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    Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
    63.
    发明授权
    Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices 有权
    用于封装发光器件和芯片级封装发光器件的芯片级方法

    公开(公告)号：US07977686B2

    公开(公告)日：2011-07-12

    申请号：US12027313

    申请日：2008-02-07

    申请人： James Ibbetson ,  Bernd Keller ,  Primit Parikh

    发明人： James Ibbetson ,  Bernd Keller ,  Primit Parikh

    IPC分类号： H01L29/18 ,  H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the substrate in electrical contact with the first conductive via. A diode having first and second electrodes is mounted on the bond pad with the first electrode is in electrical contact with the bond pad. A passivation layer is formed on the diode, exposing the second electrode of the diode. A conductive trace is formed on the top surface of the carrier substrate in electrical contact with the second conductive via and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode.

    摘要翻译： 封装的发光器件包括具有顶表面和底表面的载体衬底，从衬底的顶表面延伸到衬底的底表面的第一和第二导电通孔以及衬底的顶表面上的接合焊盘 与第一导电通孔电接触。 具有第一和第二电极的二极管安装在接合焊盘上，第一电极与接合焊盘电接触。 在二极管上形成钝化层，使二极管的第二电极露出。 导电迹线形成在载体基板的顶表面上，与第二导电通孔和第二电极电接触。 导电迹线在钝化层上并且延伸穿过第二电极。

    Low resistance tunnel junctions in wide band gap materials and method of making same
    64.
    发明申请
    Low resistance tunnel junctions in wide band gap materials and method of making same 有权
    宽带隙材料中的低电阻隧道结及其制造方法

    公开(公告)号：US20070194300A1

    公开(公告)日：2007-08-23

    申请号：US11360166

    申请日：2006-02-22

    申请人： James Ibbetson ,  Bernd Keller ,  Umesh Mishra

    发明人： James Ibbetson ,  Bernd Keller ,  Umesh Mishra

    IPC分类号： H01L29/08

    CPC分类号： H01L29/205 ,  H01L29/2003 ,  H01L29/88

    摘要： A low resistance tunnel junction that uses a natural polarization dipole associated with dissimilar materials to align a conduction band to a valence band is disclosed. Aligning the conduction band to the valence band of the junction encourages tunneling across the junction. The tunneling is encouraged, because the dipole space charge bends the energy bands, and shortens a tunnel junction width charge carriers must traverse to tunnel across the junction. Placing impurities within or near the tunnel junction that may form deep states in the junction may also encourage tunneling in a tunnel junction. These states shorten the distance charge carriers must traverse across the tunnel junction.

    摘要翻译： 公开了一种低电阻隧道结，其使用与不同材料相关联的自然极化偶极子将导带与价带对准。 将导带与结点的价带对准，促进穿越结的隧穿。 鼓励隧道，因为偶极空间电荷弯曲能带，并缩短隧道结宽度，电荷载流子必须穿过穿越交界处的隧道。 将杂质置于隧道结内或其附近可能形成深交界处的深部状态也可能鼓励在隧道结中隧道。 这些状态缩短了电荷载体必须穿过隧道结的距离。

    Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
    66.
    发明申请
    Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices 有权
    用于封装发光器件和芯片级封装发光器件的芯片级方法

    公开(公告)号：US20060006404A1

    公开(公告)日：2006-01-12

    申请号：US11171893

    申请日：2005-06-30

    申请人： James Ibbetson ,  Bernd Keller ,  Primit Parikh

    发明人： James Ibbetson ,  Bernd Keller ,  Primit Parikh

    IPC分类号： H01L29/22 ,  H01L21/00

    CPC分类号： H01L33/486 ,  H01L23/481 ,  H01L24/48 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the substrate in electrical contact with the first conductive via. A diode having first and second electrodes is mounted on the bond pad with the first electrode is in electrical contact with the bond pad. A passivation layer is formed on the diode, exposing the second electrode of the diode. A conductive trace is formed on the top surface of the carrier substrate in electrical contact with the second conductive via and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode. Methods of packaging light emitting devices include providing an epiwafer including a growth substrate and an epitaxial structure on the growth substrate, bonding a carrier substrate to the epitaxial structure of the epiwafer, forming a plurality of conductive vias through the carrier substrate, defining a plurality of isolated diodes in the epitaxial structure, and electrically connecting at least one conductive via to respective ones of the plurality of isolated diodes.

    摘要翻译： 封装的发光器件包括具有顶表面和底表面的载体衬底，从衬底的顶表面延伸到衬底的底表面的第一和第二导电通孔以及衬底的顶表面上的接合焊盘 与第一导电通孔电接触。 具有第一和第二电极的二极管安装在接合焊盘上，第一电极与接合焊盘电接触。 在二极管上形成钝化层，使二极管的第二电极露出。 导电迹线形成在载体基板的顶表面上，与第二导电通孔和第二电极电接触。 导电迹线在钝化层上并延伸穿过第二电极。 封装发光器件的方法包括在生长衬底上提供包括生长衬底和外延结构的外延膜，将载体衬底结合到外延膜的外延结构，形成通过载体衬底的多个导电通孔，限定多个 隔离二极管，并且将至少一个导电通孔电连接到多个隔离二极管中的相应二极管。

    Light emitting diodes including modifications for light extraction
    67.
    发明授权
    Light emitting diodes including modifications for light extraction 有权
    发光二极管，包括光提取的修改

    公开(公告)号：US06791119B2

    公开(公告)日：2004-09-14

    申请号：US10057821

    申请日：2002-01-25

    申请人： David B. Slater, Jr. ,  Robert C. Glass ,  Charles M. Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric J. Tarsa

    发明人： David B. Slater, Jr. ,  Robert C. Glass ,  Charles M. Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric J. Tarsa

    IPC分类号： H01L3300

    CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.

    摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。 凹槽可以包括锥形侧壁和/或斜面底板。 衬底的第一面也可以包括一组通孔。 通孔可以包括锥形侧壁和/或底板。

    Multiple conversion material light emitting diode package and method of fabricating same
    70.
    发明申请
    Multiple conversion material light emitting diode package and method of fabricating same 有权
    多重转换材料发光二极管封装及其制造方法

    公开(公告)号：US20090095966A1

    公开(公告)日：2009-04-16

    申请号：US11974431

    申请日：2007-10-10

    申请人： Bernd Keller ,  James Ibbetson

    发明人： Bernd Keller ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： C09K11/7734 ,  H01L33/504 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) emitting light at a wavelength within a wavelength range and a plurality of phosphors. Each of the phosphors absorbs at least some light from the LED and re-emits a different wavelength of light. The package emits a combination of light from the LED and the plurality of phosphors, with the phosphors having excitation characteristics such that the emitter package emits light within a standard deviation of a target color for LEDs emitting at the wavelengths with the wavelength range. A method for fabricating emitter packages comprising fabricating a plurality of LEDs, each of which emits at a wavelength within a range of wavelengths. Each of the LEDs are arranged in a respective package with a plurality of conversion materials so that at least some light from each of the LEDs is absorbed and re-emitted by its corresponding conversion materials. The plurality of conversion materials have excitation characteristics that compensate for different LED emission wavelengths within the LED range of wavelengths such that each of the LED packages emits light within a standard deviation from a target color.

    摘要翻译： 一种发射器封装，包括发射波长范围内的波长的发光二极管（LED）和多个荧光体。 每个磷光体吸收来自LED的至少一些光并重新发射不同波长的光。 该封装发射来自LED和多个荧光体的光的组合，其中荧光体具有激发特性，使得发射器封装在对波长范围内发射的LED的目标颜色的标准偏差内发射光。 一种用于制造发射器封装的方法，包括制造多个LED，每个LED以波长范围内的波长发射。 每个LED被布置在具有多个转换材料的相应封装中，使得来自每个LED的至少一些光被其相应的转换材料吸收和重新发射。 多个转换材料具有激励特性，其补偿在LED波长范围内的不同LED发射波长，使得每个LED封装在与目标颜色的标准偏差内发射光。