公开(公告)号：US20080030991A1

公开(公告)日：2008-02-07

申请号：US11500033

申请日：2006-08-07

Applicant: Peter Yeh

Inventor： Peter Yeh

IPC: F21V21/00

CPC classification number: F21V19/002 ,  F21V19/0025 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A base assembly for LEDs has a top, a bottom and multiple LED recesses formed in the top and including at least one oblique LED recess and at least one perpendicular LED recess. Each oblique LED recess has an inclined bottom, an oblique sidewall and a pair of lead passages. The at least one perpendicular LED recess has a bottom parallel to the base. LEDs can be mounted respectively in the at least one oblique LED recess at an angle relative to the base and mounted upright in the perpendicular LED recess to emit lights in different directions to provide a wide-angle luminance effect. The cover is detachably mounted on the base and has at least one though hole and at least one mounting hole to allow the LEDs mounted in the LED recesses to protrude from and to be securely and exactly held in the base.

Abstract translation: 用于LED的基座组件具有形成在顶部中的顶部，底部和多个LED凹部，并且包括至少一个倾斜LED凹部和至少一个垂直LED凹部。 每个倾斜的LED凹部具有倾斜的底部，倾斜的侧壁和一对引线通道。 至少一个垂直的LED凹部具有平行于底座的底部。 LED可以分别安装在至少一个倾斜的LED凹部中，相对于基座成一定角度，直立安装在垂直的LED凹部中，以沿不同的方向发光，以提供广角度的亮度效果。 盖可拆卸地安装在基座上，并且具有至少一个通孔和至少一个安装孔，以使得安装在LED凹部中的LED能够突出并且牢固且准确地保持在基座中。

公开(公告)号：US20070253172A1

公开(公告)日：2007-11-01

申请号：US11414429

申请日：2006-04-28

Applicant: Thomas Nodine

Inventor： Thomas Nodine

IPC: H05K7/16

CPC classification number: H05K1/148 ,  H05K1/141 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/10128 ,  H05K2201/10287 ,  H05K2201/10484

Abstract: A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed to the mother board and the daughter board on a common plane the frangible connections are broken to allow the daughter board to be moved to a desired position relative to the mother board. The electrical conductors that connect the daughter board to the mother board are semi-rigid to provide movement while maintaining a desired position of the daughter board relative to the mother board.

Abstract translation: 电路板组件包括母板和子板。 子板由与母板的多个易碎连接限定，并与母板设置在公共平面上。 在将所有电子设备安装到母板和母板上的公共平面上之后，易碎连接断开，以使子板相对于母板移动到所需的位置。 将子板连接到母板的电导体是半刚性的，以提供移动，同时保持子板相对于母板的期望位置。

公开(公告)号：US07221868B2

公开(公告)日：2007-05-22

申请号：US11110155

申请日：2005-04-20

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H01R12/00

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

Abstract translation: 在根据本发明的照相机中，透镜筒单元的边缘部分从前盖突出并布置。 透镜筒单元被连接到前盖的前盖圆柱形构件覆盖，并且前盖圆柱形构件的前部暴露部分被外部圆柱形构件覆盖为可拆卸（安装前）金属圆柱形构件。 外圆柱形部件通过前盖侧的止动爪定位并固定。 具有柔性的C形止挡部分盖被制成柔性并且被安装在止动爪部分周围，并由螺钉固定。 相机的镜筒单元的外观上的设计限制减少，摄像机外部部分可以由金属制成。

公开(公告)号：US07106609B2

公开(公告)日：2006-09-12

申请号：US11157610

申请日：2005-06-20

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C5/00 ,  G11C5/06

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US07007835B2

公开(公告)日：2006-03-07

申请号：US10775395

申请日：2004-02-10

Applicant: Philip Deane ,  Neil Teitelbaum

Inventor： Philip Deane ,  Neil Teitelbaum

IPC: B23K35/38

CPC classification number: H05K3/3436 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K3/3494 ,  H05K2201/10484 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract translation: 将光电二极管或阵列的光电二极管焊接到基板上的方法，即以预定角度倾斜的光电二极管，使用放置在与放置在基板上的对应的一对焊盘相对的光电二极管芯片上的一对焊料凸块。 当光电二极管芯片放置在基板上时，焊料凸起之间，焊料熔化并在焊盘的表面上经过回流焊。 焊盘的形状和焊盘上的焊料凸点的位置使得焊料的表面张力通过将芯片拉到一侧来使芯片倾斜。

公开(公告)号：US06947332B2

公开(公告)日：2005-09-20

申请号：US10628746

申请日：2003-07-28

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US20050185951A1

公开(公告)日：2005-08-25

申请号：US11110155

申请日：2005-04-20

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H05K1/14 ,  H05K3/36 ,  G03B17/02

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

公开(公告)号：US06853779B2

公开(公告)日：2005-02-08

申请号：US10060067

申请日：2002-01-29

Applicant: Kristofer Morzheim ,  Kelvin Chau

Inventor： Kristofer Morzheim ,  Kelvin Chau

IPC: G02B6/42 ,  G02B6/43 ,  H05K3/30 ,  H05K3/34 ,  G02B6/26

CPC classification number: G02B6/43 ,  G02B6/422 ,  G02B6/4231 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10484 ,  Y02P70/613

Abstract: An apparatus and method for aligning one or more optical fibers is disclosed. The apparatus includes a carrier having one or more through holes and one or more plugs, each of which is sized to be received in one or more of the three or more through holes. The carrier is adapted to receive one or more waveguides. The waveguides may be aligned by inserting a plug into each of one or more through holes in a carrier; attaching a waveguide to the carrier; aligning the carrier to align the one or more waveguides with respect to an optical device attached to a substrate; and tacking one or more of the plugs to the substrate to maintain the alignment of the waveguides with respect to the optical device.

Abstract translation: 公开了一种用于对准一根或多根光纤的装置和方法。 该装置包括具有一个或多个通孔和一个或多个插头的载体，每个插头的尺寸被设计成容纳在三个或更多个通孔中的一个或多个中。 载体适于接收一个或多个波导。 波导可以通过将插头插入到载体中的一个或多个通孔中的每一个中而对准; 将波导附接到所述载体; 对准载体以使一个或多个波导相对于连接到基板的光学装置对准; 并且将一个或多个插头固定到基板以保持波导相对于光学装置的对准。

公开(公告)号：US20040095632A1

公开(公告)日：2004-05-20

申请号：US10714330

申请日：2003-11-14

Inventor： Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

IPC: G02F001/15

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

Abstract translation: 反射镜组件包括壳体，角度可调节的电源组，用于供电和镜角控制的电线，包括加热器的电致变色镜子组件和转向信号装置。 这些组件包括插入电线束上的多插头连接器或彼此搭载的单独连接器。 可选地，加热器包括具有端部连接器的内部导线，用于将功率传递到加热器的相对侧，并且还包括用于漫射从转向信号装置通过扩散材料的光的透光/扩散材料层。 印刷电路板装配在面板形载体中的凹槽中，并且整体的保持器可释放地固定印刷电路板。 电源组通过一个弹性手指环连接到载体上，连续的环形凸缘可防止载体和反射镜组件中的玻璃元件的变形。

公开(公告)号：US20040004844A1

公开(公告)日：2004-01-08

申请号：US10188911

申请日：2002-07-02

Inventor： Patrick Henry Ryan, JR.

IPC: F21V021/00

CPC classification number: G09F9/33 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y10S362/80

Abstract: A portable message sign having a housing and a front surface angled with respect to a rear surface and an array of light emitting devices (such as LEDs) being angled so that the LEDs are parallel to the horizon. The LEDs are mounted at an angle to a printed circuit board (PCB), which is mounted between the front and rear surfaces. In one embodiment, the pins of the LEDs are of different lengths so that when mounted to the PCB the lens of the LED directs light at an angle with respect to the PCB. In another embodiment, a strip of hard material is laid down next to the holes in the PCB that through mount LEDs are inserted, which cause the LED to mount at an angle.

Abstract translation: 具有壳体和相对于后表面成角度的前表面的便携式消息符号和发光装置（例如LED）的阵列成角度，使得LED平行于水平线。 LED以与安装在前表面和后表面之间的印刷电路板（PCB）成一定角度安装。 在一个实施例中，LED的引脚具有不同的长度，使得当安装到PCB时，LED的透镜相对于PCB以一定角度引导光。 在另一个实施例中，将一块硬质材料放置在PCB的靠近插入LED的孔的旁边，这导致LED以一定角度安装。