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公开(公告)号：US20110197430A1
公开(公告)日：2011-08-18
申请号：US13090676
申请日：2011-04-20
申请人： Benson Chan , Matthew J. Lauffer
发明人： Benson Chan , Matthew J. Lauffer
IPC分类号： H05K13/00
CPC分类号： H05K7/1061 , H05K7/1007 , Y10T29/49002 , Y10T29/49204 , Y10T29/49222 , Y10T29/53174 , Y10T29/53209 , Y10T29/53213 , Y10T29/53283 , Y10T29/53678
摘要： A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.
摘要翻译： 弹簧致动夹紧机构具有带有上表面和下表面的支承板。 沿着支撑板的周边形成一组孔。 背板的上表面具有至少一个支承板凹部，最好在其中形成四个凹部。 螺纹孔也形成在后板中。 还提供压缩板。 沿着压缩板的周边形成第二组孔。 压缩板的下表面具有至少一个压缩板凹部和至少一个压缩板孔。 至少一个压缩弹簧设置在支承板和压缩板之间。 螺钉张力释放机构拧入支承板螺纹孔并插入通过压板孔。 当释放机构松动时，支撑板向下受力，对夹紧机构所附着的印刷电路板或卡上的所有电触头施加均匀的力。
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公开(公告)号：US07501839B2
公开(公告)日：2009-03-10
申请号：US11607973
申请日：2006-12-04
申请人： Benson Chan , Frank D. Egitto , Voya R. Markovich
发明人： Benson Chan , Frank D. Egitto , Voya R. Markovich
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/0735 , G01R1/07378 , H05K1/0393 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09627 , H05K2201/09745 , H05K2201/10378
摘要： A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.
摘要翻译： 一种测试装置，其使用一对基板和壳体将主机基板（例如，PCB）与电子设备（例如，半导体芯片）相互连接，以实现设备的测试。 该装置包括被设计用于定位在PCB上的壳体，并且在装置接合期间其中一个基板定向于其中。 上（第二）衬底的接合触点被雕刻以确保有效的芯片连接。
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公开(公告)号：US20070075726A1
公开(公告)日：2007-04-05
申请号：US11607973
申请日：2006-12-04
申请人： Benson Chan , Frank Egitto , Voya Markovich
发明人： Benson Chan , Frank Egitto , Voya Markovich
IPC分类号： G01R31/26
CPC分类号： G01R1/06711 , G01R1/0735 , G01R1/07378 , H05K1/0393 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09627 , H05K2201/09745 , H05K2201/10378
摘要： A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.
摘要翻译： 一种测试装置，其使用一对基板和壳体将主机基板（例如，PCB）与电子设备（例如，半导体芯片）互连以完成设备的测试。 该装置包括被设计用于定位在PCB上的壳体，并且在装置接合期间其中一个基板定向于其中。 上（第二）衬底的接合触点被雕刻以确保有效的芯片连接。
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公开(公告)号：US20060180343A1
公开(公告)日：2006-08-17
申请号：US11215206
申请日：2005-08-31
申请人： Benson Chan , John Lauffer
发明人： Benson Chan , John Lauffer
CPC分类号： H05K3/4641 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H05K3/383 , H05K2201/0355 , H05K2203/0353
摘要： A circuitized substrate in which three conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to two dielectric layers. Each of the foil surfaces which physically bond to a respective dielectric layer are smooth (e.g., preferably by chemical processing) and may include a thin, organic layer thereon. One of the conductive layers may function as a ground or voltage (power) plane while the other two may function as signal planes with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.
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公开(公告)号：US06981880B1
公开(公告)日：2006-01-03
申请号：US10873037
申请日：2004-06-22
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电触点对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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公开(公告)号：US20050282409A1
公开(公告)日：2005-12-22
申请号：US10873037
申请日：2004-06-22
申请人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
发明人： William Brodsky , William Buchler , Benson Chan , Michael Gaynes
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电接触对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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67.发明授权公开(公告)号：US06892451B2
公开(公告)日：2005-05-17
申请号：US10361659
申请日：2003-02-10
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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公开(公告)号：US06545226B2
公开(公告)日：2003-04-08
申请号：US09871556
申请日：2001-05-31
IPC分类号： H05K111
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
摘要翻译： 描述印刷电路板（PWB）子组件的细节及其制造方法。 子组件包括通过多个连接电连接到一个或多个区域阵列器件（例如模块或印刷线路板）的印刷电路板。 子组件可以作为原始组件的一部分。 子组件可以用作可以容易地替代为故障组件的后市场项目，其中印刷电路板与一个或两个区域阵列器件之间的尺寸空间必须为表面安装的器件提供足够的间隙。
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69.发明授权Printed circuit board to module mounting and interconnecting structure and method 失效印刷电路板到模块安装和互连结构和方法公开(公告)号：US06386890B1
公开(公告)日：2002-05-14
申请号：US09804529
申请日：2001-03-12
IPC分类号： G01R1200
CPC分类号： H05K3/325 , H01R12/7047
摘要： The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.
摘要翻译： 本发明提供一种用于将模块连接到印刷电路板的方法和结构，其中具有弹性导体的基本上刚性的插入件设置在模块和印刷电路板之间。 夹紧装置通过压缩力将模块和印刷电路板朝向彼此朝向插入器定位在其间的优选地引导模块和印刷电路板变形，从而使它们的电触点与插入器的表面对齐。 插入器还包括多个孔，每个孔还具有用于将模块接触件连接到PCB触点的可变形的弹性导体装置。 导体可以在剪切中变形，其可以移动，并因此补偿模块和PCB之间的CTE尺寸失配。 导体是可拆卸的，电连接模块和PCB触点，而不需要焊料或其他永久手段。
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公开(公告)号：US6015301A
公开(公告)日：2000-01-18
申请号：US121452
申请日：1998-07-23
IPC分类号： G06F1/18 , H01L23/32 , H01R4/26 , H01R12/51 , H01R12/57 , H01R33/76 , H05K3/32 , H05K7/10 , H01R9/09
CPC分类号： H01R12/57 , H01R12/79 , H05K3/325 , H05K7/1061 , H01R4/26
摘要： A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
摘要翻译： 具有能够更换表面安装部件的能力的表面安装插座。 组件通过弹簧偏向衬底上的区域阵列位置。 部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。 提供了一种用于其的互连结构。
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