公开(公告)号：US20080261381A1

公开(公告)日：2008-10-23

申请号：US12081297

申请日：2008-04-14

申请人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Kouichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

发明人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Kouichi Tanaka ,  Makoto Kawai ,  Yuuji Tobisaka

IPC分类号： H01L21/86

CPC分类号： H01L21/76254 ,  H01L21/3046 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/68359

摘要： When manufacturing a bonded substrate using an insulator substrate as a handle wafer, there is provided a method for manufacturing a bonded substrate which can be readily removed after carried and after mounted by roughening a back surface of the bonded substrate (corresponding to a back surface of the insulator substrate) and additionally whose front surface can be easily identified like a process of a silicon semiconductor wafer in case of the bonded substrate using a transparent insulator substrate as a handle wafer.There is provided a method for manufacturing a bonded substrate in which an insulator substrate is used as a handle wafer and a donor wafer is bonded to a front surface of the insulator substrate, the method comprises at least that a sandblast treatment is performed with respect to a back surface of the insulator substrate.

摘要翻译： 当制造使用绝缘体基板作为处理晶片的键合衬底时，提供了一种用于制造键合衬底的方法，其可以在承载和安装之后通过粗糙化粘合衬底的背面（对应于 绝缘体基板），另外，在使用透明绝缘体基板作为处理晶片的键合衬底的情况下，可以容易地识别其表面像硅半导体晶片的工艺。 提供了一种用于制造键合衬底的方法，其中使用绝缘体衬底作为把手晶片，并且施主晶片结合到绝缘体衬底的前表面，该方法至少包括相对于 绝缘体基板的背面。

公开(公告)号：US20080254597A1

公开(公告)日：2008-10-16

申请号：US12076923

申请日：2008-03-25

申请人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Makoto Kawai ,  Yuuji Tobisaka ,  Koichi Tanaka

发明人： Shoji Akiyama ,  Yoshihiro Kubota ,  Atsuo Ito ,  Makoto Kawai ,  Yuuji Tobisaka ,  Koichi Tanaka

IPC分类号： H01L21/30

CPC分类号： H01L21/76256 ,  H01L27/12

摘要： A method for manufacturing an SOI substrate superior in film thickness uniformity and resistivity uniformity in a substrate surface of a silicon layer having a film thickness reduced by an etch-back method is provided. After B ions is implanted into a front surface of a single-crystal Si substrate 10 to form a high-concentration boron added p layer 11 having a depth L in the outermost front surface, the single-crystal Si substrate 10 is appressed against a quartz substrate 20 to be bonded at a room temperature. Chemical etching is performed with respect to the single-crystal Si substrate 10 from a back surface thereof to set its thickness to L or below. A heat treatment is carried out with respect to an SOI substrate in a hydrogen containing atmosphere to outwardly diffuse B from the high-concentration boron added p layer 11, thereby acquiring a boron added p layer 12 having a desired resistance value. During this heat treatment, B in an Si crystal is diffused to the outside of the crystal in a state where it is coupled with hydrogen in the atmosphere, and a B concentration in the high-concentration boron added p layer 11 is reduced. In regard to a heat treatment temperature at this time, in view of a softening point of the insulative substrate, an upper limit of the heat treatment temperature is set to 1250° C., and 700° C. is selected as a lower limit of the temperature at which B can be diffused.

摘要翻译： 提供一种制造SOI衬底的方法，该SOI衬底具有通过蚀刻方法减小的膜厚度的硅层的衬底表面中的膜厚度均匀性和电阻率均匀性优异的SOI衬底。 在将B离子注入到单晶Si衬底10的前表面中以形成在最外表面具有深度L的高浓度硼添加p层11之后，将单晶Si衬底10贴在石英 基板20在室温下结合。 从其背面对单晶硅基板10进行化学蚀刻，将其厚度设定为L以下。 对含氢气氛中的SOI衬底进行热处理，从高浓度硼添加p层11向外扩散B，从而获得具有所需电阻值的添加硼的p层12。 在该热处理中，Si结晶中的B在与大气中的氢相结合的状态下扩散到晶体外部，并且在高浓度硼添加p层11中的B浓度降低。 就此时的热处理温度而言，考虑到绝缘基板的软化点，将热处理温度的上限设定为1250℃，选择700℃为下限值 B可以扩散的温度。

公开(公告)号：US20060276631A1

公开(公告)日：2006-12-07

申请号：US11415575

申请日：2006-05-02

申请人： Makoto Kawai ,  Tadashi Okada ,  Fukiko Atsumi ,  Masao Shibata ,  Motoki Kuhara

发明人： Makoto Kawai ,  Tadashi Okada ,  Fukiko Atsumi ,  Masao Shibata ,  Motoki Kuhara

IPC分类号： C07K14/74 ,  C07K16/28 ,  C07H21/04

CPC分类号： C07K14/705 ,  C07K16/28

摘要： A mast cell surface antigen, DNA thereof and an antibody against the antigen are provided. The amino acid sequence of this mast cell surface antigen is the translation of the coding region of its DNA. The base sequence of this DNA has been clarified in the following manner. Namely, mast cells obtained by incubating cord blood monocular cells are co-incubated with primary culture of fibroblasts to give connective tissue type mast cells (MC-TC). Then mRNA is extracted from this MC-TC cell extraction and a cDNA library is constructed therefrom. Immunological screening is carried out with the use of anti-MC-TC antiserum and the base sequence of the positive clone thus obtained is identified. Owing to the clarification of the amino acid sequence of this mast cell antigen, it becomes possible to reveal the role of mast cells in the pathology of allergic diseases and thus an antibody against mast cells can be easily obtained.

摘要翻译： 提供肥大细胞表面抗原，其DNA和针对抗原的抗体。 该肥大细胞表面抗原的氨基酸序列是其DNA编码区的翻译。 该DNA的碱基序列已经以下述方式进行了说明。 即，将通过孵育脐带血单核细胞获得的肥大细胞与成纤维细胞的原代培养物共温育以产生结缔组织型肥大细胞（MC-TC）。 然后从该MC-TC细胞提取中提取mRNA，并由其构建cDNA文库。 使用抗MC-TC抗血清进行免疫筛选，鉴定得到的阳性克隆的碱基序列。 由于这种肥大细胞抗原的氨基酸序列的澄清，可以揭示肥大细胞在过敏性疾病的病理学中的作用，因此可以容易地获得抗肥大细胞的抗体。

公开(公告)号：US06734306B2

公开(公告)日：2004-05-11

申请号：US10010863

申请日：2001-12-05

申请人： Yasuhiro Katsu ,  Makoto Kawai ,  Hiroki Koike ,  Seiji Nukui

发明人： Yasuhiro Katsu ,  Makoto Kawai ,  Hiroki Koike ,  Seiji Nukui

IPC分类号： C07D40114

CPC分类号： C07D451/02 ,  C07D401/12 ,  C07D401/14 ,  C07D451/04 ,  C07D453/02 ,  C07D487/08

摘要： This invention provides a compound of the formula (I): or the pharmaceutically acceptable salts thereof wherein X1 and X2 are halo; R1 and R2 are independently hydrogen or C1-4 alkyl; R3 and R4 are each hydrogen or halo; and R5 is (a) —C3-9 diazacycloalkyl optionally substituted with C5-11 azabicycloalkyl; (b) —C3-9 azacycloalkyl-NH—(C5-11 azabicycloalkyl optionally substituted with C1-4 alkyl); (c) —NH—C1-3 alkyl-C(O)—C5-11 diazabicycloalkyl; (d) —NH—C1-3 alkyl-C(O)—NH—C5-11 azabicycloalkyl, the C5-11 azabicycloalkyl being optionally substituted with C1-4 alkyl; (e) —C3-9 azacycloalkyl optionally substituted with C3-9 azacycloalkyl; or (f) —NH—C1-5 alkyl-NH—C(O)—C4-9 cycloalkyl-NH2. These compounds are useful for the treatment of medical conditions mediated by bradykinin such as inflammation, allergic rhinitis, pain, etc. This invention also provides a pharmaceutical composition comprising the above compound.

摘要翻译： 本发明提供式（I）化合物或其药学上可接受的盐，其中X 1和X 2为卤素; R 1和R 2独立地是氢或C 1-4烷基; R 3和R 4各自为氢或卤素; （b）-C3-9氮杂环烷基-NH-（任选被C 1-4烷基取代的C 5-10氮杂双环烷基）;（c）-C（= NH-C 1-3烷基-C（O）-C 5-11二氮杂双环烷基;（d）-NH-C 1-3烷基-C（O）-NH-C 5-11氮杂双环烷基，C 5-11氮杂双环烷基任选被C 1 -4-烷基;（e）任选被C 3-9氮杂环烷基取代的-C3-9氮杂环烷基; 或（f）-NH-C 1-5烷基-NH-C（O）-C 4-9环烷基-NH 2。这些化合物可用于治疗由缓激肽介导的医学病症如炎症，过敏性鼻炎，疼痛等。 本发明还提供了包含上述化合物的药物组合物。

公开(公告)号：US06653313B2

公开(公告)日：2003-11-25

申请号：US09903157

申请日：2001-07-11

申请人： Mitsuhiro Kawamura ,  Makoto Kawai ,  Yuji Shishido ,  Tomoki Kato ,  Yasuhiro Katsu ,  Takafumi Ikeda ,  Noriaki Murase

发明人： Mitsuhiro Kawamura ,  Makoto Kawai ,  Yuji Shishido ,  Tomoki Kato ,  Yasuhiro Katsu ,  Takafumi Ikeda ,  Noriaki Murase

IPC分类号： A61K31496

CPC分类号： A61K31/46 ,  A61K31/496 ,  C07D451/04 ,  Y02A50/411

摘要： The present invention relates to compounds of the formula wherein each A is independently halo; Y is —(CH2)m—, —C(O)— or —S(O)—; R1 and R2 are independently C1-4 alkyl; R3 is substituted azacycloalkyl etc.; R4 is phenyl substituted at the 2-position with a substituent selected from substituted C1-7 alkyl, substituted C1-7 alkoxy, amine, etc; R5 is hydrogen or C1-4 alkyl; m is 0, 1 or 2; and n is 0, 1, 2, 3, 4 or 5. The present invention also relates to pharmaceutical compositions containing such compounds and to the use of such compounds in the treatment and prevention of inflammation, asthma, allergic rhinitis, pain and other disorders.

摘要翻译： 本发明涉及各种化合物，每个A独立地是卤素; Y是 - （CH 2）m - ， - C（O） - 或-S（O） - ; R 1和R 2独立地是C 1-4烷基; R 3是取代的氮杂环烷基等; R 4是在2-位上被取代基取代的C 1-7烷基，取代的C 1-7烷氧基，胺等取代的苯基; R 5是氢或C 1-4烷基; m为0,1或2; 本发明还涉及含有这些化合物的药物组合物以及这些化合物在治疗和预防炎症，哮喘，变应性鼻炎，疼痛和其它疾病中的用途 。

公开(公告)号：US5743005A

公开(公告)日：1998-04-28

申请号：US700755

申请日：1996-08-09

申请人： Osamu Nakao ,  Masanori Yasutake ,  Wataru Hirai ,  Makoto Kawai

发明人： Osamu Nakao ,  Masanori Yasutake ,  Wataru Hirai ,  Makoto Kawai

IPC分类号： B23P19/00 ,  H05K13/00 ,  H05K13/04 ,  H05K3/30 ,  H05K13/02 ,  H05K13/08

CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/53052 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A component mounting apparatus and method for mounting components on to-be-mounted positions of works, includes a carrying device for continuously and successively carrying the works in a working area, and a first component-mounting device for picking up one component from component supply units in a first component supply section and mounting the picked-up component on the to-be-mounted position of one of the works being continuously and successively carried in the work area.

摘要翻译： 一种用于将部件安装在工件的待安装位置的部件安装装置和方法，包括用于在工作区域中连续和连续地承载工件的承载装置，以及用于从部件供给拾取一个部件的第一部件安装装置 单元在第一部件供应部分中并且将拾取部件安装在其中一个工件的待安装位置上，并连续并连续地携带在工作区域中。

公开(公告)号：US5564183A

公开(公告)日：1996-10-15

申请号：US129604

申请日：1993-09-30

申请人： Kenichi Satou ,  Makoto Kawai ,  Yoshifumi Nakao ,  Satoshi Masuda ,  Koichi Kanematsu ,  Setsuo Horimoto

发明人： Kenichi Satou ,  Makoto Kawai ,  Yoshifumi Nakao ,  Satoshi Masuda ,  Koichi Kanematsu ,  Setsuo Horimoto

IPC分类号： B23K31/12 ,  G01R31/28 ,  H05K3/12 ,  H05K3/34 ,  H05K13/08 ,  G06F19/00

CPC分类号： H05K13/08 ,  B23K31/12 ,  B23K2201/42 ,  G01R31/2806 ,  G01R31/2808 ,  H05K3/1216 ,  H05K3/3484 ,  Y10T29/49004 ,  Y10T29/49144 ,  Y10T29/53061 ,  Y10T29/53178

摘要： An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.

摘要翻译： 组装线包括用于在电路板的焊盘上印刷焊料的打印装置，用于将电气部件安装在焊料的预定位置的安装装置，以及用于将焊盘焊接到部件的端子的焊接装置。 监视项目检测装置检测预定的待监控的项目和打印，安装或焊接装置中使用的设备，并且控制装置参照不是的警告标准来分析设备的状况和板的质量 超过故障标准，然后相应地动态地控制各种设备。

公开(公告)号：US5382469A

公开(公告)日：1995-01-17

申请号：US72233

申请日：1993-06-03

申请人： Yoshihiro Kubota ,  Makoto Kawai ,  Shinji Kojima ,  Ken-ichi Arai

发明人： Yoshihiro Kubota ,  Makoto Kawai ,  Shinji Kojima ,  Ken-ichi Arai

IPC分类号： B23Q3/15 ,  C04B35/117 ,  H01L21/683 ,  H02N13/00 ,  B32B18/00

CPC分类号： H01L21/6831 ,  C04B35/117 ,  Y10T279/23 ,  Y10T428/26

摘要： Proposed is a ceramic-made electrostatic chuck consisting of two insulating ceramic layers and a metallic electrode layer integrally sandwiched between the two insulating layers, which has a very quick response characteristic to turning-on and -off of the electric voltage applied to the electrodes without affecting the very high electrostatic attracting force. This improvement can be obtained by forming the insulating ceramic layers from a specific ceramic material consisting of a highly resistive ceramic material such as alumina and the like and titanium nitride admixed with the former in an amount not exceeding 5% by weight but sufficient to impart the insulating ceramic layers with a volume resistivity in the range from 1.times.10.sup.8 to 1.times.10.sup.13 ohm.cm at 20.degree. C.

摘要翻译： 提出了一种由两个绝缘陶瓷层和一体地夹在两个绝缘层之间的金属电极层组成的陶瓷制静电卡盘，其对施加到电极的电压的导通和断开具有非常快的响应特性，而没有 影响非常高的静电吸引力。 这种改进可以通过从由高电阻陶瓷材料如氧化铝等组成的特定陶瓷材料和与前者混合的氮化钛以不超过5重量％的量形成绝缘陶瓷层而获得，但足以使 在20℃下体积电阻率为1×10 8至1×10 13欧姆·厘米的绝缘陶瓷层。

公开(公告)号：US4831878A

公开(公告)日：1989-05-23

申请号：US44833

申请日：1987-05-01

申请人： Chikahisa Hayashi ,  Makoto Kawai ,  Yoshikazu Hirose ,  Tatsuya Terayama ,  Nobutsugu Miyazaki ,  Hideo Yamamoto

发明人： Chikahisa Hayashi ,  Makoto Kawai ,  Yoshikazu Hirose ,  Tatsuya Terayama ,  Nobutsugu Miyazaki ,  Hideo Yamamoto

IPC分类号： G01F23/00 ,  G01F23/30 ,  G01F23/68

CPC分类号： G01F23/68 ,  G01F23/00 ,  G01F23/30

摘要： A level gage mounting structure comprising a level gage secured to an upper member of a liquid storage container and vertically extending inside the container, the level gage having its lower end supported on the bottom surface of the container, and a deformable member provided between the upper member and the upper end of the level gage to support the upper end of the level gage, the deformable member being deformable vertically in unison with any vertical deformation of the upper and bottom surfaces of the container, thus enabling the lower end of the level gage to be in contact with the bottom surface of the container at all times.

摘要翻译： 一种液位计安装结构，包括固定到液体储存容器的上部构件并在容器内垂直延伸的液位计，所述液位计的下端支撑在容器的底表面上，并且可变形构件设置在上部 水平计的上端和水平计的上端支撑水位计的上端，可变形构件与容器的上表面和底表面的任何垂直变形垂直可垂直变形，从而使水平计的下端 随时与容器的底面接触。

公开(公告)号：US4627280A

公开(公告)日：1986-12-09

申请号：US739476

申请日：1985-05-30

申请人： Chikahisa Hayashi ,  Makoto Kawai ,  Mikio Adachi

发明人： Chikahisa Hayashi ,  Makoto Kawai ,  Mikio Adachi

IPC分类号： G01F23/76 ,  G01R33/00

CPC分类号： G01F23/76

摘要： The present invention relates to a liquid level meter, comprising a coil having a core, a float which is provided at the external circumference of coil so that it can move in the longitudinal direction along the same core and comprises a conductor ring, a detector which detects change of inductance of coil in accordance with movement of said float namely conductor ring, a converting circuit which converts change of inductance detected by the detector into change of voltage and a liquid level indicator which is driven by a drive circuit in accordance with such conversion.

摘要翻译： 液位计本发明涉及一种液位计，包括一个具有芯体的线圈，一个设置在线圈外圆周处的浮子，使其能沿着同一个芯沿长度方向移动，并包括导体环，检测器 根据所述浮子即导体环的移动来检测线圈的电感变化，转换电路，其将由检测器检测的电感变化转换为电压变化;以及液位指示器，其由根据这种转换的驱动电路驱动 。