摘要:
An input device with swing operation includes a supporting frame, a flexible printed circuit installed on the supporting frame for outputting a signal, a supporting base fixed on the supporting frame, a cap pivoted to the supporting base, and a hook respectively pivoted to the supporting base and the cap. An inclined angle is formed between the hook and the supporting frame when the cap is not pressed down. The hook and the cap pivots relative to the supporting base when the cap is pressed down. The input device further includes a resilient component disposed between the flexible printed circuit and the cap for being pressed by the cap to actuate the flexible printed circuit when the cap is pressed down.
摘要:
The disclosure relates to a fixing mechanism for fixing a component. The fixing mechanism includes a base, a bottom wall disposed on the base, and two lateral walls disposed on the base and connected to the bottom wall. A containing space is formed between the base, the bottom wall, and the two lateral walls. The fixing mechanism further includes a hook. The hook includes a cantilever portion and a hooking portion. The cantilever portion is connected to the bottom wall and for pressing against the component when the component is contained inside the containing space. The hooking portion is connected to the cantilever portion and engages with a lateral surface of the component when the component is contained inside the containing space. The fixing mechanism further includes two engaging parts for laterally engaging against the component when the component is contained inside the containing space.
摘要:
An electronic device includes a magnetic switch, a magnetic element for actuating the magnetic switch to send a control signal to an electronic element module, and a retaining mechanism for retaining the magnetic element at a housing. The retaining mechanism includes a retaining casing, a connecting member, and a blocking member. The retaining casing is disposed on and cooperates with the housing to define a receiving space to receive the magnetic element, and has an opening in spatial communication with the receiving space. The blocking member is connected to the housing by the connecting member and is adjacent to the opening to prevent removal of the magnetic element from the receiving space through the opening.
摘要:
A portable computer comprises a base, a display module, at least one support element and at least one sliding assembly. The base comprises a first area and a second area. The display module comprises a connect end and a display face. Each support element comprises a first end pivoted on a portion of the display module other than the display face and a second end pivoted on the rear end of the base. Each sliding assembly comprises a rod element disposed at least in the second area and a sleeve sliding element connected with the connect end and moved along the rod element.
摘要:
An electronic device includes a battery module, a housing having first and second panels, and a fastening mechanism. The fastening mechanism has a fixing portion extending from the battery module and engaging an opening in the first panel, a first fastening portion formed in the fixing portion, a cantilever formed in the second panel, and a second fastening portion formed on the cantilever and engaging the first fastening portion. The cantilever can be bent away from the fixing portion, such that the second fastening portion is disengaged from the first fastening portion, and that the fixing portion is urged by a protrusion on the cantilever to be disengaged from the opening.
摘要:
A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.
摘要:
A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.
摘要:
A circuit board process is provided. First, multiple carriers is provided, and a first conductive layer having multiple concave structures is formed on each carrier. A dielectric layer is then provided, and the carriers with the first conductive layers are laminated on a first and a second surface of the dielectric layer respectively, wherein portions of the first conductive layers are embedded in the first and second surfaces. Next, the carriers are removed. Thereafter, the first conductive layer corresponding to at least one concave is removed to expose a portion of the dielectric layer. Next, the exposed dielectric layer is removed to form an opening. A second conductive layer is then formed on the inner wall of the opening, wherein the second conductive layer is electrically connected to the first conductive layers on both sides of the dielectric layer.
摘要:
A film removing equipment for removing a film from a substrate is provided. The film removing equipment comprises a base, a transmission mechanism of the erasing device, an erasing device and a positioning platform. The transmission mechanism of the erasing device is set up on the base and the erasing device is set up on the transmission mechanism. The positioning platform is set up on the base to carry the substrate. The transmission mechanism drives the erasing device to remove the film from the substrate. Using the aforementioned film removing equipment, the cost of removing a film from a substrate is reduced substantially.