公开(公告)号：US20100316329A1

公开(公告)日：2010-12-16

申请号：US12552918

申请日：2009-09-02

Applicant: Han Seo CHO ,  Sang Hoon Kim ,  Joon Sung Kim ,  Jae Hyun Jung

Inventor： Han Seo CHO ,  Sang Hoon Kim ,  Joon Sung Kim ,  Jae Hyun Jung

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/43

Abstract: Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency.

Abstract translation: 这里公开了一种光学元件封装基板，其被构造成使得具有空腔的电布线基板层叠在光波导的两侧，光学元件封装安装在电布线基板中，并且安装在光学器件的表面上的光学元件 元件封装容纳在空腔中，使得光学元件和光波导之间的距离减小，从而提高光学连接效率。

公开(公告)号：US20090290832A1

公开(公告)日：2009-11-26

申请号：US12216995

申请日：2008-07-14

Applicant: Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/43 ,  G02B6/132 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602

Abstract: Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

Abstract translation: 这里公开了包括光波导的印刷电路板和制造该板的方法。 在该板中，光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于本发明的方法使用通常用于制造一般印刷电路板的工艺中的化学镀的镜子，所以适用于制造面积大的印刷电路板，并且镜具有高反射率和 在材料消耗方面效率高。

公开(公告)号：US20090232467A1

公开(公告)日：2009-09-17

申请号：US12155755

申请日：2008-06-09

Applicant: Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G02B6/10 ,  H01B13/00

CPC classification number: G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract translation: 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US20090133444A1

公开(公告)日：2009-05-28

申请号：US12149517

申请日：2008-05-02

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

IPC: C03B37/022

CPC classification number: G02B6/136 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4611

Abstract: A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

Abstract translation: 公开了一种制造光学板的方法。 制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层 在倾斜的表面上。

公开(公告)号：US20090130390A1

公开(公告)日：2009-05-21

申请号：US12149952

申请日：2008-05-09

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: B32B3/00 ,  B29D11/00

CPC classification number: B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

Abstract: An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

Abstract translation: 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。

公开(公告)号：US07505661B2

公开(公告)日：2009-03-17

申请号：US12078948

申请日：2008-04-08

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC: G02B6/10 ,  H01L21/00

CPC classification number: B29D11/00663 ,  G02B6/136 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/3436 ,  H05K2201/10121 ,  Y10T29/49155

Abstract: An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

Abstract translation: 公开了一种光波导，具有光波导的封装板及其制造方法。 制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。 利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

公开(公告)号：US07328504B2

公开(公告)日：2008-02-12

申请号：US11453790

申请日：2006-06-15

Applicant: Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

Inventor： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

IPC: H05K3/30 ,  H05K3/34 ,  H01K3/10

CPC classification number: H05K1/188 ,  H05K1/185 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

Abstract translation: 公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120）， 步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。 步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。

公开(公告)号：US20080000680A1

公开(公告)日：2008-01-03

申请号：US11819925

申请日：2007-06-29

Applicant: Suk Hyeon Cho ,  Byoung Youl Min ,  Je Gwang Yoo ,  Hae Nam Seo ,  Byung Moon Kim ,  Ji Hong Jo ,  Han Seo Cho

Inventor： Suk Hyeon Cho ,  Byoung Youl Min ,  Je Gwang Yoo ,  Hae Nam Seo ,  Byung Moon Kim ,  Ji Hong Jo ,  Han Seo Cho

IPC: H05K1/03

CPC classification number: H05K1/0206 ,  H01L23/3735 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same, which can achieve reliable heat resistance because heat radiation characteristics are improved, and processing costs of which are reduced because processing times are shortened.

Abstract translation: 这里公开了一种印刷电路板及其制造方法，其可以提高热辐射特性，从而可以实现可靠的耐热性，并且由于加工时间缩短，其加工成本降低。

公开(公告)号：US07263256B2

公开(公告)日：2007-08-28

申请号：US10959884

申请日：2004-10-06

Applicant: Dong-Su Kim ,  Hyo-Hun Park ,  Byung-Sup Rho ,  Han-Seo Cho ,  Sun-Tae Jung

Inventor： Dong-Su Kim ,  Hyo-Hun Park ,  Byung-Sup Rho ,  Han-Seo Cho ,  Sun-Tae Jung

IPC: G02B6/26 ,  G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/421 ,  G02B6/43

Abstract: An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Abstract translation: 公开了一种光学模块。 光学模块包括基板和至少一个平面光波导，其包括多个波导和至少一个垂直地穿过基板的上表面并且依次层压在基板上的凹槽。 该光学模块还包括至少一个PCB，其具有位于面对相应凹槽的平面光波导上的至少一个集成光电转换装置，以及包括主体的至少一个光学连接块和嵌入在主体中的光纤 使其两端暴露于身体的侧表面和上表面。 将光连接块插入到平面光波导的相应凹槽中，使得已经暴露的光纤的两端分别面对波导和PCB。