconductor chip, a first plurality of signal pads disposed on the top surface of the interposer substrate and electrically connected to wiring in the interposer substrate and one or more circuits in the first semiconductor chip, a second plurality of signal pads disposed on the top surface of the interposer substrate and electrically connected to wiring in the interposer substrate and to one or more circuits in the second semiconductor chip, and a plurality of dummy pads disposed outside of an area occupied by the first semiconductor chip or the second semiconductor chip from a top-down view and disposed on the top surface of the interposer substrate. Each pad of the first plurality of signal pads and the second plurality of signal pads is configured to transfer signals between the interposer substrate and a respective semiconductor chip, and each pad of the dummy pads is not configured to transfer signals between the interposer substrate and any semiconductor chip disposed thereon.
-
公开(公告)号:US20220077154A1
公开(公告)日:2022-03-10
申请号:US17318563
申请日:2021-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Huijung Kim , Minwoo Kwon , Sangyeon Han , Sangwon Kim , Junsoo Kim , Hyeonjin Shin , Eunkyu Lee
IPC: H01L27/108 , H01L29/78 , H01L29/423
Abstract: A semiconductor device includes a substrate including an active region, a gate structure disposed in a gate trench in the substrate, a bit line disposed on the substrate and electrically connected to the active region on one side of the gate structure, and a capacitor disposed on the bit line and electrically connected to the active region on another side of the gate structure. The gate structure includes a gate dielectric layer disposed on bottom and inner side surfaces of the gate trench, a conductive layer disposed on the gate dielectric layer in a lower portion of the gate trench, sidewall insulating layers disposed on the gate dielectric layer, on an upper surface of the conductive layer, a graphene conductive layer disposed on the conductive layer, and a buried insulating layer disposed between the sidewall insulating layers on the graphene conductive layer.
-
57.
公开(公告)号:US11129012B2
公开(公告)日:2021-09-21
申请号:US16605662
申请日:2018-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangwon Kim
Abstract: The disclosure relates to technology for a sensor network, machine to machine communication (M2M), machine type communication (MTC), and the Internet of things (IoT). The disclosure may be used for an intelligent service (a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of the technology. A mobility management entity (MME) apparatus in a wireless communication system includes a transmission/reception unit and a control unit functionally connected to the transmission/reception unit, wherein the control unit is configured to: determine a timer value used to allow a terminal supporting a power saving mode (PSM) to perform transition from a PSM state to an idle mode state; and control the transmission/reception unit so as to transmit, to the terminal, a message including information related to the determined timer value, and the timer value is determined on the basis of one of a mobile terminated (MT) data occurrence expectation time point and a mobile terminated data reception target value, pre-configured in the MME.
-
公开(公告)号:US11086223B2
公开(公告)日:2021-08-10
申请号:US16426046
申请日:2019-05-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeonjin Shin , Sangwon Kim , Minsu Seol , Seongjun Park , Yeonchoo Cho
Abstract: A hardmask composition may include graphene nanoparticles having a size in a range of about 5 nm to about 100 nm and a solvent.
-
公开(公告)号:US11034847B2
公开(公告)日:2021-06-15
申请号:US15944920
申请日:2018-04-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minsu Seol , Sangwon Kim , Hyeonjin Shin , Dongwook Lee , Seongjun Park , Yunseong Lee , Seongjun Jeong , Alum Jung
IPC: C09D7/63 , G03F7/11 , G03F7/09 , G03F7/07 , G03F7/40 , C07F3/02 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/38 , H01L21/311 , H01L21/3213 , G03F7/075
Abstract: Provided are a hardmask composition including a structure represented by Formula 1 and a solvent, a method of forming a pattern using the hardmask composition, and a hardmask formed from the hardmask composition. wherein in Formula 1, R1 to R8, X, and M are described in detail in the detailed description.
-
公开(公告)号:US10825378B2
公开(公告)日:2020-11-03
申请号:US16746351
申请日:2020-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangwon Kim , Youngkook Kim , Jeongryeol Seo
Abstract: Provided is an electronic apparatus and a controlling method thereof the electronic apparatus includes: an interface connectable to a modular display apparatus including a plurality of display cabinets divided into a plurality of groups, the interface including a plurality of ports connectable to the plurality of groups; and a processor configured to: scale an image received from an external device based on a resolution of the modular display apparatus, re-scale the scaled image based on a resolution based on a user input, identify at least one group, among the plurality of groups, based on a position in which the re-scaled image is to be displayed, decompose the re-scaled image based on the identified at least one group, and control to transmit the decomposed re-scaled image to each of the identified at least one group through at least one port connected to the identified at least one group.
-
-
-
-
-
-
-
-
-