-
61.发明授权公开(公告)号：US11732330B2
公开(公告)日：2023-08-22
申请号：US16022345
申请日：2018-06-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Md Hasnine , Lik Wai Kho
CPC classification number: C22C13/00 , B23K35/262 , C22C13/02 , B23K35/025 , B23K35/0227 , B23K35/0244
Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
-
公开(公告)号：US20230146579A1
公开(公告)日：2023-05-11
申请号：US17755193
申请日：2020-10-20
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Ranjit PANDHER , Niveditha NAGARAJAN , Girard SIDONE , Carl BILGRIEN
CPC classification number: B23K35/302 , H01L24/29 , B23K1/0016 , B23K35/404 , B23K2101/40
Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
-
公开(公告)号：US11285569B2
公开(公告)日：2022-03-29
申请号：US16530053
申请日：2019-08-02
Inventor： Hans-Jurgen Albrecht , Gunnar Petzold , Klaus Wilke , Klaus Heinrich Georg Bartl , Hector Andrew Hamilton Steen , Klaus Muller , Werner Kruppa , Mathias Nowottnick , Klaus Wittke
Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
-
公开(公告)号：US11162007B2
公开(公告)日：2021-11-02
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
-
公开(公告)号：US11139089B2
公开(公告)日：2021-10-05
申请号：US16887455
申请日：2020-05-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Bawa Singh , Ravi Bhatkal , Siuli Sarkar , Anubhav Rustogi
IPC: H01B1/22 , H05K1/09 , B22F1/00 , B22F1/02 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/362 , H05K3/12 , H05K1/18
Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
-
Patent Agency Ranking
公开(公告)号：US20210249376A1
公开(公告)日：2021-08-12
申请号：US17245397
申请日：2021-04-30
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
-
公开(公告)号：US10998284B2
公开(公告)日：2021-05-04
申请号：US15302827
申请日：2015-04-10
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H05K3/32 , H01L25/00 , H01L51/52
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
-
公开(公告)号：US10682732B2
公开(公告)日：2020-06-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
IPC: C09J163/00 , C08L63/00 , C08K3/00 , C08K3/04 , C08K3/34 , C08K5/54 , C08K9/00 , B23K35/36 , B23K1/00 , B23K35/02 , H01L23/29 , H01L23/00 , C08K5/00 , C08K3/013 , B23K1/20 , C08K7/02 , B23K35/00 , C08K5/549 , B32B27/38 , B23K101/42
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
-
公开(公告)号：US20190255662A1
公开(公告)日：2019-08-22
申请号：US16404959
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
-
公开(公告)号：US20190143461A9
公开(公告)日：2019-05-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
-
-
-
-
-
-
-
-
-
Search Results
90
records
(took 0.024 seconds)
