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70 条记录 (耗时 0.027 秒)

    Liquid atomizing nozzle
    61.
    发明授权
    Liquid atomizing nozzle 失效
    液体雾化喷嘴

    公开(公告)号：US06786430B2

    公开(公告)日：2004-09-07

    申请号：US10345956

    申请日：2003-01-17

    申请人： Shigeru Hayashi

    发明人： Shigeru Hayashi

    IPC分类号： B05B710

    CPC分类号： F23C7/004 ,  F23D11/107 ,  F23D2900/11101

    摘要： This invention provides a liquid atomizing nozzle which utilizes a swirling flow of gas to form a liquid film in as uniform thickness as possible in a circumferential direction, and in which blockages are difficult to develop, and which can facilitate atomization by further reducing the size of the droplets which disperse from the front end. A liquid injected into an annular space 7 through liquid passages 14 formed in an outer cylinder 2 in an incline to the radial direction, flows within the annular space 7 having a component swirling in the circumferential direction. Air which flows into the annular space 7 through air passages 10 formed inclined in the same direction as the liquid passages in the outer cylinder 2, develops a swirling flow Ac within the annular space 7, acts upon the injected liquid to spread it onto an inner wall 5 of the outer cylinder 2, and further improving the uniformity of the thickness of the liquid film in a circumferential direction. When the liquid film disperses from the front end edge 16 of the outer cylinder 2, atomization is facilitated and the size of the droplets may be reduced further.

    摘要翻译： 本发明提供一种液体雾化喷嘴，其利用气流的旋转流形成在圆周方向上尽可能均匀厚度的液膜，并且其中堵塞难以发展，并且其可以通过进一步减小尺寸 从前端分散的液滴。 通过形成在外筒2中的沿着径向的倾斜的液体通道14注入到环状空间7内的液体在具有沿圆周方向旋转的部件的环形空间7内流动。 通过在与外筒2中的液体通道相同的方向上倾斜形成的空气通道10流入环形空间7的空气在环形空间7内产生旋转流Ac，作用在喷射的液体上以将其分散到内部 外筒2的壁5，并且进一步提高液膜在圆周方向上的厚度的均匀性。 当液膜从外筒2的前端边缘16分散时，易于雾化，并且可以进一步降低液滴的尺寸。

    Automatic winding machine
    62.
    发明授权
    Automatic winding machine 失效
    自动绕线机

    公开(公告)号：US6123283A

    公开(公告)日：2000-09-26

    申请号：US177107

    申请日：1998-10-22

    申请人： Shigeru Hayashi ,  Toshio Matsubara

    发明人： Shigeru Hayashi ,  Toshio Matsubara

    IPC分类号： B65H59/38 ,  B65H59/10 ,  B65H69/00 ,  B65H54/02

    CPC分类号： B65H59/10 ,  B65H69/00 ,  B65H2701/31

    摘要： To provide an automatic winding machine wherein even if a yarn splicing operation is carried out during the reduction of yarn winding tension at the time of winding yarn splicing, the subsequent winding tension can be maintained at an appropriate value depending upon the amount of remaining yarn. In an automatic winding machine including a tension apparatus 2 that can adjust yarn winding tension by reducing it at a predetermined rate at the time of yarn splicing, a rapid tension reduction pattern used after a yarn splicing operation during tension reduction at the time of yarn splicing is different from a rapid tension reduction pattern used after the yarn splicing operation during normal winding.

    摘要翻译： 为了提供一种自动卷绕机，其中即使在卷绕接纱时的纱线卷绕张力的降低期间进行接纱操作，随后的卷绕张力也可以根据剩余的纱线的量而保持在适当的值。 在一种自动卷绕机中，包括张力装置2，该张力装置2可以通过在接头时以预定速率减小来调节纱线卷绕张力，在接头时的拉伸减小期间的接头操作之后使用的快速张力降低图案 与在正常卷绕期间的接头操作之后使用的快速张力降低图案不同。

    Method for fabricating a semiconductor device
    64.
    发明授权
    Method for fabricating a semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号：US5616509A

    公开(公告)日：1997-04-01

    申请号：US534944

    申请日：1995-09-28

    申请人： Shigeru Hayashi

    发明人： Shigeru Hayashi

    IPC分类号： H01L29/73 ,  H01L21/331 ,  H01L21/336 ,  H01L21/8222 ,  H01L21/8249 ,  H01L27/06 ,  H01L29/06 ,  H01L29/732 ,  H01L29/78 ,  H01L21/265

    CPC分类号： H01L29/66272 ,  H01L29/0653 ,  H01L29/66575 ,  H01L29/7833

    摘要： It is the object of the invention to provide a method for fabricating a semiconductor device, such as a bipolar transistor, with improved characteristics when used in a semiconductor integrated circuit, without increasing the steps in fabricating process. In forming the graft base of the bipolar transistor, oxygen ions with higher energy than that of impurities are injected through the same mask. Thereafter, an insulating film is formed under the graft base region, by activating thermal treatment. Moreover, in a semiconductor integrated circuit of BiCMOS type, insulation films are formed under a source and a drain of a P-type transistor.

    摘要翻译： 本发明的目的是提供一种用于制造半导体器件（例如双极晶体管）的方法，其在用于半导体集成电路中具有改进的特性，而不增加制造工艺中的步骤。 在形成双极晶体管的接枝基底时，通过相同的掩模注入能量高于杂质的氧离子。 此后，通过激活热处理在接枝基底区域下形成绝缘膜。 此外，在BiCMOS型半导体集成电路中，在P型晶体管的源极和漏极下形成绝缘膜。

    Method and apparatus for measuring the size of a single fine particle and the size distribution of fine particles
    68.
    发明授权
    Method and apparatus for measuring the size of a single fine particle and the size distribution of fine particles 失效
    用于测量单个细颗粒尺寸的方法和装置以及细颗粒的尺寸分布

    公开(公告)号：US5229839A

    公开(公告)日：1993-07-20

    申请号：US795269

    申请日：1991-11-20

    申请人： Shigeru Hayashi ,  Shoji Horiuchi

    发明人： Shigeru Hayashi ,  Shoji Horiuchi

    IPC分类号： G01N15/02

    CPC分类号： G01N15/0205 ,  G01N15/0211 ,  G01N2021/4716

    摘要： The invention relates to a method and an apparatus for determining the size or the size distribution of fine particles. A single particle or a group of particles are shone by a parallel polarized beam of a single wave length and the scattered intensity on the plane of polarization of the incident beam is measured by a photodetecting array. For a single particle the size is determined from the peak scattering angle at which the profile of the product of the scattered intensity and the scattering angle has the peak. On the other hand, for a group of particles, the size distribution is determined from the angular variation of the scattered intensity or the profile of the product of the scattered intensity and the scattering angle measured on the plane of polarization of the incident beam. For fine particles mixed with large particles the scattered intensities on the plane at a right angle to the plane of polarization measured by another photodetecting array is used to improve the accuracy of size determination of the fine particles.

    摘要翻译： 本发明涉及一种用于确定细颗粒尺寸或尺寸分布的方法和装置。 单个粒子或一组粒子由单波长的平行偏振光束照射，并且通过光电检测阵列测量入射光束的偏振平面上的散射强度。 对于单个颗粒，尺寸由散射强度和散射角的乘积的轮廓具有峰值的峰值散射角确定。 另一方面，对于一组粒子，根据在入射光束的偏振面上测量的散射强度和散射角的乘积的散射强度或轮廓的角度变化来确定尺寸分布。 对于与大颗粒混合的细颗粒，使用由另一光电检测阵列测量的与偏振平面成直角的平面上的散射强度来提高细颗粒的尺寸确定的精度。

    Low profile socket connector
    69.
    发明授权
    Low profile socket connector 失效
    低端插座连接器

    公开(公告)号：US5161983A

    公开(公告)日：1992-11-10

    申请号：US654091

    申请日：1991-02-11

    申请人： Hirofumi Ohno ,  Shigeru Hayashi

    发明人： Hirofumi Ohno ,  Shigeru Hayashi

    IPC分类号： H01R12/00 ,  H05K7/10

    CPC分类号： H05K7/1084

    摘要： A low profile socket connector includes a plastic, rectangular, frame-like base member (11) having substantially rigid walls (21,22,23,24) defining between them a socket (20), receiving an LGA device (16) in coplanar relation. Beam springs (34,35), integrally formed with two adjacent walls (22,24) adjacent one corner, protrude into the socket (20) into biassing engagement with adjacent edge portions of the LGA device (16) forcing opposite adjacent edge portions into abutment with walls (23,25) defining the opposite corner, automatically locating and maintaining the device (16) in a reference position (A). A stud-like, outer securing member (14) with flexible legs (48) is insertable in a mounting socket (38) in the base member (11) and through an aperture in a circuit board (18) and an inner securing member (15) is completely receivable in an axial passageway (43) in the outer securing member (14) to spread the legs (48) into anchoring engagement with the circuit board (18). Recesses (27,28) with retaining pins (31,32) on a lower face of the base member (11) enable secure preassembly of an elastomer connector (13) on the base member (11) prior to application to the circuit board (18).

    摘要翻译： 小型插座连接器包括具有基本刚性壁（21,22,23,24）的塑料矩形框架状基座构件（21,22,23,24），其在它们之间限定插座（20），接收共面的LGA装置（16） 关系。 与一个角部相邻的两个相邻壁（22,24）整体形成的光束弹簧（34,35）突出到插座（20）中，与LGA装置（16）的相邻边缘部分进行偏置接合，从而将相对的相邻边缘部分 与限定相对角的壁（23,25）邻接，自动地将装置（16）定位并保持在参考位置（A）中。 具有柔性支脚（48）的螺柱状的外部固定构件（14）可插入基座构件（11）中的安装插座（38）中并通过电路板（18）和内部固定构件 15）完全可接收在外部固定构件（14）中的轴向通道（43）中，以将腿部（48）扩展成与电路板（18）的锚固接合。 在基部构件（11）的下表面上具有固定销（31,32）的凹槽（27,28）使得能够在施加到电路板之前将弹性体连接器（13）安装在基座构件（11）上 18）。

    Polypropylene-base resin composition
    70.
    发明授权
    Polypropylene-base resin composition 失效
    聚丙烯基树脂组合物

    公开(公告)号：US4705818A

    公开(公告)日：1987-11-10

    申请号：US845506

    申请日：1986-03-28

    申请人： Yoichi Kawai ,  Masaru Abe ,  Akio Yoshihara ,  Shigeru Hayashi ,  Katsumi Sekiguchi

    发明人： Yoichi Kawai ,  Masaru Abe ,  Akio Yoshihara ,  Shigeru Hayashi ,  Katsumi Sekiguchi

    IPC分类号： C08L23/00 ,  C08K3/00 ,  C08K5/14 ,  C08L7/00 ,  C08L21/00 ,  C08L23/16 ,  C08L51/00 ,  C08L51/02 ,  C08L51/06 ,  C08L53/00 ,  C08L77/00 ,  C08L101/00 ,  C08K9/04 ,  C08K3/34 ,  C08K3/26 ,  C08K3/06

    CPC分类号： C08K3/0033 ,  C08L53/00

    摘要： Disclosed herein is a polypropylene-base resin composition obtained by heating at a temperature of 170.degree. C.-280.degree. C. a mixture containing a crystalline ethylene-propylene block copolymer having a specific composition, an ethylene-propylene copolymer rubber having a specific composition and viscosity, an inorganic filler having a specific particle size, and an organic peroxide, all in specified amounts. The thus-obtained polypropylene-base resin composition has high molding fluidity and are inexpensive and their moldings have excellent low-temperature impact resistance and paintability along with high stiffness. They are thus suitable for use in the production of large moldings such as automobile bumpers, fenders and body sidemembers.

    摘要翻译： 本文公开了一种聚丙烯基树脂组合物，其通过在170℃-280℃的温度下加热含有具有特定组成的结晶乙烯 - 丙烯嵌段共聚物的混合物，具有特定组成的乙烯 - 丙烯共聚物橡胶 粘度，特定粒径的无机填料和有机过氧化物，均为规定量。 由此获得的聚丙烯基树脂组合物具有高的成型流动性，并且价格便宜，并且它们的模制品具有优异的耐低温冲击性和着色性以及高刚度。 因此，它们适合用于生产诸如汽车保险杠，挡泥板和车身部件的大型模制件。