公开(公告)号：US20080303044A1

公开(公告)日：2008-12-11

申请号：US12050089

申请日：2008-03-17

申请人： Tatsuoki Kohno ,  Akiko Suzuki ,  Shinetsu Fujieda ,  Toshihide Takahashi ,  Hatsuo Takezawa

发明人： Tatsuoki Kohno ,  Akiko Suzuki ,  Shinetsu Fujieda ,  Toshihide Takahashi ,  Hatsuo Takezawa

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/501 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light-emitting device includes a semiconductor light-emitting element which is capable of emitting light, a fluorescent substance which is capable of absorbing at least part of light emitted from the semiconductor light-emitting element and also capable of subsequently converting the wavelength of the absorbed light and emitting the light having a converted wavelength, and a light-transmissive sealing material encapsulating the semiconductor light-emitting element, formed of an inorganic material having, at least partially, a silicon-nitrogen linkage and including a fluorescent substance.

摘要翻译： 一种半导体发光器件包括能够发光的半导体发光元件，能够吸收从半导体发光元件发出的光的至少一部分的荧光物质，并且能够随后将波长 吸收的光并发射具有转换波长的光，以及封装半导体发光元件的透光密封材料，其由至少部分为硅 - 氮键并包括荧光物质的无机材料形成。

公开(公告)号：US20050048347A1

公开(公告)日：2005-03-03

申请号：US10879213

申请日：2004-06-30

申请人： Masahiro Takashita ,  Yoshihiko Nakano ,  Shinetsu Fujieda

发明人： Masahiro Takashita ,  Yoshihiko Nakano ,  Shinetsu Fujieda

IPC分类号： H01M8/02 ,  H01B1/24

CPC分类号： H01M8/0204 ,  H01M8/0221 ,  H01M8/0226

摘要： The present invention provides a separator for fuel cell, containing an inorganic filler and a thermosetting resin, and having glass transition temperature of 20° C. or less and 100° C. or more, coefficient of thermal expansion at 20° C. of 0.4×10−5/° C. or more and 4×10−5/° C. or less, and bending modulus of elasticity at 20° C. of 5 GPa or more and 30 GPa or less.

摘要翻译： 本发明提供一种燃料电池用隔板，其含有无机填料和热固性树脂，玻璃化转变温度为20℃以下且100℃以上，20℃时的热膨胀系数为0.4 x 10 -5℃/℃以上4×10 -5 /℃以下，20℃下的弯曲弹性模量为5GPa以上且30GPa以下。

公开(公告)号：US5998509A

公开(公告)日：1999-12-07

申请号：US980343

申请日：1997-11-28

申请人： Rumiko Hayase ,  Shinetsu Fujieda ,  Yasuyuki Hotta ,  Shinji Murai

发明人： Rumiko Hayase ,  Shinetsu Fujieda ,  Yasuyuki Hotta ,  Shinji Murai

IPC分类号： C08G59/40 ,  C08G77/16 ,  C08L63/00 ,  C08L83/04 ,  H01L23/29 ,  H01L23/31 ,  C08K3/34 ,  C08L63/02

CPC分类号： C08L63/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253

摘要： A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. The mixing ratio of the inorganic filler should preferably be 10 to 95% by weight based on the entire resin composition.

摘要翻译： 一种树脂组合物，其包含（a）环氧化合物，（b）包含其侧链上具有酚羟基的聚硅氧烷树脂的固化剂，和（c）无机填料。 基于整个树脂组合物，无机填料的混合比优选为10〜95重量％。

公开(公告)号：US5912320A

公开(公告)日：1999-06-15

申请号：US939661

申请日：1997-09-29

申请人： Yasuyuki Hotta ,  Shinetsu Fujieda ,  Tetsuo Okuyama

发明人： Yasuyuki Hotta ,  Shinetsu Fujieda ,  Tetsuo Okuyama

IPC分类号： C08K3/00 ,  C08K5/5435 ,  C08L45/00 ,  C08L81/02 ,  H01L23/29 ,  H01L23/31 ,  C08G75/00

CPC分类号： H01L23/293 ,  C08K5/5435 ,  C08L81/02 ,  H01L2224/13 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12044 ,  Y10T428/31609 ,  Y10T428/31612

摘要： A polyphenylene sulfide resin composition, which comprises, in addition to a polyphenylene sulfide resin and an inorganic filler, at least one whisker selected from the group consisting of titania whisker and aluminum borate whisker.

摘要翻译： 一种聚苯硫醚树脂组合物，其除了聚苯硫醚树脂和无机填料之外还包含至少一种选自二氧化钛晶须和硼酸铝晶须的晶须。

公开(公告)号：US5637667A

公开(公告)日：1997-06-10

申请号：US451065

申请日：1995-05-25

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

IPC分类号： C08G77/60 ,  C08L63/00 ,  C08L79/08 ,  C08L83/16 ,  C08L101/00 ,  C08G77/04

CPC分类号： C08L63/00 ,  C08G77/60 ,  C08L101/00 ,  C08L79/085 ,  C08L83/16

摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.

摘要翻译： 一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。

公开(公告)号：US5438113A

公开(公告)日：1995-08-01

申请号：US40267

申请日：1993-03-30

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

IPC分类号： C08G77/60 ,  C08L63/00 ,  C08L79/08 ,  C08L83/16 ,  C08L101/00 ,  C08G77/04

CPC分类号： C08L63/00 ,  C08G77/60 ,  C08L101/00 ,  C08L79/085 ,  C08L83/16

摘要： A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).

摘要翻译： 含有具有至少一个酚羟基的硅烷化合物a）和具有至少两个能够与硅烷化合物的酚羟基反应的官能团的有机化合物b）的热固性树脂组合物，其中硅烷化合物a）为 相对于100重量份的有机化合物b），加入量大于10重量份。

公开(公告)号：US4916174A

公开(公告)日：1990-04-10

申请号：US243719

申请日：1988-09-13

申请人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

发明人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

IPC分类号： C08L61/10 ,  C08L9/00 ,  C08L51/04 ,  C08L55/02 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L61/06 ,  C08L63/00

摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

公开(公告)号：US4719255A

公开(公告)日：1988-01-12

申请号：US760770

申请日：1985-07-31

申请人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

发明人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

IPC分类号： C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L63/00

摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。