Abstract:
An electronic device enclosure includes a rear panel and a blocking board. The rear panel comprises a front surface and a back surface opposite to the front surface. A through opening is defined in the rear panel. The blocking board comprises a main body, a first flange and a second flange opposite to the first flange. A first stopping piece is extends from the first flange. A second stopping piece is extended from the second flange. A latch portion is located on the first flange. A first protrusion is located on the second flange. The latch portion and the second protrusion extend through the through opening by being elastically deformed, the latch portion and the second protrusion abut on the front surface, and the first stopping piece and the second stopping piece abut on the back surface.
Abstract:
A connector assembly includes a first connector and a second connector. The first connector includes a concave slot and a protruding portion adjacent to the concave slot. The second connector includes a resisting member and a receiving slot adjacent to the resisting member. The resisting member is engaged in the concave slot, for preventing the first connector from moving relative to the second connector in a first direction; and the protruding portion is engaged in the receiving slot, for preventing the first connector from moving relative to the second connector in a second direction opposite to the first direction.
Abstract:
Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device module may comprise an interposer with a substrate. An interposer contact is formed within the substrate. A sensor device may be bonded to a surface of the interposer, wherein a sensor contact is bonded to a first end of the interposer contact. An ISP may be connected to the interposer, by bonding an ISP contact in the ISP to a second end of the interposer contact. An underfill layer may fill a gap between the interposer and the ISP. A printed circuit board (PCB) may further be connected to the interposer by way of a solder ball connected to another interposer contact. A thermal interface material may be in contact with the ISP and the PCB.
Abstract:
A method includes extracting a first netlist from a first layout of a semiconductor circuit and estimating layout-dependent effect data based on the first netlist. A first simulation of the semiconductor circuit is performed based on the first netlist using an electronic design automation tool, and a second simulation of the semiconductor circuit is performed based on a circuit schematic using the electronic design automation tool. A weight and a sensitivity of the at least one layout-dependent effect are calculated, and the first layout of the semiconductor circuit is adjusted based on the weight and the sensitivity to provide a second layout of the semiconductor circuit. The second layout is stored in a non-transient storage medium.
Abstract:
A method for moving icons on a display of a mobile device, either on the display or into a folder is provided. When an icon has been selected to be moved, its appearance is altered with respect to the other icons so as to provide a visual cue to the user regarding the move and the altered icon is overlaid on the other icons as it moves thereover. The icon may be displayed with a move cursor indicating where the icon will be placed if the current position is selected. A method is also provided for creating new folders on the display using a dialog box that is configured to enable a name and icon for the folder to be chosen and/or selected. Default names and folder icons may be used and alternative icons may also be presented in the dialog box to enable a preview of the choices.
Abstract:
A method of generating a circuit layout of an integrated circuit includes generating layout geometry parameters for at least a predetermined portion of an original netlist of the integrated circuit. A consolidated netlist including information from the original netlist and the layout geometry parameters is generated. Then, the circuit layout is generated based on the consolidated netlist.
Abstract:
The disclosure discloses a language setting method for mobile terminal and mobile terminal, wherein the method includes: the mobile terminal acquires the language used by the current location of the mobile terminal; and the mobile terminal sets the acquired language as the current default language of the mobile terminal. The disclosure achieves the effect of improving the user experience.
Abstract:
A brake disk for bicycles has an inner disk, two outer disks and multiple brake units. The brake units, rather than the outer disks, are used to rub with the disk brake pads. As each brake unit is a small lump, the brake units can be easily made of material with high abrasion resistance, high temperature resistance, and low heat conduction, and the brake units still can sustain sufficient strength. With those features of material, the brake disk for bicycles does not deform easily by the heat, and the glue between the outer disks and the inner disk does not melt easily by the heat from the outer disks. Because each brake unit, which is used to rub, is independent from the outer disks, the outer disks can be made of light material, and the whole weight reduces as well.
Abstract:
The present invention discloses a method for mapping a codeword to a layer in a multi-input multi-output system, the method includes: grouping current layers in a multi-input multi-output system according to the number of current codewords, and mapping each codeword to the layer of a group to which the codeword corresponds. The present invention further discloses a device for mapping a codeword to a layer in a multi-input multi-output system, the device includes: a layer grouping unit and a mapping unit, wherein the layer grouping unit is used for grouping current layers in a multi-input multi-output system according to the number of current codewords; and the mapping unit is used for mapping each codeword to the layer of a group to which the codeword corresponds. The present invention is easy to be implemented, and the mapping manner for mapping a codeword to a layer is more reasonable.
Abstract:
Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.