公开(公告)号：US07409260B2

公开(公告)日：2008-08-05

申请号：US11748825

申请日：2007-05-15

申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： G06F19/00 ,  H01L21/00 ,  B24B49/00

CPC分类号： B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24D7/14 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/26

摘要： A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

摘要翻译： 一种用于确定抛光终点的方法包括在抛光序列的不同时间期间从基板上的不同区域获得光谱，将光谱与库中的索引进行匹配，并使用索引来确定每个不同区域的抛光速率与索引 。 可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

公开(公告)号：US20080146120A1

公开(公告)日：2008-06-19

申请号：US11611640

申请日：2006-12-15

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00 ,  G01B11/24

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20070224915A1

公开(公告)日：2007-09-27

申请号：US11748825

申请日：2007-05-15

申请人： Jeffrey David ,  Dominic Benvegnu ,  Harry Lee ,  Boguslaw Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey David ,  Dominic Benvegnu ,  Harry Lee ,  Boguslaw Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/12

CPC分类号： B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24D7/14 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/26

摘要： A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

摘要翻译： 一种用于确定抛光终点的方法包括在抛光序列的不同时间期间从基板上的不同区域获得光谱，将光谱与库中的索引进行匹配，并使用索引来确定每个不同区域的抛光速率与索引 。 可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

公开(公告)号：US20060270322A1

公开(公告)日：2006-11-30

申请号：US11273766

申请日：2005-11-14

申请人： Alpay Yilmaz ,  Lakshmanan Karuppiah

发明人： Alpay Yilmaz ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00 ,  B24B1/00 ,  B24B7/30

CPC分类号： B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

公开(公告)号：US20060154569A1

公开(公告)日：2006-07-13

申请号：US11034350

申请日：2005-01-11

申请人： Terry Doyle ,  Lakshmanan Karuppiah

发明人： Terry Doyle ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  H01L21/67219 ,  H01L21/68792

摘要： Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.

摘要翻译： 本发明的实施例总体上涉及一种用于处理衬底的装置，更具体地涉及将在固定基座和旋转压板之间传递电力和/或控制信号而不涉及机械接触的装置。 该装置不会承受传统的滑动环带有移动表面的缺点。 在一个实施例中，提供了一种用于处理衬底的设备。 该装置包括压板组件，其具有用于支撑平坦化材料并设置在固定基座上的表面，使得压板组件可相对于底座旋转。 该装置还包括用于将电能从初级线圈传递到次级线圈的联接组件。 联接组件包括缠绕在第一芯上的线的初级线圈; 第一个核心耦合到基地; 线圈的二次线圈缠绕在第二芯上; 以及联接到压板组件的第二芯体。

公开(公告)号：US09061394B2

公开(公告)日：2015-06-23

申请号：US13459079

申请日：2012-04-28

申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

公开(公告)号：US08813293B2

公开(公告)日：2014-08-26

申请号：US13897008

申请日：2013-05-17

申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC分类号： A46B13/00 ,  B08B11/00

CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

公开(公告)号：US08628376B2

公开(公告)日：2014-01-14

申请号：US12610979

申请日：2009-11-02

申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

公开(公告)号：US08458843B2

公开(公告)日：2013-06-11

申请号：US12603771

申请日：2009-10-22

申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC分类号： A46B13/00 ,  B08B11/00

CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

公开(公告)号：US20130122782A1

公开(公告)日：2013-05-16

申请号：US13459071

申请日：2012-04-27

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。