公开(公告)号：US20190035699A1

公开(公告)日：2019-01-31

申请号：US16150009

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  H01L21/321 ,  B24B37/04 ,  B24B37/013

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US20180321026A1

公开(公告)日：2018-11-08

申请号：US16024312

申请日：2018-06-29

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: G01B11/06 ,  H01L21/66 ,  B24B37/013 ,  B24B49/12

CPC classification number: G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  G01B11/0625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.

公开(公告)号：US20170365532A1

公开(公告)日：2017-12-21

申请号：US15694632

申请日：2017-09-01

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  B24B37/04 ,  H01L21/321 ,  B24B37/013

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US09799578B2

公开(公告)日：2017-10-24

申请号：US15376312

申请日：2016-12-12

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  David J. Lischka

IPC: C03C15/00 ,  H01L21/66 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/013

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/31053 ,  H01L21/3212

Abstract: A method of polishing includes storing a predetermined location and a predetermined number as criteria for detecting an end point, polishing a substrate, measuring a sequence of current spectra of light reflected from the substrate while the substrate is being polished, identifying a plurality of peaks or valleys that persist with an evolving location through at least some of the sequence of current spectra, counting a number of peaks or valleys that were identified that pass the predetermined location as polishing progresses, and ceasing to polish the substrate when the number counted reaches the predetermined number.

公开(公告)号：US20170151647A1

公开(公告)日：2017-06-01

申请号：US15424670

申请日：2017-02-03

Applicant: Applied Materials, Inc.

Inventor： Alain Duboust ,  Wen-Chiang Tu ,  Shih-Haur Shen ,  Jimin Zhang ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Zhihong Wang ,  Stephen Jew ,  David H. Mai ,  Huyen Tran

IPC: B24B37/013 ,  H01L21/306 ,  B24B37/04 ,  H01L21/66

Abstract: A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.

公开(公告)号：US20170125313A1

公开(公告)日：2017-05-04

申请号：US15403915

申请日：2017-01-11

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  B24B37/20 ,  H01L21/67 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/013 ,  B24B49/12

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

公开(公告)号：US09564377B2

公开(公告)日：2017-02-07

申请号：US14088933

申请日：2013-11-25

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  David J. Lischka

IPC: H01L21/66 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/3105 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/31053 ,  H01L21/3212

Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Abstract translation: 抛光系统接收光谱中所选峰的一个或多个目标参数，抛光衬底，在衬底被抛光时测量从衬底反射的光的当前光谱，识别当前光谱中所选择的峰，测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较，并且当当前参数和目标参数具有预定关系时，停止抛光衬底。

公开(公告)号：US20160158908A1

公开(公告)日：2016-06-09

申请号：US15046270

申请日：2016-02-17

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: B24B37/013 ,  B24B49/10 ,  H01L21/67

CPC classification number: B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L21/67092 ,  H01L21/67248 ,  H01L22/14 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

公开(公告)号：US09333621B2

公开(公告)日：2016-05-10

申请号：US13942417

申请日：2013-07-15

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Manoocher Birang

IPC: B24B37/20 ,  B24D11/02 ,  B24B37/26 ,  B24B37/013 ,  B24B49/02 ,  B24B49/10 ,  B24B49/12 ,  G01B7/06

CPC classification number: B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/02 ,  B24B49/10 ,  B24B49/105 ,  B24B49/12 ,  B24D11/02 ,  G01B7/105

Abstract: A polishing pad has a polishing layer with a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.

公开(公告)号：US20160013085A1

公开(公告)日：2016-01-14

申请号：US14328211

申请日：2014-07-10

Applicant: Applied Materials, Inc.

Inventor： Xiong Yeu Chew ,  Venaka Rama Subrahmanyam Kommisetti ,  Uday Mahajan ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Jianshe Tang

IPC: H01L21/67 ,  H01L21/768 ,  B24B37/005

CPC classification number: H01L21/7684 ,  B24B37/0053 ,  H01L21/3212 ,  H01L21/76898 ,  H01L22/12 ,  H01L22/26

Abstract: A method of controlling chemical mechanical polishing includes polishing a substrate having a plurality of protrusions, monitoring the substrate during polishing with an in-situ monitoring system to generate a signal, the in-situ monitoring system including an acoustic sensor, a motor current sensor or a motor torque sensor, and detecting breakage of the protrusions based on the signal.

Abstract translation: 一种控制化学机械抛光的方法包括抛光具有多个突起的基底，在用原位监测系统进行抛光时监测基底以产生信号，原位监测系统包括声传感器，马达电流传感器或 电动机转矩传感器，并且基于该信号检测突起的断裂。