摘要:
Here is disclosed a dynamic semiconductor memory of high integration density, which has parallel word lines and parallel bit lines formed on a substrate. The bit lines include a pair of bit lines. A memory cell is coupled to a word line and to one bit line of the bit-line pair. The memory cell is composed of MOSFETs of a submicron size. A sense amplifier section is connected to the pair of bit lines, and senses and amplifies the potential difference between the pair of bit lines in a data readout mode. The amplifier section has a BIMOS structure, having MOSFETs and bipolar transistors. It has a driver section comprised of bipolar transistors.
摘要:
A multichip semiconductor device comprises a plurality of semiconductor chips, each including elements integrated in a semiconductor substrate. The semiconductor chips have substantially the same structure. Each semiconductor chip includes a connecting plug inserted in a through hole made through the semiconductor substrate. The semiconductor chips are stacked in layers. The connecting plugs of the semiconductor chips are selectively connected through metal bumps. Allocation of addresses of the semiconductor chips is designated by a connecting pattern of the bumps.
摘要:
A block size buffer and block address pre-decoder are provided for a flash memory. At the time of data erase, the size of a block to be erased is input to the block size buffer and a set of block addresses is input to the block address pre-decoder. An output signal of the block size buffer is supplied to and decoded by the block address pre-decoder, a row decoder is controlled based on the result of pre-decoding, and a plurality of addressing including the above block address as a top address are selected in a multiple manner. Then, a plurality of successive blocks are simultaneously selected to simultaneously erase data in the memory cells in the plurality of blocks.
摘要:
An NAND cell type EEPROM comprising a memory cell array wherein an NAND cell unit having a plurality of electrically rewritable memory cells is connected in series, and the NAND cell is formed on a semiconductor substrate in a matrix array, a plurality of control gate lines CG each provided to cross an NAND cell group of the same row, bit lines BL each provided to cross the NAND cell group of the same column, wherein driver circuit are provided at both sides of the memory cell array in a ratio of one to two NAND cell units so as to drive the control gate lines CG, the plurality of the control gate lines CG, provided to cross the NAND cell unit of the even row, is connected to the left driver circuit, and the plurality of the control gate lines CG, provided to cross the NAND cell unit of the odd row, is connected to the right driver circuit.
摘要:
A non-volatile semiconductor memory device includes read charging transistors for setting bit lines at a predetermined read potential to perform a data read operation, and read discharging transistors for setting non-selected bit lines at the ground potential during the read operation. These transistors are controlled by different control signals, obtained by detecting an address change, for every other bit line in accordance with an input address so that the read discharging transistors are kept ON to set the non-selected bit lines at the ground potential before and during the data read operation.
摘要:
A semiconductor device including a semiconductor substrate 1 and at least one first column-shaped semiconductor layer 10 of a first channel type formed on semiconductor substrate 1 in order of first, second and third regions, and having a side surface. At least one second column-shaped semiconductor layer 11 of a second channel type is selectively laminated on first semiconductor layer 10 in order of first, second and third regions, and having a side surface. A gate insulation film 8 is formed on the side surfaces of first semiconductor layer 10 and second semiconductor layer 11. A gate electrode 9 is formed on the insulation film 8 extending to an external portion of first semiconductor layer 10. A first source layer 2 and first drain layer 4 are respectively formed in the first and third regions of first semiconductor layer 10. A second source layer 7 and second drain layer 5 are respectively formed in the first and third regions of semiconductor layer 11. An input terminal 14 is connected to gate electrode 9 to lead out to the exterior of first semiconductor layer 10. An output terminal 15 is connected to second drain layer 5 formed on and in low-resistance contact with first drain layer. A first power source terminal 16 is connected to first source layer 2 of first semiconductor layer 10, and a second power source terminal 17 is connected to second source layer 7.
摘要:
A level shift element is contained in a through current path of a CMOS gate of a BiCMOS circuit. The level shift element limits an amplitude of an input signal to the BiCMOS circuit. The limited amplitude of the input signal controls the impact ionization within the CMOS gate, and the increase of a substrate current resulting from the impact ionization, and reduces the through current.
摘要:
A divided bit line type dynamic semiconductor memory device comprises parallel main bit line pairs, divided bit line pairs provided at each main bit line pair, parallel word lines insulatively crossing the divided bit line pairs, and memory cells provided at the cross points between the divided bit line pairs and the word lines. First sense amplifiers are coupled to the divided bit line pairs. Second sense amplifiers are coupled to the main bit line pairs. First transfer gate sections are coupled between the divided bit line pairs and the main bit line pairs, respectively. Second transfer gate sections are coupled between the main bit line pairs and the second sense amplifier circuits, respectively. A charging/discharging current suppressor is provided which, in both of the read and restoring modes, restricts the amplitude of the potential change, due to charging/discharging, of a specifi main bit line pair associated with a selected divided bit line pair including a selected cell to be smaller than a full potential change defined by the source voltage and ground potential of the device, whereby a charging/discharging cuffent flowing through the specific main bit line pair is reduced so that the dissipation power of the dRAM is saved and its operation speed is improved.
摘要:
A semiconductor integrated circuit device including a power supply voltage converter and internal circuits. The converter converts an external power supply voltage to an internal power supply voltage of a predetermined value. The internal circuits are driven by the internal power supply voltage. The internal circuits include a clock generator. The converter comprises a reference voltage generator, an output circuit for lowering the external power supply voltage, thereby outputting the internal power supply voltage, and an error signal amplifier for comparing the internal power supply voltage with the reference voltage generated by the reference voltage generator and for controlling the conductance of the output circuit to make the compared voltages equal. The error signal amplifier includes a control signal generator for generating control signals in response to the clock pulses output by the clock generator, and a current control circuit for changing, in accordance with the control signals, the current supplied from an external power supply to the error signal amplifier.