公开(公告)号：US20110220471A1

公开(公告)日：2011-09-15

申请号：US12932992

申请日：2011-03-11

申请人： Hubert Benzel ,  Christoph Schelling

发明人： Hubert Benzel ,  Christoph Schelling

IPC分类号： H01H59/00 ,  H01H11/00

CPC分类号： B81C1/00484 ,  B81B2201/014 ,  B81C2201/0143 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

摘要： A micromechanical component, e.g., a switch, includes a substrate having at least one recess, at least two electrically conductive contact surfaces provided in the region of the recess, and an actuator. The contact surfaces are able to be brought into contact with one another for electrical conduction with the aid of the actuator.

摘要翻译： 微机械部件例如开关包括具有至少一个凹部，设置在凹部的区域中的至少两个导电接触表面和致动器的基板。 接触表面能够在致动器的帮助下彼此接触以进行导电。

公开(公告)号：US07740459B2

公开(公告)日：2010-06-22

申请号：US10564370

申请日：2004-07-07

申请人： Matthias Fuertsch ,  Hubert Benzel ,  Stefan Finkbeiner ,  Stefan Pinter ,  Frank Fischer ,  Heiko Stahl ,  Tjalf Pirk

发明人： Matthias Fuertsch ,  Hubert Benzel ,  Stefan Finkbeiner ,  Stefan Pinter ,  Frank Fischer ,  Heiko Stahl ,  Tjalf Pirk

IPC分类号： F04B17/03

CPC分类号： F04B43/043

摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.

摘要翻译： 用于制造微机械部件的方法，优选用于具有空腔的流体应用。 该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。 将具有第一图案的第一蚀刻停止层施加到基板。 第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。 具有第二图案的第二蚀刻停止层被施加到第一功能层。 第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。 将蚀刻掩模施加到第二功能层。 通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。 通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。 该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

公开(公告)号：US07679154B2

公开(公告)日：2010-03-16

申请号：US12001289

申请日：2007-12-10

申请人： Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Thorsten Pannek ,  Frank Schäfer

发明人： Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Thorsten Pannek ,  Frank Schäfer

IPC分类号： H01L29/84

CPC分类号： B81C1/00182 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0115 ,  B81C2201/0136 ,  G01L9/0042

摘要： In a method for manufacturing a semiconductor component having a semiconductor substrate, a flat, porous diaphragm layer and a cavity underneath the porous diaphragm layer are produced to form unsupported structures for a component. In a first approach, the semiconductor substrate may receive a doping in the diaphragm region that is different from that of the cavity. This permits different pore sizes and/or porosities to be produced, which is used in producing the cavity for improved etching gas transport. Also, mesopores may be produced in the diaphragm region and nanopores may be produced as an auxiliary structure in what is to become the cavity region.

摘要翻译： 在制造具有半导体衬底的半导体部件的方法中，制造平坦的多孔隔膜层和多孔隔膜层下方的空腔，以形成用于部件的无支撑结构。 在第一种方法中，半导体衬底可以在膜片区域中接收不同于空腔的掺杂。 这允许产生不同的孔径和/或孔隙率，其用于制造用于改善蚀刻气体输送的空腔。 此外，可以在隔膜区域中产生介孔，并且可以在将要成为空腔区域的地方制造纳米孔作为辅助结构。

公开(公告)号：US07563634B2

公开(公告)日：2009-07-21

申请号：US11666179

申请日：2005-08-24

申请人： Hubert Benzel

发明人： Hubert Benzel

IPC分类号： H01L21/00

CPC分类号： G01L19/141 ,  G01L9/0054 ,  G01L19/0038 ,  G01L19/0636 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is described for mounting semiconductor chips and a corresponding semiconductor chip system. The method may include providing a semiconductor chip having a surface that includes a diaphragm region and a peripheral region, the peripheral region having a mounting region, and a cavity being disposed underneath the diaphragm region, which extends into the mounting region and ends there in an opening. The method may also include providing a substrate which has a surface having a recess; mounting the mounting region of the semiconductor chip in flip-chip technology onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region and the opening faces in the direction of the substrate. Additionally, the mounting region is underfilled using an underfilling, the edge of the recess serving as separating region for the underfilling so that no underfilling reaches the diaphragm region; and a through hole is provided through the substrate to the opening of the cavity.

摘要翻译： 描述了用于安装半导体芯片和相应的半导体芯片系统的方法。 该方法可以包括提供具有包括隔膜区域和周边区域的表面的半导体芯片，该周边区域具有安装区域，以及设置在隔膜区域下方的空腔，该空腔延伸到安装区域中并在其中结束 开放 该方法还可以包括提供具有凹部的表面的基板; 将半导体芯片的安装区域以倒装芯片技术安装到基板的表面上，使得凹部的边缘位于安装区域和隔膜区域之间，并且开口面朝向基板的方向。 此外，安装区域使用底部填充底部填充，凹部的边缘用作底部填充的分离区域，使得没有底部填充物到达膜片区域; 并且通孔穿过衬底提供到空腔的开口。

公开(公告)号：US20080254635A1

公开(公告)日：2008-10-16

申请号：US12067569

申请日：2006-09-18

申请人： Hubert Benzel ,  Stefan Pinter ,  Christoph Schelling ,  Tjalf Pirk ,  Julian Gonska ,  Frank Klopf ,  Christina Leinenbach

发明人： Hubert Benzel ,  Stefan Pinter ,  Christoph Schelling ,  Tjalf Pirk ,  Julian Gonska ,  Frank Klopf ,  Christina Leinenbach

IPC分类号： H01L21/306

CPC分类号： H01L21/3065 ,  B81C1/00531 ,  B81C2201/0135 ,  H01L21/26506 ,  H01L21/266 ,  H01L21/32135 ,  H01L21/78

摘要： A method for the plasma-free etching of silicon using the etching gas ClF3 or XeF2 and its use are provided. The silicon is provided having one or more areas to be etched as a layer on the substrate or as the substrate material itself. The silicon is converted into the mixed semiconductor SiGe by introducing germanium and is etched by supplying the etching gas ClF3 or XeF2. The introduction of germanium and the supply of the etching gas ClF3 or XeF2 may be performed at the same time or alternatingly. In particular, it is provided that the introduction of germanium be performed by implanting germanium ions in silicon.

摘要翻译： 提供了使用蚀刻气体ClF 3 X或XeF 2 2等离子体蚀刻硅的方法及其用途。 硅被提供有一个或多个要被蚀刻的区域作为衬底上的层或作为衬底材料本身。 通过引入锗将硅转换成混合半导体SiGe，并通过供给蚀刻气体ClF 3 X或XeF 2 2进行蚀刻。 可以同时或交替地进行锗的引入和蚀刻气体ClF 3 X或XeF 2 2的供给。 特别地，提供通过在锗中注入锗离子来进行锗的引入。

公开(公告)号：US20080128840A1

公开(公告)日：2008-06-05

申请号：US11666179

申请日：2005-08-24

申请人： Hubert Benzel

发明人： Hubert Benzel

IPC分类号： H01L29/84 ,  H01L21/52

CPC分类号： G01L19/141 ,  G01L9/0054 ,  G01L19/0038 ,  G01L19/0636 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is described for mounting semiconductor chips and a corresponding semiconductor chip system. The method may include providing a semiconductor chip having a surface that includes a diaphragm region and a peripheral region, the peripheral region having a mounting region, and a cavity being disposed underneath the diaphragm region, which extends into the mounting region and ends there in an opening. The method may also include providing a substrate which has a surface having a recess; mounting the mounting region of the semiconductor chip in flip-chip technology onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region and the opening faces in the direction of the substrate. Additionally, the mounting region is underfilled using an underfilling, the edge of the recess serving as separating region for the underfilling so that no underfilling reaches the diaphragm region; and a through hole is provided through the substrate to the opening of the cavity.

摘要翻译： 描述了用于安装半导体芯片和相应的半导体芯片系统的方法。 该方法可以包括提供具有包括隔膜区域和周边区域的表面的半导体芯片，该周边区域具有安装区域，以及设置在隔膜区域下方的空腔，该空腔延伸到安装区域中并在其中结束 开放 该方法还可以包括提供具有凹部的表面的基板; 将半导体芯片的安装区域以倒装芯片技术安装到基板的表面上，使得凹部的边缘位于安装区域和隔膜区域之间，并且开口面朝向基板的方向。 此外，安装区域使用底部填充底部填充，凹部的边缘用作底部填充的分离区域，使得没有底部填充物到达膜片区域; 并且通孔穿过衬底提供到空腔的开口。

公开(公告)号：US07193290B2

公开(公告)日：2007-03-20

申请号：US10479563

申请日：2002-07-06

申请人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

发明人： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC分类号： H01L31/058

CPC分类号： G01N27/121

摘要： A semiconductor component, such as a humidity sensor, which has a semiconductor substrate, such as, for example, made of silicon, a first electrode and a second electrode and at least one first layer that is accessible for a medium acting from the outside on the semiconductor component, the first layer being arranged at least partially between the first and the second electrode. To reduce the costs for producing the semiconductor component the first layer has pores into which the medium reaches at least partially.

摘要翻译： 诸如湿度传感器的半导体部件，其具有例如由硅制成的半导体衬底，第一电极和第二电极以及至少一个第一层，该第一层可从外部作用的介质 半导体部件，第一层至少部分地布置在第一和第二电极之间。 为了降低制造半导体部件的成本，第一层具有至少部分介质到达的孔。

公开(公告)号：US20060186085A1

公开(公告)日：2006-08-24

申请号：US10564370

申请日：2004-07-07

申请人： Matthias Fuertsch ,  Hubert Benzel ,  Stefan Finkbeiner ,  Stefan Pinter ,  Frank Fischer ,  Heiko Stahl ,  Tjalf Pirk

发明人： Matthias Fuertsch ,  Hubert Benzel ,  Stefan Finkbeiner ,  Stefan Pinter ,  Frank Fischer ,  Heiko Stahl ,  Tjalf Pirk

IPC分类号： C23F1/00 ,  F04B17/00

CPC分类号： F04B43/043

摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.

摘要翻译： 用于制造微机械部件的方法，优选用于具有空腔的流体应用。 该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。 将具有第一图案的第一蚀刻停止层施加到基板。 第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。 具有第二图案的第二蚀刻停止层被施加到第一功能层。 第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。 将蚀刻掩模施加到第二功能层。 通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。 通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。 该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

公开(公告)号：US20050186703A1

公开(公告)日：2005-08-25

申请号：US11041157

申请日：2005-01-21

申请人： Kurt Weiblen ,  Hubert Benzel ,  Stefan Pinter ,  Roland Guenschel ,  Frieder Haag

发明人： Kurt Weiblen ,  Hubert Benzel ,  Stefan Pinter ,  Roland Guenschel ,  Frieder Haag

IPC分类号： H01L23/02 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C3/00 ,  G01L9/00 ,  G01P1/02 ,  H01L21/50 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60

CPC分类号： B81B7/0051 ,  B81C2203/0154 ,  G01L19/141 ,  G01P1/023 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

摘要翻译： 一种用于封装半导体芯片的方法和相应的半导体芯片系统。 该方法包括提供具有隔膜区域的半导体芯片; 在隔膜区域上提供盖子，同时使隔膜区域打开; 将半导体芯片安装在支撑框架上; 以及提供围绕半导体芯片的模制外壳和用于包装半导体芯片的支撑框架的至少一部分区域。

公开(公告)号：US20050133880A1

公开(公告)日：2005-06-23

申请号：US11016617

申请日：2004-12-17

申请人： Hubert Benzel ,  Stefan Finkbeiner ,  Christoph Schelling ,  Julian Gonska

发明人： Hubert Benzel ,  Stefan Finkbeiner ,  Christoph Schelling ,  Julian Gonska

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G02B26/00 ,  G02B26/08

CPC分类号： B81B7/0006 ,  G02B26/0833

摘要： A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.

摘要翻译： 描述了使用该方法制造微机械部件和微机械部件的方法，该微机械部件具有第一基板，该第一基板又具有至少一个空腔和一个印刷导体。 印刷导体的至少一部分被施加到空腔的至少一部分壁。 特别地，空腔的地板被认为是腔壁的一部分。