公开(公告)号：US10672958B2

公开(公告)日：2020-06-02

申请号：US16215644

申请日：2018-12-11

Applicant: NICHIA CORPORATION

Inventor： Toru Hashimoto ,  Yukihiro Shibano

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62

Abstract: A method for manufacturing a light emitting device includes providing a frame having a through hole extending from a frame upper surface to a frame lower surface in a height direction. The frame has a communication path extending from a frame outer lateral surface to a frame inner lateral surface on the frame lower surface. A support body is provided on the frame lower surface. A light emitting element is provided on a support body upper surface in the through hole. Resin is injected into the through hole via the communication path to provide a covering member in the through hole such that at least a part of an element upper surface of the light emitting element is exposed from the covering member. A light-transmissive member is provided on the element upper surface and the covering member. The support body is removed.

公开(公告)号：US10068821B2

公开(公告)日：2018-09-04

申请号：US13944837

申请日：2013-07-17

Applicant: NICHIA CORPORATION

Inventor： Takeaki Shirase ,  Toru Hashimoto

IPC: H01L23/06 ,  H01L23/13 ,  H01L23/495 ,  H01L23/00 ,  H01L23/29 ,  H01L33/62

CPC classification number: H01L23/13 ,  H01L23/293 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/32 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/293 ,  H01L2224/32014 ,  H01L2224/32056 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48684 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83138 ,  H01L2224/83143 ,  H01L2224/83385 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83473 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/3025 ,  H01L2924/3641 ,  H01L2924/3656 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor component support is provided which includes a component support portion for a semiconductor component to be mounted on the semiconductor component support portion. The component support portion includes a metal part that includes an opening in plan view. The opening of the metal part includes first and second sections. The second section communicates with the first section, and is arranged outside the first section. The second section is wider than the first section. The first section can be at least partially positioned directly under a mount-side main surface of the semiconductor component.