公开(公告)号：US20100060298A1

公开(公告)日：2010-03-11

申请号：US12447510

申请日：2007-08-03

申请人： Yutaka Harada ,  Keiji Kanehara ,  Yoshio Yamazaki

发明人： Yutaka Harada ,  Keiji Kanehara ,  Yoshio Yamazaki

IPC分类号： G01R27/26 ,  G01R33/12

CPC分类号： G01F1/584 ,  G01F1/582

摘要： The surface of a signal electrode is treated as substrate treatment. For example, an oxide film on the surface of the signal electrode is removed for roughing, and the roughened surface is used as a surface treated face. A coating of a fluororesin is provided on the surface treated face for lining or thermal welding to the lining material. A signal electrode is provided in the resin lining. Since the oxide film has been removed from the surface of the signal electrode for roughening, the adhesive force of the coating of the fluororesin is increased. The fluororesin coating and the resin lining melt each other, and, as a result, the fluororesin coating is strongly bonded to the resin lining, whereby the adhesion between the signal electrode and the resin lining can be increased without opening a hole in the signal electrode. A method may also be adopted in which a primer film is formed by substrate treatment on the surface of the signal electrode.

摘要翻译： 将信号电极的表面作为衬底处理。 例如，除去信号电极表面的氧化膜进行粗加工，将粗糙面用作表面处理面。 在表面处理面上设置氟树脂的涂层，用于对衬里材料进行衬里或热焊接。 信号电极设置在树脂衬里中。 由于氧化膜已经从信号电极的表面去除以粗化，所以氟树脂的涂层的粘附力增加。 氟树脂涂层和树脂衬里彼此熔融，结果，氟树脂涂层牢固地结合到树脂衬里，由此可以增加信号电极和树脂衬里之间的粘附，而不会在信号电极中打开孔 。 还可以采用在信号电极的表面上通过基板处理形成底漆膜的方法。

公开(公告)号：US07582944B2

公开(公告)日：2009-09-01

申请号：US11698100

申请日：2007-01-26

申请人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

发明人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

IPC分类号： H01L31/0232

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014

摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光​​学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。

公开(公告)号：US20090171016A1

公开(公告)日：2009-07-02

申请号：US12085360

申请日：2006-11-17

申请人： Koichi Sato ,  Yutaka Harada ,  Takehito Sasaoka

发明人： Koichi Sato ,  Yutaka Harada ,  Takehito Sasaoka

IPC分类号： C08L77/00 ,  C07C267/00 ,  C08L75/00

CPC分类号： C08K5/29

摘要： It is the purpose of the present invention to provide a carbodiimide compound exhibiting superior water resistance and having good storage stability when it is applied to a waterborne coating composition, and a waterborne curable resin composition comprising thereof, and the carbodiimide compound of the present invention is represented by the following general formula (1): wherein X represents a bifunctional organic group containing at least one carbodiimide group, Y represents a structure in which a hydroxyl group is eliminated from a polyalkylene glycol monoalkyl ether, R0 represents hydrogen or an alkyl group having 2 or less carbon atoms, R1 represents an alkylene group having 4 or less carbon atoms, n represents 0 or 1 and m represents an integer of 11 or more, and wherein the repeating number of oxyalkylene group in the polyalkylene glycol monoalkyl ether is 6 to 40.

摘要翻译： 本发明的目的是提供一种在应用于水性涂料组合物时具有优异的耐水性和良好的储存稳定性的碳二亚胺化合物及其包含的水性固化性树脂组合物，本发明的碳二亚胺化合物为 由以下通式（1）表示：其中X表示含有至少一个碳二亚胺基团的双官能有机基团，Y表示从聚亚烷基二醇单烷基醚中除去羟基的结构，R 0表示氢或具有 2个以下的碳原子，R1表示碳原子数4以下的亚烷基，n表示0或1，m表示11以上的整数，聚亚烷基二醇单烷基醚中的氧化烯基的重复数为6〜 40。

公开(公告)号：US20050006749A1

公开(公告)日：2005-01-13

申请号：US10916445

申请日：2004-08-12

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L21/4763 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 接线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US06812573B2

公开(公告)日：2004-11-02

申请号：US09886971

申请日：2001-06-25

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 布线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US06313532B1

公开(公告)日：2001-11-06

申请号：US09381381

申请日：1999-09-20

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 布线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US5856377A

公开(公告)日：1999-01-05

申请号：US814773

申请日：1997-03-10

申请人： Haruhiko Sato ,  Yutaka Harada

发明人： Haruhiko Sato ,  Yutaka Harada

IPC分类号： C08F291/00 ,  C08J3/12 ,  C09D5/03 ,  C09D5/46 ,  C08K9/00

CPC分类号： C09D5/03 ,  C08J3/124

摘要： A process for manufacturing thermosetting resin particles for powder coating use exhibiting improved anti-blocking property and workability is disclosed. The process include providing a suspension of the thermosetting resin particles in an aqueous medium and an emulsion or dispersion of a vinyl-based polymer having a relatively high Tg, respectively. The thermosetting resin particles are then treated with the emulsion while the resin particles are still suspended in or wetted with the aqueous medium to adhere the vinyl based polymer onto the resin particles forming a shell layer. The resin particles are dried and made to ready to use in the powder coating.

摘要翻译： 公开了一种制造具有改进的抗粘连性和可加工性的粉末涂料用热固性树脂颗粒的方法。 该方法包括提供热固性树脂颗粒在水性介质中的悬浮液和分别具有较高Tg的乙烯基类聚合物的乳液或分散体。 然后用乳液处理热固性树脂颗粒，同时树脂颗粒仍然悬浮在水性介质中或用水介质润湿，以将乙烯基聚合物粘附到形成壳层的树脂颗粒上。 将树脂颗粒干燥并制成即用于粉末涂料中。

公开(公告)号：US5311036A

公开(公告)日：1994-05-10

申请号：US875431

申请日：1992-04-29

申请人： Toshikazu Nishino ,  Mutsuko Miyake ,  Ushio Kawabe ,  Yutaka Harada ,  Masaaki Aoki ,  Mikio Hirano

发明人： Toshikazu Nishino ,  Mutsuko Miyake ,  Ushio Kawabe ,  Yutaka Harada ,  Masaaki Aoki ,  Mikio Hirano

IPC分类号： H01L21/82 ,  H01L39/22

CPC分类号： H01L39/228 ,  H01L21/82

摘要： A pair of superconducting electrodes are so formed as to interpose a semiconductor therebetween, and a control electrode is formed on the semiconductor through an insulator film so as to control the superconductive weak coupling state in the semiconductor between the superconducting electrodes. The distance between the superconducting electrodes is determined by the thickness of the superconductor interposed between the two electrodes, whereby the interelectrode distance is settled with a high precision to improve the uniformity of the device characteristic.And in an arrangement where two superconducting electrodes are formed on a semiconductor layer and the superconductive weak coupling state between such two electrodes is controlled by a third electrode, the gain is increadable by furnishing a varied impurity distribution in the semiconductor layer.

摘要翻译： 一对超导电极形成为在其间插入半导体，并且通过绝缘膜在半导体上形成控制电极，以便控制超导电极之间的半导体中的超导弱耦合状态。 超导电极之间的距离由插入在两个电极之间的超导体的厚度决定，从而以高精度稳定电极间距离，以提高器件特性的均匀性。 并且在半导体层上形成两个超导电极并且在这两个电极之间的超导弱耦合状态由第三电极控制的布置中，通过在半导体层中提供不同的杂质分布来增加增益。

公开(公告)号：US5309038A

公开(公告)日：1994-05-03

申请号：US851007

申请日：1992-03-11

申请人： Yutaka Harada ,  Hioe Willy

发明人： Yutaka Harada ,  Hioe Willy

IPC分类号： H03K3/38 ,  H03K3/47 ,  H03K21/00 ,  H03K23/00 ,  H03K23/76

CPC分类号： H03K3/38 ,  H03K23/763

摘要： A high-speed counter capable of counting the number of randomly incoming pulses is constructed by serially connecting a plurality of toggle flip-flop circuits, each of which is activated by input pulses and constructed from an rf-SQUID and the quantum flux parametron, whereby a high-speed computer or a high-speed measurement apparatus can be realised by the use of the high-speed counter.

摘要翻译： 通过串联连接多个触发器触发电路构成了能够计数随机输入脉冲数的高速计数器，每个触发器电路由输入脉冲激活并由rf-SQUID和量子通量参数构成，由此 可以通过使用高速计数器来实现高速计算机或高速测量装置。

公开(公告)号：US5053645A

公开(公告)日：1991-10-01

申请号：US510183

申请日：1990-04-17

申请人： Yutaka Harada

发明人： Yutaka Harada

IPC分类号： H03K19/23 ,  H03K5/08 ,  H03K17/30 ,  H03K17/62 ,  H03K19/08 ,  H03K19/086 ,  H03K19/20

CPC分类号： H03K17/625 ,  H03K19/0813 ,  H03K19/086

摘要： In a threshold logic circuit, digital input signals are weighted and summed up and then the sum of weighted digital signals is compared with a threshold value. The threshold logic circuit comprises a plurality of current switching circuits and means for summing up the output currents from the current switching circuit. The weights for the input signals are changed by controlling supply currents to the current switching circuits.

摘要翻译： 在阈值逻辑电路中，对数字输入信号进行加权和求和，然后将加权数字信号的和与阈值进行比较。 阈值逻辑电路包括多个电流开关电路和用于将来自电流开关电路的输出电流相加的装置。 通过控制对当前开关电路的电源电流来改变输入信号的权重。