利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

41 条记录 (耗时 0.032 秒)

    System for inspecting an apparatus of a printed circuit board
    2.
    发明授权
    System for inspecting an apparatus of a printed circuit board 失效
    用于检查印刷电路板外观的系统

    公开(公告)号：US06445813B1

    公开(公告)日：2002-09-03

    申请号：US09566741

    申请日：2000-05-09

    申请人： Kazuhiro Ikurumi ,  Masanori Yasutake ,  Osamu Nakao ,  Masaharu Tsujimura ,  Toshihiko Tsujikawa ,  Kenji Okamoto

    发明人： Kazuhiro Ikurumi ,  Masanori Yasutake ,  Osamu Nakao ,  Masaharu Tsujimura ,  Toshihiko Tsujikawa ,  Kenji Okamoto

    IPC分类号： G06K900

    CPC分类号： G06T7/0004 ,  G01R31/2813 ,  G01R31/309 ,  G06T2207/30141

    摘要： A motion of a printed circuit board (1) is detected by an encoder (4) arranged aside a belt conveyer (2), and the encoder generates a detection signal (S3) which activates a timing signal generator unit (5) for generating an image pickup start timing signal which is fed to a time measuring unit (6) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S1). According to the image storing time, the image signal (S2) generated by the line CCD camera (3) is normalized by the normalizing calculation means (7), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

    摘要翻译： 印刷电路板（1）的运动由布置在带式输送机（2）的编码器（4）检测，并且编码器产生检测信号（S3），该检测信号激活定时信号发生器单元（5） 图像拾取开始定时信号，被馈送到用于测量对应于摄像开始信号的时间间隔的图像存储时间的时间测量单元（6）。 根据图像存储时间，由CCD摄像机（3）生成的图像信号（S2）由归一化计算装置（7）归一化，然后通过图像识别来判断印刷电路板的安装状态 （B），从而以低成本和高精度实现简单方便的机构。

    MAGNETIC SENSOR MODULE AND PISTON POSITION DETECTOR
    5.
    发明申请
    MAGNETIC SENSOR MODULE AND PISTON POSITION DETECTOR 审中-公开
    磁传感器模块和活塞位置检测器

    公开(公告)号：US20100090692A1

    公开(公告)日：2010-04-15

    申请号：US12528585

    申请日：2008-02-08

    申请人： Kazuhisa Itoi ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao

    发明人： Kazuhisa Itoi ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao

    IPC分类号： G01R33/02

    CPC分类号： G01R33/09 ,  G01D5/147 ,  G01R33/0011 ,  G01R33/07 ,  G01R33/072

    摘要： A magnetic sensor module which includes: a semiconductor substrate including an integrated circuit for switching operation; a magneto-resistive element which is disposed on a first surface of the semiconductor substrate and has a magneto-sensitive direction in a direction along the first surface; and a bias magnetic field applying member provided on the semiconductor substrate and disposed on a surface which is parallel to the first surface, wherein: the bias magnetic field applying member is magnetized in a direction along the surface on which the bias magnetic field applying member is disposed; and when no external magnetic field is applied, the bias magnetic field applying member applies a bias magnetic field in the direction along the first surface on which the magneto-resistive element is provided.

    摘要翻译： 一种磁传感器模块，包括：包括用于切换操作的集成电路的半导体衬底; 磁阻元件，其设置在所述半导体衬底的第一表面上，并且沿着所述第一表面的方向具有磁敏方向; 以及偏置磁场施加构件，其设置在所述半导体基板上并配置在与所述第一面平行的面上，其中：所述偏置磁场施加构件沿着所述偏置磁场施加构件的表面的方向被磁化， 处置 并且当没有施加外部磁场时，偏置磁场施加构件沿着设置有磁阻元件的第一表面的方向施加偏置磁场。

    MAGNETIC DEVICE
    7.
    发明申请
    MAGNETIC DEVICE 失效
    磁性装置

    公开(公告)号：US20090066326A1

    公开(公告)日：2009-03-12

    申请号：US12267169

    申请日：2008-11-07

    申请人： Kazuhisa ITOI ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao ,  Shigekazu Kawai

    发明人： Kazuhisa ITOI ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao ,  Shigekazu Kawai

    IPC分类号： G01R33/00

    CPC分类号： G01R33/09 ,  G01R33/0011 ,  G01R33/02 ,  G01R33/063 ,  G01R33/18 ,  H01L43/12

    摘要： A magnetic device comprises a magnetic element, a first magnetic field applying means, and a second magnetic field applying means. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field applying means create a magnetic field in one direction from the first magnetic field applying means toward the second magnetic field applying means. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field applying means.

    摘要翻译： 磁性装置包括磁性元件，第一磁场施加装置和第二磁场施加装置。 第一和第二磁场施加装置设置在磁性元件的彼此相对的两侧。 磁性元件例如是在非磁性基板上以曲折形状形成软磁性膜的元件。 第一和第二磁场施加装置在从第一磁场施加装置朝向第二磁场施加装置的一个方向上产生磁场。 因此，一个方向上的偏置磁场被施加到设置在第一和第二磁场施加装置之间的磁性元件中的整个软磁膜上。

    Multilayer board manufacturing method
    8.
    发明授权
    Multilayer board manufacturing method 有权
    多层板制造方法

    公开(公告)号：US07421779B2

    公开(公告)日：2008-09-09

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/30

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Multilayer board and its manufacturing method
    9.
    发明申请
    Multilayer board and its manufacturing method 有权
    多层板及其制造方法

    公开(公告)号：US20060191133A1

    公开(公告)日：2006-08-31

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/36 ,  H05K3/20

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。