摘要:
A method for assessing a performance of a laser system for use in corneal ablation is provided that includes directing a beam of laser shots onto a fluorescent indicator. The indicator is adapted to emit a first wavelength of light different from a second wavelength of light impinging thereon. The directing step is performed in a plane of a cornea of an eye desired to be ablated and also onto a cornea positioned at the corneal plane. Light reflected from the indicator is detected, and a difference between a detected light pattern from the camera and a predetermined ablation pattern desired to be made on the cornea is calculated. The predetermined pattern is then corrected to compensate for the calculated difference.
摘要:
An apparatus for holding a cover in a closed orientation substantially covering a chassis face of a unit; the unit containing equipment in an equipment volume; the equipment volume being partially bounded by the chassis face; includes: a positioning structure coupling the cover with the unit for selectively situating the cover in the closed orientation or in an other orientation; and a latching structure configured for latchingly engaging the chassis face and the cover for holding the cover in the closed orientation when the latching structure is in a first orientation. The latching structure does not engage the chassis face and the cover when the latching structure is in a second orientation. The latching structure is situated substantially entirely outside the equipment volume.
摘要:
This invention has as its object a method for releasing a product by subjecting a compound of Formula (II′): R′7R′8(HX)C1-C2(YH)R′9R′10 to a chemical oxidation that cleaves the bond C1-C2 to obtain the product. In the compound of Formula (II′): R′7 to R′10, which are identical or different, correspond to a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted functional group; X and Y, which are identical or different, are an oxygen atom, a sulfur atom, or an amine of Formula —NR11R12, wherein R11 is a hydrogen atom, an alkyl group, or a substituted or unsubstituted aryl group, and R12 is not a hydrogen atom. The invention also has as its object a method for releasing a product that comprises, before the chemical oxidation stage, a first step for preparing the compound of Formula (II′). The released product can be a volatile molecule or an active substance or else a specific product. The invention also relates to a method for detecting the released product as well as its applications, in particular for detecting catalytic or enzymatic activities.
摘要翻译:本发明的目的是通过使式(II')的化合物:R',R“8(HX)C(C) (YH)R'9 R 10与化学氧化反应,其切割键C 1 sub> C 2以获得产物。 在式(II')的化合物中:R'7至R'10相同或不同,相当于氢原子,取代或未取代的烷基 ,或取代或未取代的官能团; X和Y相同或不同,是氧原子,硫原子或式-NR 11 R 12的胺,其中R 11 R 2是氢原子,烷基或取代或未取代的芳基,R 12不是氢原子。 本发明的目的还有一种释放产品的方法,该方法包括在化学氧化阶段之前制备式(II')化合物的第一步骤。 释放的产物可以是挥发性分子或活性物质或特定产物。 本发明还涉及用于检测释放产物及其应用的方法,特别是用于检测催化或酶活性。
摘要:
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Article formed from this method are also disclosed.
摘要:
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a substrate patterned-nanostructure surface, disposing a metal layer on the substrate patterned-nanostructure surface to form a metallic patterned-nanostructure surface region, forming a self-assembled monolayer on the metallic patterned-nanostructure surface region, exposing the self-assembled monolayer to an electroless plating solution comprising a deposit metal, and depositing electrolessly the deposit metal selectively on the surface regions having a metallic nanostructured surface. Articles formed from this method are also disclosed.
摘要:
An apparatus that presents an output signal that is modulated by input signal includes: (a) A signal source providing a signal at a reference frequency. (b) A frequency comparer coupled with the signal source and the output signal for comparing the extant output signal frequency with the reference frequency and generating an indicator representing the comparing. (c) Value storing units coupled with the frequency comparer to respond to an indicator and store a parameter associated with one of predetermined frequencies. (d) A selector coupled with the value storing units. (e) A signal controlled oscillator coupled with the selector. The selector responds to the input signal to couple a value storing unit with the oscillator for providing a parameter to the oscillator for effecting the modulation.
摘要:
A method for depositing silicon nitride on a semiconductor wafer uses plasma enhanced chemical vapor deposition at very low temperatures. The temperature in a silicon nitride deposition chamber is set to be about 170.degree. C. or less. Silane gas (SiH.sub.4) flows into the silicon nitride deposition chamber with a flow rate in a range of from about 300 sccm (standard cubic cm per minute) to about 500 sccm. Nitrogen gas (N.sub.2) flows into the silicon nitride deposition chamber with a flow rate in a range of from about 500 sccm to about 2000 sccm. Ammonia gas (NH.sub.3) flows into the silicon nitride deposition chamber with a flow rate in a range of from about 1.0 slm to about 2.2 slm. A high frequency RF signal is applied on a showerhead within the deposition chamber. A low frequency RF signal is applied on a heating block for holding the semiconductor wafer. A predetermined volume for the silicon nitride deposition chamber is used such that pressure within the silicon nitride deposition chamber is in a range of from about 1.0 torr to about 2.4 torr. The semiconductor wafer is placed inside the silicon nitride deposition chamber for a soak time period of about 30 seconds or greater before the high frequency RF signal is applied on the showerhead in the deposition chamber and the low frequency RF signal is applied on the heating block. When the semiconductor wafer reaches the deposition temperature, the high frequency RF signal and the low frequency RF signal are applied for deposition of the silicon nitride layer onto the semiconductor wafer. By using low temperatures during the deposition of the silicon nitride layer, the structural integrity of any structure already on the semiconductor wafer is advantageously preserved.