公开(公告)号：US20080041615A1

公开(公告)日：2008-02-21

申请号：US11838365

申请日：2007-08-14

申请人： Hui ZHONG ,  Kenichi Shimada ,  Yukihiko Toyoda ,  Motoo Asai ,  Dongdong Wang ,  Koji Sekine ,  Yoshitaka Ono

发明人： Hui ZHONG ,  Kenichi Shimada ,  Yukihiko Toyoda ,  Motoo Asai ,  Dongdong Wang ,  Koji Sekine ,  Yoshitaka Ono

IPC分类号： H05K1/03

CPC分类号： H05K3/285 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/4602

摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

摘要翻译： 本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层 基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

公开(公告)号：US20070223349A1

公开(公告)日：2007-09-27

申请号：US11508628

申请日：2006-08-22

申请人： Kenichi Shimada ,  Kunikazu Ohnishi ,  Nobuhiro Konuma

发明人： Kenichi Shimada ,  Kunikazu Ohnishi ,  Nobuhiro Konuma

IPC分类号： G11B7/00

CPC分类号： G11B7/1367 ,  G11B7/0903 ,  G11B2007/0006 ,  G11B2007/0013

摘要： An optical pickup for writing information to and/or for reading information from an optical disc having at least two recording layers (dual layer) provided with first and second recording layers can prevent layer crosstalk resulting from disturbing a signal reproduced from the first recording layer by a reflected light beam reflected from the second recording layer during a writing operation for writing information to the first recording layer or a reading operation for reading information from the fist recording layer. An orthogonal polarization region forming component forms an orthogonal polarization region, in which respective directions of polarization of a first light beam focused on and reflected by a first recording layer of an optical disc and a second light beam reflected by a second recording layer of the optical disc are perpendicular to each other, in a region, in which the first and the second light beam overlap each other, on a light-receiving surface of a detector. The orthogonal polarization region forming component is a polarization switch for changing the directions of polarization of part or all of the first and the second light beam.

摘要翻译： 用于向具有第一和第二记录层的至少两个记录层（双层）的光盘写入信息和/或从其读取信息的光学拾取器可以防止由于干扰由第一记录层再现的信号而引起的层串扰 在用于将信息写入第一记录层的写入操作期间从第二记录层反射的反射光束或用于从第一记录层读取信息的读取操作。 正交偏振区域形成部件形成正交偏振区域，其中聚焦在光盘的第一记录层上的第一光束的偏振方向和由光学器件的第二记录层反射的第二光束 在第一和第二光束彼此重叠的区域中，光盘在检测器的光接收表面上彼此垂直。 正交偏振区域形成部件是用于改变第一和第二光束的部分或全部的偏振方向的偏振开关。

公开(公告)号：US07152545B2

公开(公告)日：2006-12-26

申请号：US11003978

申请日：2004-12-06

申请人： Katsuhiko Sasayama ,  Kenichi Shimada

发明人： Katsuhiko Sasayama ,  Kenichi Shimada

IPC分类号： B63H25/12 ,  B62D1/18 ,  B62D5/07

CPC分类号： B63H25/02 ,  B63H25/12 ,  B63H2025/022

摘要： A manual hydraulic steering apparatus of a vessel is provided with a tilting mechanism 1 positioned on one side of a dashboard D and a hydraulic pump 51 positioned on the other side. A tilt housing 2 is fixed to a mounting plate 3 and has an oil feeding tank 11 formed in an upper portion thereof. A semispherical shell 4 is supported turnably in all directions by the tilt housing 2. A steering shaft 5 is supported rotatably by the semispherical shell 4 and is rotatably coupled to the driving shaft 53. The steering shaft 5 is also tiltable on a horizontal axis perpendicular to the driving shaft. The hydraulic pump 51 includes a pump casing 52, which has a mounting part 52b extending into a larger hole D1 of the dashboard D. An oil feeding pipe 13 extends through a smaller hole D2 of the dashboard D and communicates with the oil feeding tank 11 and an oil tank 54 of the hydraulic pump 51.

摘要翻译： 容器的手动液压转向装置设置有位于仪表板D一侧的倾斜机构1和位于另一侧的液压泵51。 倾斜壳体2固定在安装板3上并具有形成在其上部的供油槽11。 半球形壳体4通过倾斜壳体2在所有方向上可转动地支撑。 转向轴5由半球形壳体4可旋转地支撑并且可旋转地联接到驱动轴53。 转向轴5也可在垂直于驱动轴的水平轴上倾斜。 液压泵51包括泵壳52，其具有延伸到仪表板D的较大孔D 1中的安装部52b。供油管13延伸穿过仪表板D的较小孔D 2并与油连通 进料罐11和液压泵51的油箱54。

公开(公告)号：US20050258522A1

公开(公告)日：2005-11-24

申请号：US11188886

申请日：2005-07-26

申请人： Honchin En ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

发明人： Honchin En ,  Masayuki Hayashi ,  Dongdong Wang ,  Kenichi Shimada ,  Motoo Asai ,  Koji Sekine ,  Tohru Nakai ,  Shinichiro Ichikawa ,  Yukihiko Toyoda

IPC分类号： C23G1/10 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H01L23/495

CPC分类号： C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

摘要翻译： 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

公开(公告)号：US20050100720A1

公开(公告)日：2005-05-12

申请号：US11020035

申请日：2004-12-23

申请人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

发明人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

IPC分类号： H05K3/10 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  B32B15/00 ,  B32B3/00

CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

摘要翻译： 本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半，小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

公开(公告)号：US06778475B2

公开(公告)日：2004-08-17

申请号：US10294943

申请日：2002-11-15

申请人： Katsuhiko Izumi ,  Kunikazu Ohnishi ,  Kenichi Shimada ,  Masayuki Inoue ,  Shinji Fujita

发明人： Katsuhiko Izumi ,  Kunikazu Ohnishi ,  Kenichi Shimada ,  Masayuki Inoue ,  Shinji Fujita

IPC分类号： G11B700

CPC分类号： G11B7/131 ,  G11B7/0903 ,  G11B7/0909 ,  G11B7/0943 ,  G11B2007/0006

摘要： An optical pickup has a semiconductor laser having two laser sources of different wavelengths disposed in the same package, one diffraction grating and one optical detector. A plurality of light reception areas each having four divisional light reception planes of a -character shape are disposed at positions where light beams reflected from an optical disc are applied. A focus error signal is generated by an astigmatism method by using independently these light reception areas and a tracking error signal is generated by a differential phase detection method by using one or both the light reception areas.

摘要翻译： 光拾取器具有设置在相同封装中的两个具有不同波长的激光源的半导体激光器，一个衍射光栅和一个光学检测器。 多个光接收区域，每个具有四个分光接收面的 - 字符形状设置在从光盘反射的光束被施加的位置。 通过独立地使用这些光接收区域通过散光法产生聚焦误差信号，并且通过使用光接收区域中的一个或两个，通过差分相位检测方法生成跟踪误差信号。

公开(公告)号：US06445203B1

公开(公告)日：2002-09-03

申请号：US09456408

申请日：1999-12-08

申请人： Tsuyoshi Yamashita ,  Yoshihito Kobayashi ,  Toshiyuki Kiyokawa ,  Hiroto Nakamura ,  Noriyuki Igarashi ,  Kenichi Shimada

发明人： Tsuyoshi Yamashita ,  Yoshihito Kobayashi ,  Toshiyuki Kiyokawa ,  Hiroto Nakamura ,  Noriyuki Igarashi ,  Kenichi Shimada

IPC分类号： G01R3102

CPC分类号： G01R31/2874 ,  G01R31/2806 ,  G01R31/2856 ,  G01R31/2863

摘要： An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.

摘要翻译： 一种电气设备测试装置，包括：被测试的IC芯片可拆卸地连接到的连接端子，用于沿着连接端子的方向推动IC芯片的推动器，以将IC芯片连接到连接端子，并且温度调节 用于在通过形成在所述推动件上的通孔对IC芯片进行测试期间将温度调节的空气吹送到IC芯片周围。

公开(公告)号：US06365843B1

公开(公告)日：2002-04-02

申请号：US09582665

申请日：2000-06-29

申请人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

发明人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

IPC分类号： H01R1204

CPC分类号： H05K3/4644 ,  H05K1/113 ,  H05K1/115 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/381 ,  H05K3/384 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/099

摘要： A filled-via structure multilayer printed wiring board is provided which exhibits excellent reliability of the connection between via holes. An opening 42 formed in a lower interlaminer resin insulating layer 40 is filled with plated metal 48 so that a lower via hole 50 having a flat surface is formed. An opening 62 is formed in an interlaminer resin insulating layer 60 above the lower via hole 50 so that an upper via hole 70 is formed. Since the lower via hole 50 has a flat surface and resin is not residual on the surface, the reliability of the connection between the lower via hole 50 and the upper via hole 70 can be maintained. Since the lower via hole 50 has a flat surface, the smoothness and flatness of the surface of the multilayer printed wiring board can be maintained even if the upper via hole 70 is superimposed on the lower via hole 50.

摘要翻译： 提供了一种填充通孔结构的多层印刷线路板，其显示了通孔之间的连接的良好的可靠性。 形成在下部层间树脂绝缘层40中的开口42填充有电镀金属48，从而形成具有平坦表面的下通孔50。 在下通孔50上方的层间树脂绝缘层60中形成开口62，从而形成上通孔70。 由于下通孔50具有平坦表面，树脂在表面上不残留，因此可以保持下通孔50和上通孔70之间的连接的可靠性。 由于下通孔50具有平坦的表面，所以即使上通孔70重叠在下通孔50上，也可以保持多层印刷电路板的表面的平滑度和平坦度。

公开(公告)号：US08987603B2

公开(公告)日：2015-03-24

申请号：US13348708

申请日：2012-01-12

申请人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

发明人： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

IPC分类号： H05K1/03 ,  H05K3/46 ,  H05K3/42 ,  H05K3/10 ,  H05K3/38

CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

摘要： A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.

摘要翻译： 多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔 形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且 焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。 填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

公开(公告)号：US08335147B2

公开(公告)日：2012-12-18

申请号：US13086421

申请日：2011-04-14

申请人： Toshiki Ishii ,  Kenichi Shimada ,  Yusuke Nakamura

发明人： Toshiki Ishii ,  Kenichi Shimada ,  Yusuke Nakamura

IPC分类号： G11B7/00

CPC分类号： G11B7/00772 ,  G11B7/08564

摘要： In case of reproducing a hologram recorded on an optical information recording medium, adjusting beam with the amplitude distribution and phase distribution at least partially the same as those of a signal beam upon recording is radiated to the optical information recording medium which records information. The diffracting beam diffracted by the hologram is detected by a photodetector. Based on the detected information, an incident angle of the reference beam to the optical information recording medium is appropriately controlled.

摘要翻译： 在再现记录在光学信息记录介质上的全息图的情况下，在记录信息的光学信息记录介质中照射具有与记录时的信号光束的幅度分布和相位分布至少部分相同的调整光束。 由全息图衍射的衍射光束由光电检测器检测。 基于检测到的信息，适当地控制参考光束对光信息记录介质的入射角度。