公开(公告)号：US11130142B2

公开(公告)日：2021-09-28

申请号：US16846000

申请日：2020-04-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Dmitry Lubomirsky ,  Vladimir Knyazik ,  Hamid Noorbakhsh ,  Jason Della Rosa ,  Zheng John Ye ,  Jennifer Y. Sun ,  Sumanth Banda

IPC: C23C16/40 ,  B05B1/00 ,  C23C16/455 ,  H01J37/32 ,  B05B1/18

Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a substrate processing chamber includes a body having a first side and an opposing second side; a gas distribution plate disposed proximate the second side of the body; and a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the body, wherein the body is electrically coupled to the gas distribution plate through the clamp.

公开(公告)号：US10774006B2

公开(公告)日：2020-09-15

申请号：US15976704

申请日：2018-05-10

Applicant: Applied Materials, Inc.

Inventor： Kaushal Gangakhedkar ,  Jennifer Y. Sun

IPC: C04B35/50 ,  C04B35/505 ,  C04B35/622 ,  C23C4/11 ,  C23C4/134 ,  C23C14/08 ,  C23C14/22 ,  C23C16/40 ,  C23C16/455 ,  C23C24/04 ,  C23C4/18 ,  C23C14/58 ,  C23C16/56 ,  C04B35/64 ,  C04B35/44 ,  C04B35/486

Abstract: Methods comprise loading an article comprising a ceramic coating into an induction heating system or a microwave heating system and heat treating the ceramic coating using the microwave heating system or the induction heating system within a temperature range for a duration of about 1-15 minutes.

公开(公告)号：US10604831B2

公开(公告)日：2020-03-31

申请号：US16231139

申请日：2018-12-21

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Yikai Chen ,  Biraja Prasad Kanungo

IPC: C23C4/134 ,  C23C4/11 ,  C04B35/505 ,  C04B35/48 ,  C04B35/10

Abstract: A ceramic coating is coated on a body of an article, wherein the ceramic coating includes Y2O3, Y4Al2O9, Y3Al5O12, or a solid-solution of Y2O3 mixed with at least one of ZrO2, Al2O3, HfO2, Er2O3, Nd2O3, Nb2O5, CeO2, Sm2O3 or Yb2O3. The ceramic coating is applied to the body by a method including providing a plasma spraying system having a plasma current in the range of between about 100 A to about 1000 A, positioning a torch standoff of the plasma spraying system a distance from the body between about 60 mm and about 250 mm, flowing a first gas through the plasma spraying system at a rate of between about 30 L/min and about 400 L/min, and plasma spray coating the body to form a ceramic coating, wherein splats of the coating are amorphous and have a pancake shape.

公开(公告)号：US10570257B2

公开(公告)日：2020-02-25

申请号：US15352925

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Sumanth Banda

IPC: C08G77/442 ,  C08G77/385 ,  C08L27/12 ,  C09J127/12 ,  C08L83/04

Abstract: A copolymerized high temperature bonding component that includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other to form a copolymer. The bonding component may have properties that allow it to be used for binding dissimilar materials.

公开(公告)号：US10563297B2

公开(公告)日：2020-02-18

申请号：US15824912

申请日：2017-11-28

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Biraja P. Kanungo ,  Vahid Firouzdor

IPC: H05H1/24 ,  C23C14/22 ,  C23C14/08 ,  C23C28/04 ,  C23C14/54 ,  C23C14/02 ,  C23C14/06 ,  C23C4/11 ,  C23C14/04 ,  B32B3/26 ,  B32B5/14 ,  B32B7/02 ,  H01J37/32 ,  C23C4/134 ,  C23C14/46 ,  B32B15/04 ,  B32B33/00

Abstract: A method of manufacturing an article comprises providing an article. An ion assisted deposition (IAD) process is performed to deposit a second protective layer over a first protective layer. The second protective layer is a plasma resistant rare earth oxide having a thickness of less than 50 microns and a porosity of less than 1%. The second protective layer seals a plurality of cracks and pores of the first protective layer.

公开(公告)号：US20190391602A1

公开(公告)日：2019-12-26

申请号：US16563774

申请日：2019-09-06

Applicant: Applied Materials, Inc.

Inventor： Ming Xu ,  Sushant S. Koshti ,  Michael R. Rice ,  Steven E. Babayan ,  Jennifer Y. Sun

IPC: G05D7/06 ,  C23C14/54 ,  C23C16/52 ,  G01F1/684 ,  G01F15/14 ,  G01F15/18 ,  G01F1/696

Abstract: An electronic device manufacturing system includes a mass flow controller (MFC) that has a thermal flow sensor. The thermal flow sensor may measure a mass flow rate and may include a sensor tube having an inner surface coated with a material to form an inner barrier layer. The inner barrier layer may prevent or substantially reduce the likelihood of a corrosive reaction from occurring on the inner surface, which may prevent or reduce the likelihood of the MFC drifting beyond the MFC's mass flow rate accuracy specifications. This may improve the repeatability of flow detection by the MFC. Methods of measuring and controlling a mass flow rate in an electronic device manufacturing system are also provided, as are other aspects.

公开(公告)号：US20190338418A1

公开(公告)日：2019-11-07

申请号：US16401467

申请日：2019-05-02

Applicant: Applied Materials, Inc.

Inventor： Prerna Goradia ,  Jennifer Y. Sun ,  Xiaowei Wu ,  Geetika Bajaj ,  Atul Chaudhari ,  Ankur Kadam

IPC: C23C16/44 ,  C23C16/18 ,  C23C16/27 ,  H01J37/32 ,  C23C16/455

Abstract: Described herein are articles, systems and methods where a halogen resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The halogen resistant coating has an optional amorphous seed layer and a transition metal-containing layer. The halogen resistant coating uniformly covers features of the chamber component, such as those having an aspect ratio of about 3:1 to about 300:1.

公开(公告)号：US10468235B2

公开(公告)日：2019-11-05

申请号：US14462271

申请日：2014-08-18

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Yikai Chen ,  Biraja P. Kanungo

IPC: C23C4/10 ,  C23C4/18 ,  C23C4/11 ,  C23C4/134 ,  H01J37/32

Abstract: A method for forming a plasma resistant ceramic coating on an article includes placing the article into a chamber or spray cell of a plasma spraying system. A ceramic powder is then fed into the plasma spraying system at a powder feed rate, and a plasma resistant ceramic coating is deposited onto at least one surface of the article in a plasma spray process by the plasma spray system. The plasma spray system is then used to perform an in-situ plasma flame heat treatment of the plasma resistant ceramic coating to form crust on the plasma resistant ceramic coating.

公开(公告)号：US20190330742A1

公开(公告)日：2019-10-31

申请号：US15965797

申请日：2018-04-27

Applicant: Applied Materials, Inc.

Inventor： Xiaowei Wu ,  Jennifer Y. Sun

IPC: C23C18/08 ,  C25F3/02 ,  B01D46/00 ,  B01D39/20

Abstract: Methods for forming a porous coating with a controlled porosity and pore size are described. The methods include mixing a first powder comprising a first material with a second powder comprising a second material to form a mixed powder comprising 30-99 vol. % of the first powder and 1-70 vol. % of the second powder. The methods further include performing cold spray coating to deposit a coating comprising the first material and the second material onto an article, wherein the coating comprises approximately 30-99 vol. % of the first material and 1-70 vol. % of the second material. The methods further include performing a post-coating process to remove the second material from the coating, wherein after the post-coating process the coating consists essentially of the first material and has a porosity that is approximately equivalent to a volume occupied by the second material prior to the post-coating process.

公开(公告)号：US20190271076A1

公开(公告)日：2019-09-05

申请号：US16411823

申请日：2019-05-14

Applicant: Applied Materials, Inc.

Inventor： David Fenwick ,  Jennifer Y. Sun

IPC: C23C16/44 ,  C23C28/04 ,  C23C16/455 ,  C23C16/40

Abstract: A multi-component coating composition for a surface of a semiconductor process chamber component comprising at least one first film layer of a yttrium oxide or a yttrium fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process and at least one second film layer of an additional oxide or an additional fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process, wherein the multi-component coating composition is selected from the group consisting of YOxFy, YxAlyO, YxZryO and YxZryAlzO.