公开(公告)号：US10903400B2

公开(公告)日：2021-01-26

申请号：US16290229

申请日：2019-03-01

Applicant: NICHIA CORPORATION

Inventor： Daigo Hiraoka ,  Takeaki Shirase

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/52 ,  H01L33/60

Abstract: A light emitting device includes a first light emitting element and a first covering member. The first light emitting element has a peak emission wavelength in a range of 430 nm or greater and less than 490 nm. The first covering member covers the first light emitting element, and contains a first phosphor having a peak emission wavelength in a range of 490 nm and 570 nm or less. A content of the first phosphor is 50 weight % or greater with respect to a total weight of the first covering member. A mixed color light in which light emitted from the first light emitting element and light emitted from the first phosphor are mixed has an excitation purity of 60% or greater on a 1931CIE chromaticity diagram. The first phosphor contains secondary particles.

公开(公告)号：US10068821B2

公开(公告)日：2018-09-04

申请号：US13944837

申请日：2013-07-17

Applicant: NICHIA CORPORATION

Inventor： Takeaki Shirase ,  Toru Hashimoto

IPC: H01L23/06 ,  H01L23/13 ,  H01L23/495 ,  H01L23/00 ,  H01L23/29 ,  H01L33/62

CPC classification number: H01L23/13 ,  H01L23/293 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/32 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/293 ,  H01L2224/32014 ,  H01L2224/32056 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48684 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83138 ,  H01L2224/83143 ,  H01L2224/83385 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83473 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/3025 ,  H01L2924/3641 ,  H01L2924/3656 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor component support is provided which includes a component support portion for a semiconductor component to be mounted on the semiconductor component support portion. The component support portion includes a metal part that includes an opening in plan view. The opening of the metal part includes first and second sections. The second section communicates with the first section, and is arranged outside the first section. The second section is wider than the first section. The first section can be at least partially positioned directly under a mount-side main surface of the semiconductor component.

公开(公告)号：US08703511B2

公开(公告)日：2014-04-22

申请号：US13975658

申请日：2013-08-26

Applicant: Nichia Corporation

Inventor： Kosuke Matoba ,  Takeaki Shirase

IPC: H01L21/00

CPC classification number: H01L33/483 ,  H01L23/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/16315 ,  H01L2924/00014

Abstract: A light emitting device is manufactured in which a cap having a frame portion is bonded to a package having a light emitting element mounted in a recess of the package to cover an opening of the recess. A method for manufacturing the light emitting device includes: partially disposing a metal bonding agent, having greater wettability to the frame portion than to the package, to one of the package and the frame portion; and bonding the package and the frame portion by extending the metal bonding agent along the frame portion so that ends of the metal bonding agent are joined to each other while defining a space at a joining portion where the ends of the metal bonding agent are joined.

Abstract translation: 一种制造发光器件，其中具有框架部分的盖子被结合到具有安装在封装的凹部中的发光元件的封装体以覆盖凹部的开口。 一种制造发光器件的方法包括：将部分地布置具有比包装件更大程度地对框架部分的润湿性的金属粘合剂到包装和框架部分中的一个; 以及通过沿着所述框架部分延伸所述金属粘合剂来使所述包装和所述框架部分接合，使得所述金属粘结剂的端部彼此接合，同时在所述金属粘合剂的端部接合的接合部分处形成空间。